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1. 发明授权

US08883950B2 Silicone resin composition, encapsulating material, and light emitting diode device 有权
标题翻译：硅树脂组合物，封装材料和发光二极管装置
公开(公告)号：US08883950B2
公开(公告)日：2014-11-11
申请号：US13564932
申请日：2012-08-02
申请人： Ryuichi Kimura , Munehisa Mitani
发明人： Ryuichi Kimura , Munehisa Mitani
IPC分类号： C08G77/20 , C08L83/04 , H01L23/29 , C08K5/5425 , C08G77/12 , C08G77/16 , C08K5/5435
CPC分类号： C08L83/04 , C08G77/12 , C08G77/16 , C08G77/20 , C08K5/5425 , C08K5/5435 , H01L23/296 , H01L2924/0002 , H01L2924/19105 , Y10T428/31663 , C08L83/00 , H01L2924/00
摘要： A silicone resin composition contains a silicon-containing component including a silicon atom to which a monovalent hydrocarbon group selected from a saturated hydrocarbon group and an aromatic hydrocarbon group is bonded and a silicon atom to which an alkenyl group is bonded. The number of moles of alkenyl group per 1 g of the silicon-containing component is 200 to 2000 μmol/g.
摘要翻译：有机硅树脂组合物含有含有选自饱和烃基和芳香族烃基中的一价烃基的硅原子和链烯基相连的硅原子的含硅成分。每1g含硅成分的烯基的摩尔数为200〜2000μmol/ g。

2. 发明授权

US08551277B2 Method for producing light emitting diode device 有权
标题翻译：发光二极管装置的制造方法
公开(公告)号：US08551277B2
公开(公告)日：2013-10-08
申请号：US13597341
申请日：2012-08-29
申请人： Yasunari Ooyabu , Hiroyuki Katayama , Daisuke Tsukahara , Munehisa Mitani
发明人： Yasunari Ooyabu , Hiroyuki Katayama , Daisuke Tsukahara , Munehisa Mitani
IPC分类号： H01L33/00
CPC分类号： H01L33/52 , H01L2933/005
摘要： A method for producing a light emitting diode device includes the steps of preparing a laminate including, in order, a supporting layer, a constraining layer and an encapsulating resin layer, each formed in a thickness direction; cutting the encapsulating resin layer and the constraining layer in the laminate into a pattern corresponding to the light emitting diode element; removing a portion which does not correspond to the light emitting diode element in the encapsulating resin layer and the constraining layer that are cut into the pattern; allowing the encapsulating resin layer corresponding to the light emitting diode element to be opposed to the light emitting diode element to be pressed in the direction where they come close to each other so as to encapsulate the light emitting diode element by the encapsulating resin layer; and removing the supporting layer and the constraining layer from the laminate.
摘要翻译：一种发光二极管器件的制造方法，其特征在于，具有如下工序：在厚度方向上形成有依次层叠的支撑层，约束层和密封树脂层。将层压体中的封装树脂层和约束层切割成对应于发光二极管元件的图案; 去除与切割成图案的封装树脂层和约束层中的发光二极管元件不对应的部分; 使与发光二极管元件相对应的封装树脂层与发光二极管元件相对，以使它们彼此靠近的方向被按压，以便通过封装树脂层封装发光二极管元件; 并从层叠体上除去支撑层和约束层。

3. 发明申请

US20130032852A1 SILICONE RESIN COMPOSITION, ENCAPSULATING MATERIAL, AND LIGHT EMITTING DIODE DEVICE 有权
标题翻译：硅树脂组合物，封装材料和发光二极管器件
公开(公告)号：US20130032852A1
公开(公告)日：2013-02-07
申请号：US13564932
申请日：2012-08-02
申请人： Ryuichi KIMURA , Munehisa MITANI
发明人： Ryuichi KIMURA , Munehisa MITANI
IPC分类号： C08L83/05 , H01L33/56 , C08G77/12
CPC分类号： C08L83/04 , C08G77/12 , C08G77/16 , C08G77/20 , C08K5/5425 , C08K5/5435 , H01L23/296 , H01L2924/0002 , H01L2924/19105 , Y10T428/31663 , C08L83/00 , H01L2924/00
摘要： A silicone resin composition contains a silicon-containing component including a silicon atom to which a monovalent hydrocarbon group selected from a saturated hydrocarbon group and an aromatic hydrocarbon group is bonded and a silicon atom to which an alkenyl group is bonded. The number of moles of alkenyl group per 1 g of the silicon-containing component is 200 to 2000 μmol/g.
摘要翻译：有机硅树脂组合物含有含有选自饱和烃基和芳香族烃基中的一价烃基的硅原子和链烯基相连的硅原子的含硅成分。每1g含硅成分的烯基的摩尔数为200〜2000μmol/ g。

