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1. 发明授权

US08204701B2 Aeroelastic model using the principal shapes of modes (AMPS) 有权
标题翻译：使用主要形状模式（AMPS）的气动弹性模型
公开(公告)号：US08204701B2
公开(公告)日：2012-06-19
申请号：US11763649
申请日：2007-06-15
申请人： Ming-Ta Yang , James M. Bleeg , James A. Eley
发明人： Ming-Ta Yang , James M. Bleeg , James A. Eley
IPC分类号： G01R31/36
CPC分类号： G06F17/5018 , G06F2217/16
摘要： The Aeroelastic Model using the Principal Shapes of modes (AMPS) is a method used to predict flutter in gas turbine engines. Modern gas turbine engines often include rotors with flexible disks and/or significant blade geometry variations. The AMPS method accounts for the varying blade mode shapes associated with flexible disks as well as changing blade geometry, providing accurate flutter predictions for a large number of modes from a relatively small number of CFD (computational fluid dynamics) simulations. The AMPS method includes determining a smaller set of principal shapes that approximates a larger set of structural modes of interest. Using linear superposition, aerodynamic forces associated with the vibration of the principal shapes can be used to construct the full aerodynamic coupling matrix associated with the structural modes of interest. An eigenvalue equation is solved to determine a damping distribution associated with the structural modes of interest. The damping distribution is predictive of flutter.
摘要翻译：使用模态主成像（AMPS）的气动弹性模型是用于预测燃气轮机发动机颤振的方法。现代燃气涡轮发动机通常包括具有柔性盘和/或显着的叶片几何变化的转子。 AMPS方法考虑到与柔性磁盘相关联的变化的刀片模式形状以及改变刀片几何形状，从相对较少数量的CFD（计算流体动力学）模拟中为大量模式提供准确的颤动预测。 AMPS方法包括确定近似较大的一组感兴趣的结构模式的较小的主形状集合。使用线性叠加，可以使用与主要形状的振动相关联的空气动力来构建与感兴趣的结构模式相关联的全部空气动力学耦合矩阵。解决特征值方程以确定与感兴趣的结构模式相关联的阻尼分布。阻尼分布可预测颤振。

2. 发明申请

US20110116506A1 METHODS AND SYSTEMS FOR REROUTE AND GENERATION OF BACKWARD ROUTING INFORMATION 有权
标题翻译：用于路由和生成后向路由信息的方法和系统
公开(公告)号：US20110116506A1
公开(公告)日：2011-05-19
申请号：US12651346
申请日：2009-12-31
申请人： Hui-Kai SU , Ming-Ta Yang , Cheng-Shong Wu
发明人： Hui-Kai SU , Ming-Ta Yang , Cheng-Shong Wu
IPC分类号： H04L12/56
CPC分类号： H04L45/00 , H04L45/12 , H04L45/22 , H04L45/28
摘要： Methods and systems for reroute and generation of backward routing information are provided. When an originator node wants to transmit a packet to a destination node and cannot transmit the packet to a next node recorded in a routing table, the originator node records a backward packet tag and information of the originator node into the packet, and transmits the edited packet to a backup node recorded in the routing table. The backup node retrieves a backward routing table in response to the backward packet tag to see whether a forwarding node corresponding to the originator node and the destination node is a backward routing terminal. If not, the backup node transmits the packet to the forwarding node. If so, the backup node removes the backward packet tag and the information of the originator node from the packet, and transmits the packet to the forwarding node.
摘要翻译：提供了重新路由和生成后向路由信息的方法和系统。当发起者节点想要向目的地节点发送分组，并且不能将分组发送到记录在路由表中的下一个节点时，发起者节点将反向分组标签和发起者节点的信息记录到分组中，并发送编辑的分组到记录在路由表中的备份节点。备份节点响应于反向分组标签检索后向路由表，以查看对应于始发者节点和目的地节点的转发节点是否是后向路由终端。如果没有，则备份节点将数据包发送到转发节点。如果是，则备份节点从分组中去除反向分组标签和发起者节点的信息，并将该分组发送到转发节点。

