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    • 1. 发明专利
    • Rotary type internal combustion engine
    • 旋转式内燃机
    • JP2006207564A
    • 2006-08-10
    • JP2005043037
    • 2005-01-24
    • Minoru Sanada実 真田
    • SANADA MINORU
    • F02B53/00F01C1/46
    • Y02T10/17
    • PROBLEM TO BE SOLVED: To directly rotate a rotor and a rotary shaft by energy at the time of explosion of air-fuel mixture in an internal combustion engine, and thereby to dispense with complicated delivery of energy in a piston of a conventional reciprocation type engine, and to reduce mechanical loss.
      SOLUTION: A combustion chamber is provided in a housing having a center part machined to be a cylindrical shape, the rotor, a cam, a gate and a valve are incorporated, and strokes of intake, compression, explosion and exhaust are performed with the usage of the air-fuel mixture comprising liquid or gas fuel and the air by rotating the rotor three times and operating the gate and the valve. The rotor and the four cams are rotated to the left, and the cam is rotated once while the rotor is rotated three times.
      COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:在内燃机中的空气 - 燃料混合物的爆炸时,通过能量直接旋转转子和旋转轴,由此在常规的活塞的活塞中省去复杂的能量输送 往复式发动机,并减少机械损失。 解决方案:燃烧室设置在具有加工成圆筒形状的中心部分的壳体中,并入转子,凸轮,闸门和阀,并且进行进气,压缩,爆炸和排气的冲程 利用包含液体或气体燃料的空气 - 燃料混合物和空气通过使转子旋转三次并操作闸门和阀。 转子和四个凸轮向左旋转,当转子旋转三次时,凸轮旋转一次。 版权所有(C)2006,JPO&NCIPI
    • 4. 发明申请
    • Semiconductor test device
    • 半导体测试装置
    • US20070009240A1
    • 2007-01-11
    • US11480485
    • 2006-07-05
    • Naomi MiyakeMinoru Sanada
    • Naomi MiyakeMinoru Sanada
    • A21B2/00F26B19/00
    • H01L21/67248G01R31/2856G01R31/2874
    • A semiconductor test device comprises a substrate having a opposed-wafer surface on which a semiconductor wafer with a plurality of the embedded semiconductor devices is placing opposite when a burn-in test is implemented, a wiring layer provided on the substrate, and a temperature sensor for measuring a temperature of the semiconductor wafer in the state here the semiconductor wafer is placing opposite on the substrate, wherein the wiring layer includes a wiring which is connected to the semiconductor wafer in the state where the semiconductor wafer is placing opposite on the substrate, and supplies a signal and a voltage for the burn-in test to the semiconductor wafer, and the temperature sensor is provided on the substrate in vicinity of the opposed-wafer surface.
    • 半导体测试装置包括具有相对晶片表面的基板,在实现老化测试的同时,具有多个嵌入式半导体器件的半导体晶片在其上相对放置,设置在基板上的布线层和温度传感器 用于在半导体晶片在基板上相对放置的状态下测量半导体晶片的温度,其中布线层包括在半导体晶片相对于基板放置的状态下连接到半导体晶片的布线, 并且向半导体晶片提供用于老化测试的信号和电压,并且在相对晶片表面附近的基板上设置温度传感器。
    • 5. 发明授权
    • Method and apparatus for wafer level burn-in
    • 晶圆级老化的方法和装置
    • US07940064B2
    • 2011-05-10
    • US12063276
    • 2006-05-29
    • Terutsugu SegawaMinoru Sanada
    • Terutsugu SegawaMinoru Sanada
    • G01R31/00
    • H01L21/67248G01R31/2874H01L21/67103H01L21/67242H01L21/67288
    • A temperature regulation plate 106 is divided into at least two areas, a heater 408 for applying a temperature load in correspondence with such areas and its control system are divided and controlled independently to set temperatures, and a cooling source is controlled by comparing the measurements from temperature sensors 409 arranged in respective areas for controlling the heater 408 and switching the measurement for calculating the control output sequentially thus reducing variation in in-plane temperature of a wafer due to heating when an electric load is applied. Since consumption and burning of a probe are prevented, highly reliable wafer level burn-in method and apparatus can be provided.
