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1. 发明申请

US20100259898A1 ELECTRIC POWER CONVERTER 有权
标题翻译：电力转换器
公开(公告)号：US20100259898A1
公开(公告)日：2010-10-14
申请号：US12759971
申请日：2010-04-14
申请人： Mitsunori KIMURA , Yukitoshi Narumi , Masaya Tonomoto
发明人： Mitsunori KIMURA , Yukitoshi Narumi , Masaya Tonomoto
IPC分类号： H05K7/20
CPC分类号： H05K7/20927
摘要： An electric power converter has a semiconductor module having a semiconductor element integrally and at least a pair of semiconductor terminals, a capacitor electrically connected to the semiconductor module, and a cooler that thermally contacts to at least one of a plurality of capacitor terminals provided in the capacitor. The capacitor terminals that thermally contact the cooler are arranged between the cooler and the capacitor.
摘要翻译：电力转换器具有半导体元件，半导体元件为一体，至少一对半导体端子，与该半导体模块电连接的电容器，以及与设置在该半导体元件中的多个电容端子中的至少一个热接触的冷却器电容器。与冷却器热接触的电容器端子布置在冷却器和电容器之间。

2. 发明授权

US08355244B2 Electric power converter 有权
标题翻译：电力转换器
公开(公告)号：US08355244B2
公开(公告)日：2013-01-15
申请号：US12759971
申请日：2010-04-14
申请人： Mitsunori Kimura , Yukitoshi Narumi , Masaya Tonomoto
发明人： Mitsunori Kimura , Yukitoshi Narumi , Masaya Tonomoto
IPC分类号： H05K7/20
CPC分类号： H05K7/20927
摘要： An electric power converter has a semiconductor module having a semiconductor element integrally and at least a pair of semiconductor terminals, a capacitor electrically connected to the semiconductor module, and a cooler that thermally contacts to at least one of a plurality of capacitor terminals provided in the capacitor. The capacitor terminals that thermally contact the cooler are arranged between the cooler and the capacitor.
摘要翻译：电力转换器具有半导体元件，半导体元件为一体，至少一对半导体端子，与该半导体模块电连接的电容器，以及与设置在该半导体元件中的多个电容端子中的至少一个热接触的冷却器电容器。与冷却器热接触的电容器端子布置在冷却器和电容器之间。

3. 发明申请

US20100235152A1 INTERACTIVE CONTACT LENS SIMULATION SYSTEM AND METHOD 审中-公开
标题翻译：交互式镜头模拟系统及方法
公开(公告)号：US20100235152A1
公开(公告)日：2010-09-16
申请号：US12401662
申请日：2009-03-11
申请人： Mitsunori Kimura , Francesca Renna , Justin O'Connell
发明人： Mitsunori Kimura , Francesca Renna , Justin O'Connell
IPC分类号： G06G7/48
CPC分类号： G06T11/60
摘要： An interactive contact lens simulation system including a user interactive device including a processor, a storage device storing executable code operative with the processor to display a viewing area on a user interactive device, display a digital image on a user interactive device, the digital image having a representation of at least one eye, display at least one image manipulation tool on a user interactive device wherein the at least one image manipulation tool is configured to modify a digital image on a user interactive device when engaged by a user, display at least one graphical representation of a contact lens on a user interactive device, and display at least one lens manipulation tool on a user interactive device wherein the at least one lens manipulation tool is configured to modify the at least one graphical representation of a contact lens when engaged by a user.
摘要翻译：一种交互式隐形眼镜模拟系统，包括包括处理器的用户交互设备，存储与所述处理器一起操作以在用户交互设备上显示观看区域的可执行代码的存储设备，在用户交互设备上显示数字图像，所述数字图像具有至少一个眼睛的表示，在用户交互设备上显示至少一个图像操纵工具，其中所述至少一个图像操纵工具被配置为在用户接合时修改用户交互设备上的数字图像，显示至少一个在用户交互设备上的隐形眼镜的图形表示，以及在用户交互设备上显示至少一个透镜操纵工具，其中所述至少一个透镜操纵工具被配置成当由所述至少一个透镜操纵工具接合时修改隐形眼镜的至少一个图形表示一个用户

4. 发明申请

US20090178788A1 SEMICONDUCTOR COOLING STRUCTURE 审中-公开
标题翻译：半导体冷却结构
公开(公告)号：US20090178788A1
公开(公告)日：2009-07-16
申请号：US12351178
申请日：2009-01-09
申请人： Mitsunori KIMURA
发明人： Mitsunori KIMURA
IPC分类号： F28D15/00
CPC分类号： H01L23/473 , H01L23/4334 , H01L25/071 , H01L25/112 , H01L2023/4043 , H01L2023/4056 , H01L2924/0002 , H01L2924/00
摘要： The semiconductor cooling structure includes a semiconductor module including therein at least two semiconductor elements, a cooling pipe having a cooling surface in close contact with the semiconductor module, the cooling pipe including a coolant inlet hole, a coolant outlet hole, and a coolant passage through which coolant flows in a first direction from the coolant inlet hole to the coolant outlet hole, and a coolant moving structure disposed within the cooling pipe to move the coolant flowing through the coolant passage such that the coolant has a velocity vector in a second direction perpendicular to the cooling surface.
摘要翻译：半导体冷却结构包括其中包括至少两个半导体元件的半导体模块，具有与半导体模块紧密接触的冷却表面的冷却管，冷却管包括冷却剂入口孔，冷却剂出口孔和冷却剂通道所述冷却剂沿第一方向从所述冷却剂入口孔流到所述冷却剂出口孔;以及冷却剂移动结构，其设置在所述冷却管内，以使流过所述冷却剂通道的冷却剂移动，使得所述冷却剂具有垂直于第二方向的速度矢量到冷却表面。

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