3. 发明申请

US20090099796A1 AEROELASTIC MODEL USING THE PRINCIPAL SHAPES OF MODES (AMPS) 有权
标题翻译：使用模式的主要形状（AMPS）的AEROELASTIC MODEL
公开(公告)号：US20090099796A1
公开(公告)日：2009-04-16
申请号：US11763649
申请日：2007-06-15
申请人： Ming-Ta Yang , James M. Bleeg , James A. Eley
发明人： Ming-Ta Yang , James M. Bleeg , James A. Eley
IPC分类号： G06F19/00
CPC分类号： G06F17/5018 , G06F2217/16
摘要： The Aeroelastic Model using the Principal Shapes of modes (AMPS) is a method used to predict flutter in gas turbine engines. Modern gas turbine engines often include rotors with flexible disks and/or significant blade geometry variations. The AMPS method accounts for the varying blade mode shapes associated with flexible disks as well as changing blade geometry, providing accurate flutter predictions for a large number of modes from a relatively small number of CFD (computational fluid dynamics) simulations. The AMPS method includes determining a smaller set of principal shapes that approximates a larger set of structural modes of interest. Using linear superposition, aerodynamic forces associated with the vibration of the principal shapes can be used to construct the full aerodynamic coupling matrix associated with the structural modes of interest. An eigenvalue equation is solved to determine a damping distribution associated with the structural modes of interest. The damping distribution is predictive of flutter.
摘要翻译：使用模态主成像（AMPS）的气动弹性模型是用于预测燃气轮机发动机颤振的方法。现代燃气涡轮发动机通常包括具有柔性盘和/或显着的叶片几何变化的转子。 AMPS方法考虑到与柔性磁盘相关联的变化的刀片模式形状以及改变刀片几何形状，从相对较少数量的CFD（计算流体动力学）模拟中为大量模式提供准确的颤动预测。 AMPS方法包括确定近似较大的一组感兴趣的结构模式的较小的主形状集合。使用线性叠加，可以使用与主要形状的振动相关联的空气动力来构建与感兴趣的结构模式相关联的全部空气动力学耦合矩阵。解决特征值方程以确定与感兴趣的结构模式相关联的阻尼分布。阻尼分布可预测颤振。

4. 发明授权

US08532109B2 Methods and systems for reroute and generation of backward routing information 有权
标题翻译：重新路由和生成后向路由信息的方法和系统
公开(公告)号：US08532109B2
公开(公告)日：2013-09-10
申请号：US12651346
申请日：2009-12-31
申请人： Hui-Kai Su , Ming-Ta Yang , Cheng-Shong Wu
发明人： Hui-Kai Su , Ming-Ta Yang , Cheng-Shong Wu
IPC分类号： H04L12/28
CPC分类号： H04L45/00 , H04L45/12 , H04L45/22 , H04L45/28
摘要： Methods and systems for reroute and generation of backward routing information are provided. When an originator node wants to transmit a packet to a destination node and cannot transmit the packet to a next node recorded in a routing table, the originator node records a backward packet tag and information of the originator node into the packet, and transmits the edited packet to a backup node recorded in the routing table. The backup node retrieves a backward routing table in response to the backward packet tag to see whether a forwarding node corresponding to the originator node and the destination node is a backward routing terminal. If not, the backup node transmits the packet to the forwarding node. If so, the backup node removes the backward packet tag and the information of the originator node from the packet, and transmits the packet to the forwarding node.
摘要翻译：提供了重新路由和生成后向路由信息的方法和系统。当发起者节点想要向目的地节点发送分组，并且不能将分组发送到记录在路由表中的下一个节点时，发起者节点将反向分组标签和发起者节点的信息记录到分组中，并发送编辑的分组到记录在路由表中的备份节点。备份节点响应于反向分组标签检索后向路由表，以查看对应于始发者节点和目的地节点的转发节点是否是后向路由终端。如果没有，则备份节点将数据包发送到转发节点。如果是，则备份节点从分组中去除反向分组标签和发起者节点的信息，并将该分组发送到转发节点。

5. 发明授权

US08492872B2 On-chip inductors with through-silicon-via fence for Q improvement 有权
公开(公告)号：US08492872B2
公开(公告)日：2013-07-23
申请号：US11868392
申请日：2007-10-05
申请人： Li-Chun Yang , Ming-Ta Yang , Chao-Shun Hsu
发明人： Li-Chun Yang , Ming-Ta Yang , Chao-Shun Hsu
IPC分类号： H01L27/08
CPC分类号： H01L27/08 , H01L23/5225 , H01L23/5227 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor structure for providing isolations for on-chip inductors comprises a semiconductor substrate, one or more on-chip inductors formed above the first semiconductor substrate, a plurality of through-silicon-vias formed through the first semiconductor substrate in a vicinity of the one or more on-chip inductors, and one or more conductors coupling at least one of the plurality of through-silicon-vias to a ground, wherein the plurality of through-silicon-vias provide isolations for the one or more on-chip inductors.

