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1. 发明专利

JPS61135475A Production of compound material 失效
标题翻译：生产复合材料
公开(公告)号：JPS61135475A
公开(公告)日：1986-06-23
申请号：JP25597184
申请日：1984-12-04
申请人： Mikio Nishihata , Tanaka Kikinzoku Kogyo Kk
发明人： NISHIHATA MIKIO , TAKARASAWA KATSUYUKI
IPC分类号： H01R43/16 , B23K1/00 , C23C2/36 , H01H11/04
摘要： PURPOSE: To produce continuously the compound material of good quality without separation in cut and bend works, etc. by joining the strip materials of precious metals in the longitudinal direction of the surface of a strip metal material and by performing a molten soldering in the longitudinal direction of the part being not joined.
CONSTITUTION: A strip shaped material 2 is joined in the longitudinal direction of the surface of a strip shaped metal material 1 and the compound strip material of the strip metal material 1 is obtd. with executing a cold rolling work further. The compound strip material is passed through the slit provided on the solder melting tank and moved with dipping the one side end part in the molten solder inside the tank and with the molten soldering the compound material 3' providing a solder layer 4 on the one side end part is produced.
COPYRIGHT: (C)1986,JPO&Japio
摘要翻译：目的：通过在带状金属材料的表面的长度方向上连接贵金属的带状材料并且通过在纵向上进行熔融焊接来连续地生产质量好的复合材料，而不会在切割和弯曲加工等中分离零件未连接的方向。构成：带状材料2沿带状金属材料1的表面的长度方向接合，并且可以看到带状金属材料1的复合带状材料。进一步执行冷轧工作。复合条带材料通过设置在焊料熔化槽上的狭缝，并且通过将一侧端部浸入罐内的熔融焊料中而移动，并且通过熔融焊接将复合材料3'在一侧上提供焊料层4 生产终端。

2. 发明专利

JPS61110562A Wire for dot printer 失效
标题翻译：线打印机线
公开(公告)号：JPS61110562A
公开(公告)日：1986-05-28
申请号：JP23125584
申请日：1984-11-05
申请人： Mikio Nishihata , Tanaka Kikinzoku Kogyo Kk
发明人： NISHIHATA MIKIO , TAKARASAWA KATSUYUKI
IPC分类号： C25D7/00 , B21F45/00 , B41J2/25
CPC分类号： B41J2/25
摘要： PURPOSE:To enhance lightweightness, abrasion resistance, strength or the like, by a construction wherein a cover layer of gold or a gold alloy is provided on a part or the entire part of the surface of a wire of Ti or a Ti alloy, and a hard solder is adhered to one end part of the wire. CONSTITUTION:The cover layer 3 of gold or a gold alloy is provided by plating, cladding, thermal spraying or other means on the surface of the wire 2 made of Ti or a Ti alloy and having a diameter of about 0.3mm. Next, a hard solder 4 such as silver hard solder and German hard solder is adhered to onened part of the wire 2 to produce a wire 1 for a dot printer. The cover layer 3 may cover either the entire part or a part of the surface of the wier 2. The wires 1 are connected to an electromagnetic driver through the hard solder 4, and the tips of the wires 1 are so located as to face to a platen 7.
摘要翻译：目的：通过在Ti或Ti合金的线的表面的一部分或全部上设置金或金合金覆盖层的结构来提高轻量化，耐磨性，强度等，以及硬焊料粘附到导线的一个端部。构成：金或金合金的覆盖层3通过电镀，包层，热喷涂或其他方式提供在由Ti或Ti合金制成并具有约0.3mm直径的金属线2的表面上。接下来，将诸如银硬焊料和德国硬焊料的硬焊料4粘附到导线2的一部分上，以制造点印刷机的导线1。覆盖层3可以覆盖绕线器2的表面的整个部分或一部分。电线1通过硬焊料4连接到电磁驱动器，并且电线1的尖端位于面向压板7。

