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    • 4. 发明授权
    • Advanced equipment control system
    • 先进的设备控制系统
    • US5546301A
    • 1996-08-13
    • US277385
    • 1994-07-19
    • Mukul AgrawalJames E. OrrockPradip K. PatiathLloyd A. Rachor
    • Mukul AgrawalJames E. OrrockPradip K. PatiathLloyd A. Rachor
    • G06F9/46G06F19/00
    • G06F9/46
    • The present invention relates to a control solution development environment coupled to a runtime environment constructed to insulate the control solution designer as well as the developed control applications from both the hardware and the operating system. This insulation frees the designer from having to deal with a tangle of control and operating system commands and considerations. The runtime environment manages the details of the process system resource and task allocation to implement the control strategies. Since the runtime environment insulates the developed control applications from changes in operating systems and hardware, applications developed to run in this environment are both reusable and portable. The runtime environment is scaleable, fault-tolerant, allows dynamic reconfiguration of the system, integration of diverse sensors and actuators and enables distributed control strategies. The runtime environment is built on C++ software language, is hostable on a variety of industry-standard computer operating systems, and readily accommodates legacy and third-party software tools.
    • 本发明涉及一种与运行时环境相结合的控制解决方案开发环境,该运行时环境构造为使得控制解决方案设计者以及来自硬件和操作系统的开发的控制应用程序都是绝缘的。 这种绝缘使设计人员不必处理控制和操作系统命令和注意事项的纠缠。 运行环境管理流程系统资源和任务分配的细节,实现控制策略。 由于运行时环境将开发的控制应用程序与操作系统和硬件的变化隔离开发,因此在此环境中运行的应用程序都是可重复使用和可移植的。 运行时环境是可扩展的,容错的,允许系统的动态重新配置,各种传感器和执行器的集成,并实现分布式控制策略。 运行时环境是基于C ++软件语言,可以在各种行业标准的计算机操作系统上使用,并且容易地适应传统和第三方软件工具。
    • 5. 发明申请
    • SPUTTER TOOL
    • 飞溅工具
    • US20160177439A1
    • 2016-06-23
    • US14578332
    • 2014-12-19
    • Yu-Chen ShenTaiqing QiuRobe WoehlKieran Mark TracyMukul Agrawal
    • Yu-Chen ShenTaiqing QiuRobe WoehlKieran Mark TracyMukul Agrawal
    • C23C14/50C23C14/34
    • C23C14/50C23C14/165C23C14/34C23C14/3464H01J37/32715
    • Sputter tools are described. In one embodiment, an apparatus to support a wafer includes a pallet having a depression to receive the wafer. The pallet includes an opening below the depression, and an edge in the depression is to support the wafer over the opening. A cover at least partially covers the opening. In one example, the cover may be a plate with one or more holes, and a pipe may be located below each of the holes in the cover. In one embodiment, a wafer-processing system includes a processing chamber and a pallet with a depression to receive a wafer. The pallet has an opening below the depression, and an edge in the depression supports the wafer over the opening. In one such embodiment, a cover at least partially covers the opening. According to one embodiment, an energy-absorbing material is disposed below the opening in the pallet.
    • 描述了溅射工具。 在一个实施例中,用于支撑晶片的装置包括具有用于接收晶片的凹陷的托盘。 托盘包括在凹陷下方的开口,并且凹陷中的边缘将晶片支撑在开口上。 盖子至少部分地覆盖开口。 在一个示例中,盖可以是具有一个或多个孔的板,并且管可以位于盖中的每个孔下方。 在一个实施例中,晶片处理系统包括处理室和具有凹陷的托盘以接收晶片。 托盘在凹陷下方具有开口,并且凹陷中的边缘将晶片支撑在开口上方。 在一个这样的实施例中,盖至少部分地覆盖开口。 根据一个实施例,能量吸收材料设置在托盘中的开口下方。