6. 发明授权

US08292672B2 Flash memory device and assembly thereof with improved planar contact portions 有权
标题翻译：闪存器件及其组装具有改进的平面接触部分
公开(公告)号：US08292672B2
公开(公告)日：2012-10-23
申请号：US12796873
申请日：2010-06-09
申请人： Tsu-Liang Chou , Cheng-Fu Yau , Wei-Jen Cheng , Yu-Cheng Kang , Mei-Chih Chen , Ming-Ta Yang
发明人： Tsu-Liang Chou , Cheng-Fu Yau , Wei-Jen Cheng , Yu-Cheng Kang , Mei-Chih Chen , Ming-Ta Yang
IPC分类号： H01R24/00
CPC分类号： G06K19/005 , G06K19/07743
摘要： A flash memory device includes a Chip-On-Board (COB) type circuit board and a number of first and second contacts electrically connected to the circuit board. Each first contact includes a stiff first contact portion formed on an upper surface of the circuit board. Each second contact includes a cantilevered planar second contact portion extending along the front-to-rear direction. When the flash memory device is inserted into a USB 3.0 receptacle connector, the first and the second contact portions jointly electrically connect with the USB 3.0 receptacle connector. The planar second contact portions provide larger contacting area for mating with the corresponding contacts of the USB 3.0 receptacle connector.
摘要翻译：闪速存储器件包括片上电路板（COB）型电路板和电连接到电路板的多个第一和第二触点。每个第一接触包括形成在电路板的上表面上的刚性第一接触部分。每个第二接触件包括沿着前后方向延伸的悬臂式平面第二接触部分。当闪存装置插入USB 3.0插座连接器时，第一和第二接触部分与USB 3.0插座连接器共同电连接。平面的第二接触部分提供较大的接触面积，用于与USB 3.0插座连接器的相应触点配合。

7. 发明申请

US20110136356A1 FLASH MEMORY DEVICE WITH SLIDABLE CONTACT MODULE 有权
标题翻译：具有可滑动触点模块的闪存存储器
公开(公告)号：US20110136356A1
公开(公告)日：2011-06-09
申请号：US13019994
申请日：2011-02-02
申请人： Tsu-Liang Chou , Cheng-Fu Yau , Wei-Jen Cheng , Yu-Cheng Kang , Mei-Chih Chen , Ming-Ta Yang
发明人： Tsu-Liang Chou , Cheng-Fu Yau , Wei-Jen Cheng , Yu-Cheng Kang , Mei-Chih Chen , Ming-Ta Yang
IPC分类号： H01R13/44
CPC分类号： H05K5/0278 , G06K19/07 , G06K19/07732 , H01R13/60
摘要： A flash memory device includes a circuit board and a contact module slidable with respect to the circuit board. The circuit board includes a plurality of first contacts each having a stiff first contact portion. The contact module includes a slider and a plurality of second contacts fixed to the slider. The slider is slidable with respect to the circuit board along a front-to-rear direction between a first position and a second position. The flash memory device is compatible to USB 2.0 and USB 3.0 receptacle connectors via the slidable contact module.
摘要翻译：闪存器件包括电路板和可相对于电路板滑动的接触模块。电路板包括多个第一触头，每个触头具有刚性的第一接触部分。接触模块包括滑块和固定到滑块的多个第二触头。滑块可相对于电路板在第一位置和第二位置之间沿着前后方向滑动。闪存设备通过可滑动触点模块与USB 2.0和USB 3.0插座连接器兼容。