    • 温度调节板106被分成至少两个区域,加热器408用于对应于这些区域施加温度负荷,并且其控制系统被独立地分开和控制以设定温度,并且通过将来自 温度传感器409布置在用于控制加热器408的各个区域中,并且顺序地切换用于计算控制输出的测量值,从而当施加电负载时,由于加热而减小晶片的面内温度的变化。 由于防止了探测器的消耗和燃烧,因此可以提供高度可靠的晶片级老化方法和装置。
    • 8. 发明授权
    • Probe card for semiconductor IC test and method of manufacturing the same
    • 半导体IC测试用探针卡及其制造方法
    • US07768285B2
    • 2010-08-03
    • US11812463
    • 2007-06-19
    • Minoru SanadaYoshirou Nakata
    • Minoru SanadaYoshirou Nakata
    • G01R31/02G01R31/26
    • G01R1/07314G01R1/44G01R31/2863Y10T29/49117
    • Provided is a probe card for semiconductor IC test on one principal surface of which are formed a plurality of probe electrodes, such as bump electrodes (5), and which has, in a peripheral portion thereof, a thin film sheet (9) fixed to a support, such as a ceramics ring (7). A local tension-changed portion (12) is formed in the thin film sheet (9) fixed to the ceramics ring (7) so that a tensile strain is generated, and the plurality of bump electrodes (5) are arranged in prescribed positions that connect electrically to electrodes of each semiconductor IC element of the semiconductor wafer. The tensile strain of the thin film sheet (9) is changed positively and in a sustained manner, whereby the bump electrodes (5) are rearranged in desired positions.
    • 提供一种用于半导体IC测试的探针卡,其一个主表面上形成有诸如凸起电极(5)的多个探针电极,并且其周边部分具有固定到 诸如陶瓷环(7)的支撑件。 在固定在陶瓷环(7)上的薄膜片(9)上形成局部张力变化部(12),产生拉伸应变,多个突起电极(5)配置在规定位置 电连接到半导体晶片的每个半导体IC元件的电极。 薄膜片(9)的拉伸应变以持续的方式正向变化,由此将凸起电极(5)重新布置在期望的位置。
    • 9. 发明申请
    • Probe card for semiconductor IC test and method of manufacturing the same
    • 半导体IC测试用探针卡及其制造方法
    • US20080150563A1
    • 2008-06-26
    • US11812463
    • 2007-06-19
    • Minoru SanadaYoshirou Nakata
    • Minoru SanadaYoshirou Nakata
    • G01R1/073G01R3/00
    • G01R1/07314G01R1/44G01R31/2863Y10T29/49117
    • Provided is a probe card for semiconductor IC test on one principal surface of which are formed a plurality of probe electrodes, such as bump electrodes (5), and which has, in a peripheral portion thereof, a thin film sheet (9) fixed to a support, such as a ceramics ring (7). A local tension-changed portion (12) is formed in the thin film sheet (9) fixed to the ceramics ring (7) so that a tensile strain is generated, and the plurality of bump electrodes (5) are arranged in prescribed positions that connect electrically to electrodes of each semiconductor IC element of the semiconductor wafer. The tensile strain of the thin film sheet (9) is changed positively and in a sustained manner, whereby the bump electrodes (5) are rearranged in desired positions.
    • 提供一种用于半导体IC测试的探针卡,其一个主表面上形成有诸如凸起电极(5)的多个探针电极,并且其周边部分具有固定到 诸如陶瓷环(7)的支撑件。 在固定在陶瓷环(7)上的薄膜片(9)上形成局部张力变化部(12),产生拉伸应变,多个突起电极(5)配置在规定位置 电连接到半导体晶片的每个半导体IC元件的电极。 薄膜片(9)的拉伸应变以持续的方式正向变化,由此将凸起电极(5)重新布置在期望的位置。