4. 发明申请

US20130069106A1 SILICONE RESIN SHEET, PRODUCING METHOD THEREOF, ENCAPSULATING SHEET, AND LIGHT EMITTING DIODE DEVICE 失效
标题翻译：硅树脂板，其制造方法，封装板和发光二极管装置
公开(公告)号：US20130069106A1
公开(公告)日：2013-03-21
申请号：US13605632
申请日：2012-09-06
申请人： Munehisa MITANI , Hiroyuki KATAYAMA
发明人： Munehisa MITANI , Hiroyuki KATAYAMA
IPC分类号： B05D1/36 , H01L33/56 , B05D3/02 , B32B9/04 , B05D7/24
CPC分类号： C08L83/04 , C08G77/12 , C08G77/20 , C09D183/04 , H01L23/296 , H01L33/56 , H01L2924/0002 , Y10T428/31663 , C08K3/36 , C08K5/56 , C08L83/00 , H01L2924/00
摘要： A method for producing a silicone resin sheet includes the steps of forming a first coating layer by applying a first silicone resin composition which contains a first organopolysiloxane and a second organopolysiloxane; forming a precursor layer from the first coating layer by reacting the first organopolysiloxane with the second organopolysiloxane so as to have a conversion ratio of 5 to 40%; and forming a second layer on at least one surface in a thickness direction of the precursor layer by applying a second silicone resin composition which contains a third organopolysiloxane, a fourth organopolysiloxane, a hydrosilylation catalyst, and a curing retardant containing tetraalkylammonium hydroxide.
摘要翻译：一种硅树脂片的制造方法，其特征在于，通过涂布含有第一有机聚硅氧烷和第二有机聚硅氧烷的第一有机硅树脂组合物形成第一被覆层的工序; 通过使所述第一有机聚硅氧烷与所述第二有机聚硅氧烷反应从而使所述第一涂层形成前体层，以使其转化率为5〜40％。通过施加含有第三有机聚硅氧烷，第四有机聚硅氧烷，氢化硅烷化催化剂和含有四烷基氢氧化铵的固化阻聚剂的第二有机硅树脂组合物，在前体层的厚度方向的至少一个表面上形成第二层。

5. 发明申请

US20120306107A1 SILICONE RESIN COMPOSITION, SILICONE RESIN SHEET, OPTICAL SEMICONDUCTOR ELEMENT DEVICE, AND PRODUCING METHOD OF SILICONE RESIN SHEET 有权
标题翻译：硅树脂组合物，硅树脂片，光学半导体元件装置和硅树脂片的制造方法
公开(公告)号：US20120306107A1
公开(公告)日：2012-12-06
申请号：US13469452
申请日：2012-05-11
申请人： Munehisa MITANI , Hiroyuki KATAYAMA , Haruka FUJII
发明人： Munehisa MITANI , Hiroyuki KATAYAMA , Haruka FUJII
IPC分类号： H01L23/29 , B05D7/24 , B05D3/02 , C09D183/07
CPC分类号： H01L23/296 , C08G77/12 , C08G77/20 , C08J5/18 , C08J2383/05 , C08J2383/07 , C08K5/19 , C08K5/57 , C08L83/00 , C08L83/04 , H01L2924/0002 , Y10T428/31663 , H01L2924/00
摘要： A silicone resin composition contains a first organopolysiloxane having, in one molecule, both at least two ethylenically unsaturated hydrocarbon groups and at least two hydrosilyl groups; a second organopolysiloxane having, in one molecule, at least two hydrosilyl groups without containing an ethylenically unsaturated hydrocarbon group; a hydrosilylation catalyst; and a hydrosilylation inhibitor.
摘要翻译：硅氧烷树脂组合物含有在一个分子中具有至少两个烯属不饱和烃基和至少两个氢化甲硅烷基的第一有机聚硅氧烷; 在一分子中具有不含有烯属不饱和烃基的至少两个氢甲硅烷基的第二有机聚硅氧烷; 氢化硅烷化催化剂; 和氢化硅烷化抑制剂。

