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    • 2. 发明申请
    • LOW PROFILE THERMOSIPHON
    • 低剖面温度计
    • WO2008108777A1
    • 2008-09-12
    • PCT/US2007/009541
    • 2007-04-18
    • DELPHI TECHNOLOGIES, INC.REYZIN, IlyaBHATTI, Mohinder, SinghJOSHI, Shrikant, Mukund
    • REYZIN, IlyaBHATTI, Mohinder, SinghJOSHI, Shrikant, Mukund
    • H01L23/427
    • H01L23/427H01L2924/0002H01L2924/00
    • A thermosiphon cooling assembly for dissipating heat generated by an electronic device includes a housing having a housing top (24), housing bottom and opposing sides (28). The opposing sides extend between the housing top and the housing bottom to define a low profile entrance and a low profile exit (32). A refrigerant is disposed within one or more boiling chambers (34). Heat generated by the electronic device is transferred to the refrigerant by the boiling chambers for liquid-to-vapor transformation. Condenser tubes having a bottom end and a top end extend from the boiling chambers at a diagonally upward angle across the sides between the housing bottom and housing top (24). The condenser tubes receive and condense vapor boiled off from the refrigerant (42). Air moving devices axially move air through the housing. Air is flowed across the condenser tubes to facilitate condensation.
    • 用于耗散由电子设备产生的热量的热虹吸管冷却组件包括具有壳体顶部(24),壳体底部和相对侧面(28)的壳体。 相对侧在壳体顶部和壳体底部之间延伸以限定低轮廓入口和低轮廓出口(32)。 制冷剂设置在一个或多个沸腾室(34)内。 由电子装置产生的热量通过沸腾室转移到制冷剂以进行液体 - 蒸气转化。 具有底端和顶端的冷凝器管从沸腾室以对角线向上的角度延伸穿过壳体底部和壳体顶部(24)之间的侧面。 冷凝器管接收并冷凝从制冷剂(42)中煮沸的蒸气。 空气移动装置将空气轴向移动通过壳体。 空气流过冷凝器管,以便冷凝。
    • 4. 发明授权
    • Evaporative cooler
    • 蒸发冷却器
    • US07658084B2
    • 2010-02-09
    • US11732294
    • 2007-04-03
    • Mohinder Singh BhattiIlya Reyzin
    • Mohinder Singh BhattiIlya Reyzin
    • F25D23/12
    • F25D7/00
    • A refrigeration assembly includes a pair of refrigerated chambers defined within a working chamber. The refrigerated chambers include channel walls extending parallel to one another and spaced apart, and first and second panels extending channel walls to define a working channel for separating the working chamber into sub-chambers. Apertures defined in the panels allow airflow from the sub-chambers into the working channel, and a supply of water wets the panels and a first section of the refrigerated chambers. Air enters the sub-chambers and flows over the first sections of the refrigerated chambers for direct evaporative cooling. A portion of the air bleeds through the apertures and evaporates water from the panels prior to flowing over the second sections of the refrigerated chambers for indirect evaporative cooling.
    • 制冷组件包括限定在工作室内的一对冷藏室。 冷藏室包括彼此平行延伸并间隔开的通道壁,第一和第二面板延伸通道壁以限定用于将工作室分离成子室的工作通道。 限定在面板中的孔允许从子室进入气流进入工作通道,并且水的供应将润湿面板和冷藏室的第一部分。 空气进入分室并流过冷藏室的第一部分,用于直接蒸发冷却。 一部分空气通过孔流出并在流过冷藏室的第二部分之前从面板中蒸发水以进行间接蒸发冷却。
    • 5. 发明授权
    • Domed heat exchanger (porcupine)
    • 圆顶换热器(豪猪)
    • US07644753B2
    • 2010-01-12
    • US11439364
    • 2006-05-23
    • Debashis GhoshMohinder Singh Bhatti
    • Debashis GhoshMohinder Singh Bhatti
    • F28D15/00H05K7/20
    • F28D15/0233F28D15/0266H01L23/427H01L2924/0002H01L2924/00
    • Three embodiments of a heat exchanger assembly for cooling an electronic device are shown respectively in FIGS. 1-2, 3 and 4 and each comprises a flange, a dome, a plurality of condensing tubes, a shroud, and a boiler plate. In the first embodiment shown in FIG. 1, the dome is semi-spherical in shape and the distance measured axially along the center axis equals the distance measured laterally from or perpendicular to the center axis. In the second and third embodiments shown in FIGS. 3 and, 4, respectively, the distance measured axially along the center axis is greater than the distance measured laterally from or perpendicular to the center axis. The domes in the second and third embodiments are an ellipsoid and a semi-logarithmic body, respectively. In all embodiments, a plurality of condensing tubes aligned in fan rows and arced rows extend from the dome to distal ends to facilitate more-efficient heat transfer.