8. 发明申请

US20110092109A1 FLASH MEMORY DEVICE AND ASSEMBLY THEREOF WITH IMPROVED PLANAR CONTACT PORTIONS 有权
标题翻译：闪存存储器件及其与改进的平面接触部分的组件
公开(公告)号：US20110092109A1
公开(公告)日：2011-04-21
申请号：US12796873
申请日：2010-06-09
申请人： Tsu-Liang Chou , Cheng-Fu Yau , Wei-Jen Cheng , Yu-Cheng Kang , Mei-Chih Chen , Ming-Ta Yang
发明人： Tsu-Liang Chou , Cheng-Fu Yau , Wei-Jen Cheng , Yu-Cheng Kang , Mei-Chih Chen , Ming-Ta Yang
IPC分类号： H01R24/00
CPC分类号： G06K19/005 , G06K19/07743
摘要： A flash memory device includes a Chip-On-Board (COB) type circuit board and a number of first and second contacts electrically connected to the circuit board. Each first contact includes a stiff first contact portion formed on an upper surface of the circuit board. Each second contact includes a cantilevered planar second contact portion extending along the front-to-rear direction. When the flash memory device is inserted into a USB 3.0 receptacle connector, the first and the second contact portions jointly electrically connect with the USB 3.0 receptacle connector. The planar second contact portions provide larger contacting area for mating with the corresponding contacts of the USB 3.0 receptacle connector.
摘要翻译：闪速存储器件包括片上电路板（COB）型电路板和电连接到电路板的多个第一和第二触点。每个第一接触包括形成在电路板的上表面上的刚性第一接触部分。每个第二接触件包括沿着前后方向延伸的悬臂式平面第二接触部分。当闪存装置插入USB 3.0插座连接器时，第一和第二接触部分与USB 3.0插座连接器共同电连接。平面的第二接触部分提供较大的接触面积，用于与USB 3.0插座连接器的相应触点配合。

9. 发明申请

US20090090995A1 On-chip inductors with through-silicon-via fence for Q improvement 有权
标题翻译：具有通硅栅的片上电感，提高Q值
公开(公告)号：US20090090995A1
公开(公告)日：2009-04-09
申请号：US11868392
申请日：2007-10-05
申请人： Li-Chun Yang , Ming-Ta Yang , Chao-Shun Hsu
发明人： Li-Chun Yang , Ming-Ta Yang , Chao-Shun Hsu
IPC分类号： H01L29/66
CPC分类号： H01L27/08 , H01L23/5225 , H01L23/5227 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor structure for providing isolations for on-chip inductors comprises a semiconductor substrate, one or more on-chip inductors formed above the first semiconductor substrate, a plurality of through-silicon-vias formed through the first semiconductor substrate in a vicinity of the one or more on-chip inductors, and one or more conductors coupling at least one of the plurality of through-silicon-vias to a ground, wherein the plurality of through-silicon-vias provide isolations for the one or more on-chip inductors.
摘要翻译：用于为片上电感器提供隔离的半导体结构包括半导体衬底，形成在第一半导体衬底上方的一个或多个片上电感器，在第一半导体衬底附近通过第一半导体衬底形成的多个穿硅通孔或更多片上电感器，以及将多个穿硅通孔中的至少一个耦合到地的一个或多个导体，其中多个通硅通孔为一个或多个片上电感器提供隔离。

10. 发明授权

US07980868B2 Flash memory device with slidable contact module 有权
标题翻译：具有滑动触点模块的闪存设备
公开(公告)号：US07980868B2
公开(公告)日：2011-07-19
申请号：US13019994
申请日：2011-02-02
申请人： Tsu-Liang Chou , Cheng-Fu Yau , Wei-Jen Cheng , Yu-Cheng Kang , Mei-Chih Chen , Ming-Ta Yang
发明人： Tsu-Liang Chou , Cheng-Fu Yau , Wei-Jen Cheng , Yu-Cheng Kang , Mei-Chih Chen , Ming-Ta Yang
IPC分类号： H01R13/44
CPC分类号： H05K5/0278 , G06K19/07 , G06K19/07732 , H01R13/60
摘要： A flash memory device includes a circuit board and a contact module slidable with respect to the circuit board. The circuit board includes a plurality of first contacts each having a stiff first contact portion. The contact module includes a slider and a plurality of second contacts fixed to the slider. The slider is slidable with respect to the circuit board along a front-to-rear direction between a first position and a second position. The flash memory device is compatible to USB 2.0 and USB 3.0 receptacle connectors via the slidable contact module.
摘要翻译：闪存器件包括电路板和可相对于电路板滑动的接触模块。电路板包括多个第一触头，每个触头具有刚性的第一接触部分。接触模块包括滑块和固定到滑块的多个第二触头。滑块可相对于电路板在第一位置和第二位置之间沿着前后方向滑动。闪存设备通过可滑动触点模块与USB 2.0和USB 3.0插座连接器兼容。

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