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    • 6. 发明申请
    • Interconnect material and interconnect formation method
    • 互连材料和互连形成方法
    • US20090180914A1
    • 2009-07-16
    • US12292937
    • 2008-12-01
    • Motoi TobitaYusuke Yasuda
    • Motoi TobitaYusuke Yasuda
    • B22F7/00B32B15/02
    • B22F1/0062B22F7/04Y10T428/2991
    • A metal particle having an organic substance coated thereon, dispersibility that is the same as that of a known metal particle having an organic substance coated thereon, and an improved low temperature connectability. A method for forming interconnect between materials by using the interconnect materials that include a metal particle on which an organic substance is coated, which includes the steps of coating the interconnect materials on subject interconnect materials, and heating the materials at a temperature in the range of 50 to 400° C. for 1 sec to 10 min to form a sintered body made of metal between the subject interconnect materials. The organic substance is a secondary amine having a molecular weight of 250 or less, and the metal particle is made of a unit of silver, copper, or gold, which has a mean diameter of 100 nm or less, or a mixture thereof.
    • 具有涂布有机物的金属颗粒,其分散性与其上涂覆有有机物质的已知金属颗粒的分散性和改善的低温连接性相同。 一种用于通过使用包括其上涂覆有机物质的金属颗粒的互连材料形成材料之间的互连的方法,其包括以下步骤:在物体互连材料上涂布互连材料,并在 50〜400℃,保持1〜10分钟,形成由金属构成的烧结体。 有机物质是分子量为250以下的仲胺,金属颗粒由平均直径为100nm以下的银,铜或金的单位或其混合物构成。