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1. 发明授权

US07521011B2 Semiconductor-sealing-purpose epoxy resin compound producing method 有权
标题翻译：半导体封装用环氧树脂复合物的制造方法
公开(公告)号：US07521011B2
公开(公告)日：2009-04-21
申请号：US10526008
申请日：2004-01-30
申请人： Mitsuo Ishikawara , Kouji Taya , Rikiya Kobayashi , Hideki Ebihara , Tateo Yamada
发明人： Mitsuo Ishikawara , Kouji Taya , Rikiya Kobayashi , Hideki Ebihara , Tateo Yamada
IPC分类号： B29C47/38
CPC分类号： B29B7/84 , B29C47/46 , B29C47/6037 , H01L21/565 , H01L2924/0002 , H01L2924/00
摘要： A method of manufacturing an epoxy resin composition for semiconductor encapsulating by use of a kneader provided with a suction hole on the downstream side of a kneading region in a conveying direction of the epoxy resin composition, and being provided with a supply orifice and a discharge orifice respectively disposed on the upstream side and the downstream side in the conveying direction of the epoxy resin composition, the method comprising kneading the epoxy resin composition, while discharging a volatile gas from the kneader through the suction hole, and simultaneously introducing outside air to the kneader through the supply orifice and the discharge orifice. Even under conditions of continuous operation of the kneader, it is possible to efficiently discharge a volatile gas, thereby significantly decreasing the quantity of a volatile components remaining in the kneaded epoxy resin composition. Therefore, when semiconductor devices are encapsulated with the epoxy resin composition, the generation of voids can be decreased.
摘要翻译：一种制造用于半导体封装的环氧树脂组合物的方法，该环氧树脂组合物通过使用在环氧树脂组合物的输送方向上在捏合区域的下游侧设置有吸孔的捏合机，并且设置有供给孔和排出孔分别设置在环氧树脂组合物的输送方向的上游侧和下游侧，该方法包括：通过吸入孔从捏合机排出挥发性气体，同时将外部空气引入捏合机中，使环氧树脂组合物混炼; 通过供应孔和排放孔。即使在捏合机连续操作的条件下，也可以有效地排出挥发性气体，从而显着降低残留在捏合环氧树脂组合物中的挥发性成分的量。因此，当半导体器件被环氧树脂组合物包封时，可以减少空隙的产生。

2. 发明申请

US20060017188A1 Semiconductor- sealing -purpose epoxy resin compound producing method 有权
标题翻译：半导体封装 - 环氧树脂复合材料的生产方法
公开(公告)号：US20060017188A1
公开(公告)日：2006-01-26
申请号：US10526008
申请日：2004-01-30
申请人： Mitsuo Ishikawara , Kouji Taya , Rikiya Kobayashi , Hideki Ebihara , Tateo Yamada
发明人： Mitsuo Ishikawara , Kouji Taya , Rikiya Kobayashi , Hideki Ebihara , Tateo Yamada
IPC分类号： B29C47/76 , B29C47/38
CPC分类号： B29B7/84 , B29C47/46 , B29C47/6037 , H01L21/565 , H01L2924/0002 , H01L2924/00
摘要： A method of manufacturing an epoxy resin composition for semiconductor encapsulating by use of a kneader provided with a suction hole on the downstream side of a kneading region in a conveying direction of the epoxy resin composition, and being provided with a supply orifice and a discharge orifice respectively disposed on the upstream side and the downstream side in the conveying direction of the epoxy resin composition, the method comprising kneading the epoxy resin composition, while discharging a volatile gas from the kneader through the suction hole, and simultaneously introducing outside air to the kneader through the supply orifice and the discharge orifice. Even under conditions of continuous operation of the kneader, it is possible to efficiently discharge a volatile gas, thereby significantly decreasing the quantity of a volatile components remaining in the kneaded epoxy resin composition. Therefore, when semiconductor devices are encapsulated with the epoxy resin composition, the generation of voids can be decreased.
摘要翻译：一种制造用于半导体封装的环氧树脂组合物的方法，该环氧树脂组合物通过使用在环氧树脂组合物的输送方向上在捏合区域的下游侧设置有吸孔的捏合机，并且设置有供给孔和排出孔分别设置在环氧树脂组合物的输送方向的上游侧和下游侧，该方法包括：通过吸入孔从捏合机排出挥发性气体，同时将外部空气引入捏合机中，使环氧树脂组合物混炼; 通过供应孔和排放孔。即使在捏合机连续操作的条件下，也可以有效地排出挥发性气体，从而显着降低残留在捏合环氧树脂组合物中的挥发性成分的量。因此，当半导体器件被环氧树脂组合物封装时，可以减少空隙的产生。

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