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    • 4. 发明授权
    • Testing method using a scalable parametric measurement macro
    • 使用可扩展参数测量宏的测试方法
    • US07656182B2
    • 2010-02-02
    • US11689150
    • 2007-03-21
    • Jeanne P. BickfordJohn R. GossNazmul HabibRobert J. McMahon
    • Jeanne P. BickfordJohn R. GossNazmul HabibRobert J. McMahon
    • G01R31/26
    • G01R31/2894G01R31/2831G01R31/30
    • Disclosed are testing method embodiments in which, during post-manufacture testing, parametric measurements are taken from on-chip parametric measurement elements and used to optimize manufacturing in-line parametric control learning and/or to optimize product screening processes. Specifically, these post-manufacture parametric measurements can be used to disposition chips without shipping out non-conforming products, without discarding conforming products, and without requiring high cost functional tests. They can also be used to identify yield sensitivities to parametric variations from design and to provide feedback for manufacturing line improvements based on the yield sensitivities. Additionally, a historical database regarding the key parameters that are monitored at both the fabrication and post-fabrication levels can be used to predict future yield and, thereby, to preemptively improve the manufacturing line and/or also to update supply chain forecasts.
    • 公开了测试方法实施例,其中在后制造测试中,参数测量取自片上参数测量元件,并用于优化制造在线参数控制学习和/或优化产品筛选过程。 具体来说,这些后期制造参数测量可用于配置芯片,而不会丢弃不合格的产品,而不会丢弃符合要求的产品,并且不需要高成本的功能测试。 它们也可以用于识别来自设计的参数变化的产量敏感性,并且基于产量灵敏度为制造线改进提供反馈。 此外,关于在制造和制造后水平上监测的关键参数的历史数据库可用于预测未来产量,从而预先改进生产线和/或更新供应链预测。
    • 8. 发明授权
    • System for acquiring device parameters
    • 用于获取设备参数的系统
    • US07382149B2
    • 2008-06-03
    • US11459367
    • 2006-07-24
    • Darren L. AnandNazmul HabibRobert J. McMahonTroy J. Perry
    • Darren L. AnandNazmul HabibRobert J. McMahonTroy J. Perry
    • G01R31/26
    • G01R31/318511G01R31/31723G01R31/31724
    • A system for performing device-specific testing and acquiring parametric data on custom integrated circuits, for example ASICs, such that each chip is tested individually without excessive test time requirements, additional silicon, or special test equipment. The testing system includes a device test structure integrated into unused backfill space in an ASIC design which tests a set of dummy devices that are identical to some of those of the ASIC. The device test structure includes control logic for designating the type of test and which device types to activate (e.g. pFETs or nFETs), a protection circuit for protecting the SPM when the test is inactive, an isolation circuit for isolating the devices under test (DUT) from any leakage current during test, and a decode circuit for providing test input (e.g. voltages) to the DUT. By controlling which devices to test and the voltage conditions of those devices, the system calculates the relative product yield and health of the line on a die by die basis.
    • 用于执行特定于设备的测试和获取定制集成电路(例如ASIC)的参数数据的系统,使得每个芯片被单独测试而没有过多的测试时间要求,附加的硅或特殊的测试设备。 测试系统包括在ASIC设计中集成到未使用的回填空间中的器件测试结构,其测试与ASIC中的一些相同的一组虚设器件。 器件测试结构包括用于指定测试类型和要激活的器件类型(例如pFET或nFET)的控制逻辑,用于在测试无效时保护SPM的保护电路,用于隔离被测器件(DUT)的隔离电路 )和测试期间的任何漏电流的解码电路,以及用于向DUT提供测试输入(例如电压)的解码电路。 通过控制要测试的设备和这些设备的电压条件,系统通过模具计算芯片上的线路的相对产品产量和健康状况。
    • 9. 发明申请
    • SPEED BINNING FOR DYNAMIC AND ADAPTIVE POWER CONTROL
    • 用于动态和自适应功率控制的速度波动
    • US20130113514A1
    • 2013-05-09
    • US13288269
    • 2011-11-03
    • Theodoros E. AnemikosJeanne P. BickfordNazmul HabibSusan K. Lichtensteiger
    • Theodoros E. AnemikosJeanne P. BickfordNazmul HabibSusan K. Lichtensteiger
    • H03K19/00G06F17/50
    • H03K19/0013
    • A plurality of digital circuits are manufactured from an identical circuit design. A power controller is operatively connect to the digital circuits, and a non-volatile storage medium is operatively connected to the power controller. The digital circuits are classified into different voltage bins, and each of the voltage bins has a current leakage limit. Each of the digital circuits has been previously tested to operate within a corresponding current leakage limit of a corresponding voltage bin into which each of the digital circuits has been classified. The non-volatile storage medium stores boundaries of the voltage bins as speed-binning test data. The power controller controls power-supply signals applied differently for each of the digital circuits based on which bin each of the digital circuit has been classified and the speed-binning test data.
    • 由相同的电路设计制造多个数字电路。 功率控制器可操作地连接到数字电路,并且非易失性存储介质可操作地连接到功率控制器。 数字电路分为不同的电压箱,每个电压箱都有漏电极限。 已经对每个数字电路进行了测试,以在对应的电压仓的相应的电流泄漏极限内运行,每个数字电路已被分类到该对应的电压仓。 非易失性存储介质存储电压仓的边界作为速度分级测试数据。 功率控制器控制基于每个数字电路已被分类的每个数字电路不同地施加的电源信号和速度合并测试数据。
    • 10. 发明授权
    • Speed binning for dynamic and adaptive power control
    • 用于动态和自适应功率控制的速度分组
    • US08421495B1
    • 2013-04-16
    • US13288269
    • 2011-11-03
    • Theodoros E. AnemikosJeanne P. BickfordNazmul HabibSusan K. Lichtensteiger
    • Theodoros E. AnemikosJeanne P. BickfordNazmul HabibSusan K. Lichtensteiger
    • H03K19/003
    • H03K19/0013
    • A plurality of digital circuits are manufactured from an identical circuit design. A power controller is operatively connect to the digital circuits, and a non-volatile storage medium is operatively connected to the power controller. The digital circuits are classified into different voltage bins, and each of the voltage bins has a current leakage limit. Each of the digital circuits has been previously tested to operate within a corresponding current leakage limit of a corresponding voltage bin into which each of the digital circuits has been classified. The non-volatile storage medium stores boundaries of the voltage bins as speed-binning test data. The power controller controls power-supply signals applied differently for each of the digital circuits based on which bin each of the digital circuit has been classified and the speed-binning test data.
    • 由相同的电路设计制造多个数字电路。 功率控制器可操作地连接到数字电路,并且非易失性存储介质可操作地连接到功率控制器。 数字电路分为不同的电压箱,每个电压箱都有漏电极限。 已经对每个数字电路进行了测试,以在对应的电压仓的相应的电流泄漏极限内运行,每个数字电路已被分类到该对应的电压仓。 非易失性存储介质存储电压仓的边界作为速度分级测试数据。 功率控制器控制基于每个数字电路已被分类的每个数字电路不同地施加的电源信号和速度合并测试数据。