    • 在图1和图2中分别示出了用于冷却电子设备的热交换器组件的三个实施例。 如图1-2,3和4所示,每个包括凸缘,圆顶,多个冷凝管,护罩和锅炉板。 在图1所示的第一实施例中, 如图1所示,圆顶是半球形的,沿中心轴线轴向测量的距离等于从中心轴线侧向或垂直于中心轴线测量的距离。 在图1和图2所示的第二和第三实施例中, 如图3和图4所示,沿着中心轴线轴向测量的距离大于从中心轴线侧向或垂直于中心轴线测量的距离。 第二和第三实施例中的圆顶分别是椭球体和半对数体。 在所有实施例中,排列成扇形排和弧形行的多个冷凝管从圆顶延伸到远端以便于更有效的热传递。
    • 6. 发明授权
    • Impingement cooled heat sink with low pressure drop
    • 具有低压降的冲击冷却散热片
    • US07597135B2
    • 2009-10-06
    • US11439042
    • 2006-05-23
    • Debashis GhoshMohinder Singh Bhatti
    • Debashis GhoshMohinder Singh Bhatti
    • F28F7/00H05K7/20
    • H01L23/4336H01L2924/0002H01L2924/00
    • Two embodiments of a heat exchanger assembly for cooling an electronic device are shown respectively in FIGS. 1 and 3 and each comprises a housing, a plurality of high fins, a plurality of low fins, a nozzle plate, an inlet, at least one outlet, a primary nozzle, and a plurality of secondary nozzles. In the first embodiment shown in FIG. 1, the housing and the nozzle plate are circular in shape. In the second embodiment shown in FIG. 3, the housing and the nozzle plate are rectangular in shape. Both embodiments include a plurality of secondary nozzles that are aligned outwardly of the primary nozzle and the center axis of the nozzle plate. The secondary nozzles direct the flow of the cooling liquid outwardly of the primary nozzle from the center thus creating an overall system pressure drop lower than that of other assemblies without a plurality of secondary nozzles.
    • 在图1和图2中分别示出了用于冷却电子设备的热交换器组件的两个实施例。 每个包括壳体,多个高翅片,多个低翅片,喷嘴板,入口,至少一个出口,主喷嘴和多个次喷嘴。 在图1所示的第一实施例中, 如图1所示,壳体和喷嘴板的形状为圆形。 在图2所示的第二实施例中, 如图3所示,壳体和喷嘴板的形状为矩形。 两个实施例都包括多个次级喷嘴,其在主喷嘴的外侧和喷嘴板的中心轴线对齐。 次级喷嘴将冷却液从中心向外引导到主喷嘴外部,从而产生比其它组件的系统总压力低的系统压降,而不需要多个次级喷嘴。
    • 7. 发明申请
    • Evaporative heat exchanger for cooling a refrigerant
    • 用于冷却制冷剂的蒸发式换热器
    • US20090178426A1
    • 2009-07-16
    • US12009026
    • 2008-01-16
    • Mohinder Singh BhattiIlya ReyzinShrikant Mukund Joshi
    • Mohinder Singh BhattiIlya ReyzinShrikant Mukund Joshi
    • F28D5/02F28D7/16
    • F28D5/02F25B39/04F25B2339/041
    • An evaporative heat exchanger for cooling a hot refrigerant having a core of alternatively stacked dry and wet plates. Each dry plate includes a dry side defining a plurality of dry channels in a first direction, a series of ports distributed along the dry channels, a wet side, and a refrigerant cooling section. Each wet plate includes a wet side adjacent to and cooperates with the wet side of the dry plate to define a plurality of wet channels in a second direction. The dry channels, ports, and wet channels define a labyrinth for the air flow, which evaporates the liquid contained in the wet channels resulting in a cooling of the refrigerant. The refrigerant cooling section is integral with the outboard of the dry plate and adjacent to an end section of the wet channels to provide enhanced refrigerant cooling.
    • 一种蒸发式热交换器,用于冷却具有交替堆叠干湿板的芯的热制冷剂。 每个干板包括在第一方向上限定多个干燥通道的干燥侧面,沿着干燥通道分布的一系列端口,湿侧和制冷剂冷却部分。 每个湿板包括与干板相邻并与湿侧配合的湿侧以在第二方向上限定多个湿通道。 干燥的通道,端口和湿通道为空气流动定义了迷宫,这会使包含在湿通道中的液体蒸发,从而冷却制冷剂。 制冷剂冷却部分与干板的外侧相邻并且与湿通道的端部部分相邻,以提供增强的制冷剂冷却。
    • 9. 发明授权
    • Heat dissipation element for cooling electronic devices
    • 用于冷却电子设备的散热元件
    • US07509995B2
    • 2009-03-31
    • US10840410
    • 2004-05-06
    • Mohinder Singh BhattiIlya ReyzinDebashis GhoshShrikant Mukund Joshi
    • Mohinder Singh BhattiIlya ReyzinDebashis GhoshShrikant Mukund Joshi
    • F28F7/00H05K7/20
    • F28F3/04F28D15/0233F28F13/00
    • A heat dissipation element for cooling an electronic device is disclosed. The heat dissipation element has a top surface and a bottom surface for mounting the electronic device to be cooled thereto. The top surface defines a heat dissipation area for dissipating heat from the electronic device and a plurality of heat transfer fins project upwardly from the top surface and are coextensive with the heat dissipation area. Each of the heat transfer fins defines a plurality of steps having a rise and a run and each of the steps extend across the heat dissipation area for maximizing an amount of heat dissipated from the electronic device. The heat dissipation element is particularly useful in either one of a cold plate assembly used with a liquid cooled unit (LCU) or a boiler plate assembly used with a thermosiphon cooling unit (TCU).
    • 公开了一种用于冷却电子设备的散热元件。 散热元件具有用于安装要冷却的电子设备的顶表面和底表面。 顶表面限定了用于从电子设备散热的散热区域,并且多个传热翅片从顶表面向上突出并且与散热区域共同延伸。 每个传热翅片限定了具有上升和下降的多个台阶,并且每个台阶延伸穿过散热区域以最大化从电子设备散发的热量。 散热元件在与液体冷却单元(LCU)一起使用的冷板组件或与热虹吸冷却单元(TCU)一起使用的锅炉板组件中的任一个中特别有用。