6. 发明授权

US08575290B2 Silicone resin composition, silicone resin sheet, optical semiconductor element device, and producing method of silicone resin sheet 有权
标题翻译：硅树脂组合物，硅树脂片，光半导体元件装置以及有机硅树脂片的制造方法
公开(公告)号：US08575290B2
公开(公告)日：2013-11-05
申请号：US13469452
申请日：2012-05-11
申请人： Munehisa Mitani , Hiroyuki Katayama , Haruka Fujii
发明人： Munehisa Mitani , Hiroyuki Katayama , Haruka Fujii
IPC分类号： C08G77/08
CPC分类号： H01L23/296 , C08G77/12 , C08G77/20 , C08J5/18 , C08J2383/05 , C08J2383/07 , C08K5/19 , C08K5/57 , C08L83/00 , C08L83/04 , H01L2924/0002 , Y10T428/31663 , H01L2924/00
摘要： A silicone resin composition contains a first organopolysiloxane having, in one molecule, both at least two ethylenically unsaturated hydrocarbon groups and at least two hydrosilyl groups; a second organopolysiloxane having, in one molecule, at least two hydrosilyl groups without containing an ethylenically unsaturated hydrocarbon group; a hydrosilylation catalyst; and a hydrosilylation inhibitor.
摘要翻译：硅氧烷树脂组合物含有在一个分子中具有至少两个烯属不饱和烃基和至少两个氢化甲硅烷基的第一有机聚硅氧烷; 在一分子中具有不含有烯属不饱和烃基的至少两个氢甲硅烷基的第二有机聚硅氧烷; 氢化硅烷化催化剂; 和氢化硅烷化抑制剂。

7. 发明授权

US08569792B2 Silicone resin sheet, producing method thereof, encapsulating sheet, and light emitting diode device 失效
标题翻译：硅树脂片，其制造方法，封装片和发光二极管装置
公开(公告)号：US08569792B2
公开(公告)日：2013-10-29
申请号：US13605632
申请日：2012-09-06
申请人： Munehisa Mitani , Hiroyuki Katayama
发明人： Munehisa Mitani , Hiroyuki Katayama
IPC分类号： H01L33/00 , B05D7/00
CPC分类号： C08L83/04 , C08G77/12 , C08G77/20 , C09D183/04 , H01L23/296 , H01L33/56 , H01L2924/0002 , Y10T428/31663 , C08K3/36 , C08K5/56 , C08L83/00 , H01L2924/00
摘要： A method for producing a silicone resin sheet includes the steps of forming a first coating layer by applying a first silicone resin composition which contains a first organopolysiloxane and a second organopolysiloxane; forming a precursor layer from the first coating layer by reacting the first organopolysiloxane with the second organopolysiloxane so as to have a conversion ratio of 5 to 40%; and forming a second layer on at least one surface in a thickness direction of the precursor layer by applying a second silicone resin composition which contains a third organopolysiloxane, a fourth organopolysiloxane, a hydrosilylation catalyst, and a curing retardant containing tetraalkylammonium hydroxide.
摘要翻译：一种硅树脂片的制造方法，其特征在于，通过涂布含有第一有机聚硅氧烷和第二有机聚硅氧烷的第一有机硅树脂组合物形成第一被覆层的工序; 通过使所述第一有机聚硅氧烷与所述第二有机聚硅氧烷反应从而使所述第一涂层形成前体层，以使其转化率为5〜40％。通过施加含有第三有机聚硅氧烷，第四有机聚硅氧烷，氢化硅烷化催化剂和含有四烷基氢氧化铵的固化阻聚剂的第二有机硅树脂组合物，在前体层的厚度方向的至少一个表面上形成第二层。

8. 发明申请

US20130048209A1 METHOD FOR PRODUCING LIGHT EMITTING DIODE DEVICE 有权
标题翻译：用于生产发光二极管器件的方法
公开(公告)号：US20130048209A1
公开(公告)日：2013-02-28
申请号：US13597341
申请日：2012-08-29
申请人： Yasunari OOYABU , Hiroyuki Katayama , Daisuke Tsukahara , Munehisa Mitani
发明人： Yasunari OOYABU , Hiroyuki Katayama , Daisuke Tsukahara , Munehisa Mitani
IPC分类号： H01L33/00
CPC分类号： H01L33/52 , H01L2933/005
摘要： A method for producing a light emitting diode device includes the steps of preparing a laminate including, in order, a supporting layer, a constraining layer and an encapsulating resin layer, each formed in a thickness direction; cutting the encapsulating resin layer and the constraining layer in the laminate into a pattern corresponding to the light emitting diode element; removing a portion which does not correspond to the light emitting diode element in the encapsulating resin layer and the constraining layer that are cut into the pattern; allowing the encapsulating resin layer corresponding to the light emitting diode element to be opposed to the light emitting diode element to be pressed in the direction where they come close to each other so as to encapsulate the light emitting diode element by the encapsulating resin layer; and removing the supporting layer and the constraining layer from the laminate.
摘要翻译：一种发光二极管器件的制造方法，其特征在于，具有如下工序：在厚度方向上形成有依次层叠的支撑层，约束层和密封树脂层。将层压体中的封装树脂层和约束层切割成对应于发光二极管元件的图案; 去除与切割成图案的封装树脂层和约束层中的发光二极管元件不对应的部分; 使与发光二极管元件相对应的封装树脂层与发光二极管元件相对，以使它们彼此靠近的方向被按压，以便通过封装树脂层封装发光二极管元件; 并从层叠体上除去支撑层和约束层。

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