专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20060163330A1 SITE FLATTENING TOOL AND METHOD FOR CIRCUIT BOARD REPAIR 审中-公开
标题翻译：用于电路板维修的现场平铺工具和方法
公开(公告)号：US20060163330A1
公开(公告)日：2006-07-27
申请号：US10905919
申请日：2005-01-26
申请人： Brian Chapman , James Petrone , Nandakumar Ranadive
发明人： Brian Chapman , James Petrone , Nandakumar Ranadive
IPC分类号： B23K31/02
CPC分类号： H05K3/225 , H05K2203/0195 , H05K2203/0278 , H05K2203/1105
摘要： Disclosed are a tool and a procedure for flattening a site on a printed circuit board. The tool comprises three sections: a nozzle, a throat and a flattening block. The nozzle connects the tool to a hot air source and receives hot air from said source, and the throat is connected to the nozzle section for receiving the hot air from the nozzle section. The flattening block has a generally planar bottom surface for engaging a site on a printed circuit board. The flattening block forms a vent for venting the hot air from the flattening block to the ambient to help maintain said site at an approximately constant temperature when said bottom surface engages said site. A resilient mechanism is mounted on the throat section, for forcing said bottom surface against said site, with a constant, known force.
摘要翻译：公开了用于使印刷电路板上的部位平坦化的工具和程序。该工具包括三个部分：喷嘴，喉部和扁平块。喷嘴将工具连接到热空气源并且从所述源接收热空气，并且喉部连接到喷嘴部分以从喷嘴部分接收热空气。平整块具有用于接合印刷电路板上的位置的大致平坦的底表面。平坦块形成用于将热空气从平坦块排放到周围的通风口，以在所述底表面接合所述位置时帮助将所述位置维持在近似恒定的温度。弹性机构安装在喉部，用于以恒定的已知力将所述底面强制抵靠所述部位。

2. 发明申请

US20060202001A1 ENHANCED HEAT SYSTEM FOR BGA/CGA REWORK 审中-公开
标题翻译： BGA / CGA REWORK加强系统
公开(公告)号：US20060202001A1
公开(公告)日：2006-09-14
申请号：US10906824
申请日：2005-03-08
申请人： Raymond Birchall , Brian Chapman , Wai Ma , James Petrone , Nandakumar Ranadive
发明人： Raymond Birchall , Brian Chapman , Wai Ma , James Petrone , Nandakumar Ranadive
IPC分类号： H02H7/00 , B23K1/018 , H05K7/06
CPC分类号： H05K3/3494 , B23K1/012 , B23K2101/36 , H01L2224/98 , H05K1/112 , H05K2203/081 , H05K2203/1581 , H05K2203/176
摘要： A method and system for heating a circuit board component to an approximately uniform temperature sufficient to reflow the connections between the circuit board component and the circuit board. The method and system include a supplemental gas heater having a diffuser plate. The circuit board is placed against the diffuser plate and heated gas is channeled through openings in the diffuser plate into vias in the circuit board to heat a circuit board component connected on the opposite side of the circuit board. Heated gas can be channeled through selected vias towards predetermined areas and/or specified connections such as towards those areas or connections where there is a temperature differential greater than approximately 10 degrees Celsius compared to other areas or connections across the circuit board component. Hot gas can be channeled through selected vias by baffling or patterning the diffuser plate, accordingly.
摘要翻译：一种用于将电路板部件加热到大致均匀的温度以足以回流电路板部件和电路板之间的连接的方法和系统。该方法和系统包括具有扩散板的补充气体加热器。将电路板放置在扩散板上，将加热的气体通过扩散板中的开口引导到电路板中的通孔中，以加热连接在电路板相对侧的电路板部件。与电路板部件上的其他区域或连接相比，加热气体可以通过选定的通孔被引导到预定区域和/或指定的连接，例如朝向与大于约10摄氏度的温度差的那些区域或连接。因此，热气体可以通过选择的通孔引导通过挡板或图案化扩散板。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式