3. 发明授权

US5387293A Copper base alloys and terminals using the same 失效
标题翻译：铜基合金和使用其的端子
公开(公告)号：US5387293A
公开(公告)日：1995-02-07
申请号：US36489
申请日：1993-03-24
申请人： Takayoshi Endo , Kenji Takenouchi , Mikio Nishihata , Toshio Asano , Akira Sugawara
发明人： Takayoshi Endo , Kenji Takenouchi , Mikio Nishihata , Toshio Asano , Akira Sugawara
IPC分类号： C22F1/08 , C22C9/02
CPC分类号： C22F1/08 , C22C9/02 , C22C9/06
摘要： A copper base alloy for terminals that is of the Cu-Ni-Sn-P or Cu-Ni-Sn-P-Zn system and that has a tensile strength of at least 50 kgf/mm.sup.2, a spring limit of at least 40 kgf/mm.sup.2, a stress relaxation of not more than 10% and a conductivity of at least 30% IACS is provided. Terminals the spring portion or the entire part of which is produced from that copper base alloy, having an insertion/extraction force of 0.2-3 kgf and a resistance of not more than 3 m.OMEGA. at low voltage and current as initial performance, with the added characteristic that the terminals will experience not more than 20% stress relaxation are also provided. The alloy is superior to the conventional bronze, phosphor bronze and Cu-Sn-Fe-P alloys for terminals in terms of tensile strength, spring limits, stress relaxation characteristic and conductivity and, hence, the terminals manufactured from those alloys have higher performance and reliability than the terminals made of the conventional copper base alloys for terminals.
摘要翻译：用于Cu-Ni-Sn-P或Cu-Ni-Sn-P-Zn系的端子用铜基合金，其拉伸强度为至少50kgf / mm 2，弹簧极限为至少40kgf / mm2，应力松弛不大于10％，电导率至少为30％IACS。端子弹簧部分或其整个部分由该铜基合金制成，其具有0.2-3kgf的插入/拉伸力和在低电压和电流下不超过3m欧姆电阻作为初始性能，其中还提供了终端将经历不超过20％的应力松弛的特征。在拉伸强度，弹簧极限，应力松弛特性和导电性方面，该合金优于常规的青铜，磷青铜和Cu-Sn-Fe-P合金，因此，由这些合金制造的端子具有更高的性能和可靠性高于由常规铜基合金端子制成的端子。

4. 发明授权

US5322575A Process for production of copper base alloys and terminals using the same 失效
标题翻译：生产铜基合金及使用其的端子的方法
公开(公告)号：US5322575A
公开(公告)日：1994-06-21
申请号：US36490
申请日：1993-03-24
申请人： Takayoshi Endo , Kenji Takenouchi , Mikio Nishihata , Toshio Asano , Akira Sugawara
发明人： Takayoshi Endo , Kenji Takenouchi , Mikio Nishihata , Toshio Asano , Akira Sugawara
IPC分类号： C22F1/08
CPC分类号： C22F1/08 , C22C9/02 , C22C9/06
摘要： A copper base alloy for terminals that is superior in all aspects of tensile strength, spring limits, conductivity, and stress relaxation characteristics can be produced by a process repeating the cycles consisting of hot-rolling, cold-rolling and annealing, in which process an ingot is prepared by melting and casting an alloy containing 1.0-3.0 wt % Ni, 0.02-0.15 wt % P. 0.5-2.0 wt. % Sn and, as an optional component, 0.01-2.0 wt % Zn, with the balance being Cu and incidental impurities, and with the ratio of weight percentages of Ni to P being within the range of 10-50%.
摘要翻译：可以通过重复由热轧，冷轧和退火组成的循环的过程来制造在拉伸强度，弹簧极限，导电性和应力松弛特性的各个方面都优异的用于端子的铜基合金，其中，通过熔融和铸造含有1.0-3.0重量％Ni，0.02-0.15重量％P.0.5-2.0重量％的Ni，％Sn，并且作为任选组分，为0.01-2.0重量％的Zn，余量为Cu和偶然杂质，并且Ni与P的重量百分比的比例在10-50％的范围内。

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