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    • 4. 发明申请
    • ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
    • 电子元件及其制造方法
    • US20080314627A1
    • 2008-12-25
    • US12206164
    • 2008-09-08
    • Hiroyuki FujinoYoshihiro KoshidoNaoko AizawaHajime YamadaKenichi Uesaka
    • Hiroyuki FujinoYoshihiro KoshidoNaoko AizawaHajime YamadaKenichi Uesaka
    • H05K1/09H05K3/00
    • H03H9/1092Y10T29/49124
    • There are provided an electronic component in which two substrates are bonded to each other with a large bonding force and a method for manufacturing electronic components in which two substrates can be bonded to each other with a large bonding force and in which the substrates are not likely to be bent and broken. In an embodiment, a plurality of first connection portions 30 is formed on a first substrate 22, and in addition, a plurality of IDT electrodes 26 and a plurality of second connection portions 32 are formed on a second substrate 24. The first connection portions 30 are engaged in concave parts of the second connection portions 32, so that temporary bonding is performed. Between adjacent first connection portions 30, only the first substrate is cut. By heat application, laser irradiation, pressure application, ultrasonic application, or the like, the first connection portions 30 and the second connection portions 32 are finally bonded to each other. The second substrate 24 is cut along the cut portions of the first substrate 22, so that a plurality of electronic components 20 is formed.
    • 提供了一种电子部件,其中两个基板以大的接合力彼此接合,并且制造电子部件的方法,其中两个基板可以以大的接合力彼此接合,并且其中基板不可能 被弯曲破碎。 在一个实施例中,多个第一连接部30形成在第一基板22上,另外,多个IDT电极26和多个第二连接部32形成在第二基板24上。第一连接部30 与第二连接部32的凹部接合,从而进行临时接合。 在相邻的第一连接部30之间,仅切割第一基板。 通过热施加,激光照射,压力施加,超声波应用等,第一连接部30和第二连接部32最终彼此结合。 第二基板24沿着第一基板22的切割部分被切割,从而形成多个电子部件20。
    • 7. 发明申请
    • IN-LIQUID-SUBSTANCE DETECTION SENSOR
    • 液体物质检测传感器
    • US20090320574A1
    • 2009-12-31
    • US12555894
    • 2009-09-09
    • Hajime YAMADANaoko AIZAWAYoshihiro KOSHIDOKoji FUJIMOTOToru YABEMichio KADOTA
    • Hajime YAMADANaoko AIZAWAYoshihiro KOSHIDOKoji FUJIMOTOToru YABEMichio KADOTA
    • G01N29/02
    • G01N29/022G01N29/222G01N2291/022G01N2291/0423
    • An in-liquid-substance detection sensor that achieves size reduction and detection accuracy improvement includes a piezoelectric substrate, at least two SAW devices provided on one major surface of the piezoelectric substrate and each having at least one IDT electrode defining a sensing portion, outer electrodes provided on the other major surface of the piezoelectric substrate and electrically connected to the SAW devices through vias extending through the piezoelectric substrate, a channel-defining member provided on the one major surface of the piezoelectric substrate so as to surround the SAW devices and a region connecting the SAW devices to each other, thereby defining sidewalls of a channel, and a protective member bonded to the one major surface of the piezoelectric substrate with the channel-defining member interposed therebetween, thereby sealing the channel, the protective member having at least two through holes communicating with the channel.
    • 实现尺寸减小和检测精度提高的液体内物质检测传感器包括压电基板,设置在压电基板的一个主表面上的至少两个SAW器件,每个具有限定感测部分的至少一个IDT电极,外部电极 设置在压电基板的另一个主表面上,并且通过延伸穿过压电基板的通孔电连接到SAW器件,设置在压电基板的一个主表面上以便包围SAW器件的通道限定元件和区域 将所述SAW器件彼此连接,由此限定通道的侧壁,以及保护构件,其与所述压电基板的所述一个主表面接合,并且所述通道限定构件插入其间,从而密封所述通道,所述保护构件具有至少两个 通道与通道相通。