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    • 10. 发明申请
    • METHOD FOR MANUFACTURING AN FPCB USING A BONDING SHEET
    • 使用粘结片材制造FPCB的方法
    • WO2010128833A3
    • 2011-02-17
    • PCT/KR2010002948
    • 2010-05-10
    • INTERFLEX CO LTDYANG HO-MINNAM DAE-WOO
    • YANG HO-MINNAM DAE-WOO
    • H05K3/28
    • H05K3/281H05K1/0393
    • According to the present invention, a method for manufacturing an FPCB using a bonding sheet including a substrate portion having a substrate mounted thereon, and a bending portion to be bent, comprises the steps of: forming a circuit pattern on a copper foil surface of a copper clad laminate; removing a first release film of the bonding sheet having said first release film and a second release film attached to an adhesive layer on either surface thereof; stacking the bonding sheet on the circuit pattern formed on the substrate portion and the bending portion, such that the adhesive layer is opposite the bonding sheet; and removing the second release film of the stacked bonding sheet. According to the present invention, a bonding sheet is used on a bending portion of an FPCB, as opposed to the solder mask ink of the prior art, such that low repulsive forces can be provided and costs can be reduced through a simple process as compared to said solder mask ink printing process.
    • 根据本发明,使用包括具有安装在其上的基板的基板部分和弯曲部分的粘合片来制造FPCB的方法包括以下步骤:在铜箔表面上形成电路图案 覆铜层压板; 去除其表面上附着有粘合剂层的具有所述第一脱模膜和第二剥离膜的粘合片的第一剥离膜; 将粘合片堆叠在形成在基片部分和弯曲部分上的电路图案上,使粘合剂层与接合片相对; 并且去除叠置的粘结片的第二剥离膜。 根据本发明,与现有技术的阻焊油墨相比,在FPCB的弯曲部分上使用接合片,使得可以提供低排斥力并且通过简单的工艺可以降低成本, 到所述焊接油墨印刷过程。