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    • 9. 发明授权
    • Method of fabricating thin film transistor
    • 制造薄膜晶体管的方法
    • US07071040B2
    • 2006-07-04
    • US10639478
    • 2003-08-13
    • Naoki MatsunagaKenji Sera
    • Naoki MatsunagaKenji Sera
    • H01L21/00H01L21/84
    • H01L29/66757H01L29/458H01L29/66765H01L29/78675H01L29/78678
    • A method of fabricating a thin film transistor including an electrically insulating substrate, a semiconductor layer formed on the substrate, and source and drain electrodes formed above source and drain regions formed in the semiconductor layer, the source and drain electrodes being composed of aluminum or aluminum alloy, the method including the steps of forming a gate electrode, implanting impurity ions into the semiconductor layer for forming the source and drain regions, forming an interlayer insulating film entirely over the substrate, forming contact holes throughout the interlayer insulating film such that the source and drain regions are exposed through the contact holes, forming an electrically conductive film composed of aluminum or aluminum alloy, in the contact holes for forming the source and drain electrodes, and thermally annealing the substrate at 275 to 350 degrees centigrade for 1.5 to 3 hours in inert atmosphere.
    • 一种制造薄膜晶体管的方法,所述薄膜晶体管包括电绝缘基板,形成在所述基板上的半导体层以及形成在所述半导体层中形成的源极和漏极区之上的源极和漏极,所述源极和漏极由铝或铝 合金,该方法包括以下步骤:形成栅电极,将杂质离子注入用于形成源极和漏极区的半导体层中,在衬底上整个形成层间绝缘膜,在整个层间绝缘膜上形成接触孔,使得源 漏极区域通过接触孔露出,形成由铝或铝合金构成的导电膜,用于形成源电极和漏电极的接触孔中,并在275-350℃下热处理基片1.5至3小时 在惰性气氛中。