会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明授权
    • Method for forming amorphous silica-based coating film with low dielectric constant and thus obtained amorphous silica-based coating film
    • 用于形成具有低介电常数的无定形二氧化硅基涂膜的方法,由此获得无定形二氧化硅基涂膜
    • US08227028B2
    • 2012-07-24
    • US12310486
    • 2007-07-11
    • Miki EgamiAkira NakashimaMichio Komatsu
    • Miki EgamiAkira NakashimaMichio Komatsu
    • B05D3/02B05D3/04H01L29/00
    • C09D1/00C09D4/00H01L21/316C08G77/04
    • A method of forming on a substrate an amorphous silica-based coating film having a low dielectric constant of 3.0 or below and a film strength (Young's modulus) of 3.0 GPa or more, which comprises, as a typical one, the steps of; (a) coating on the substrate a liquid composition containing hydrolysate of an organic silicon compound or compounds hydrolyzed in the presence of tetraalkylammonium hydroxide (TAAOH); (b) setting the substrate in a chamber and then drying a coating film formed on the substrate at a temperature in the range from 25 to 340° C.; (c) heating the coating film at a temperature in the range from 105 to 450° C. with introduction of a superheated steam having such a temperature into the chamber, and (d) curing the coating film at a temperature in the range from 350 to 450° C. with introduction of a nitrogen gas into the chamber.
    • 一种在基板上形成介电常数低于3.0或更低的无定形二氧化硅基涂层以及3.0GPa或更高的膜强度(杨氏模量)的方法,其中典型的步骤包括: (a)在基材上涂覆含有有机硅化合物的水解产物或在四烷基氢氧化铵(TAAOH))存在下水解的化合物的液体组合物; (b)将基板设置在室中,然后在25至340℃的温度范围内干燥形成在基板上的涂膜。 (c)在105至450℃的温度范围内加热涂膜,并将具有这种温度的过热蒸汽引入室中,和(d)在350℃的温度下固化涂膜 至450℃,同时将氮气引入室中。
    • 9. 发明授权
    • Coating liquid for forming a silica-containing film with a low-dielectric constant and substrate coated with such a film
    • 用于形成具有低介电常数的含二氧化硅的膜和用这种膜涂覆的基材的涂布液
    • US06451436B1
    • 2002-09-17
    • US09577507
    • 2000-05-24
    • Michio KomatsuAkira NakashimaMiki Egami
    • Michio KomatsuAkira NakashimaMiki Egami
    • B32B904
    • H01L21/3122C09D183/04H01L21/02126H01L21/02216H01L21/02282H01L21/02337Y10T428/31511Y10T428/31663Y10T428/31725Y10T428/31786Y10T428/31855C08L2666/02
    • A coating liquid for forming a silica-containing film with a low-dielectric constant, which enables the formation of a low-density film having a dielectric constant as low as 3 or less and being excellent not only in resistance of oxygen plasma and in process adaptation but also in adhesion to a substrate and in film strength, is provided. A substrate coated with the silica-containing film having the above characteristics, which is obtained by the use of the above coating liquid, is further provided. The coating liquid for forming a silica-containing film with a low-dielectric constant comprises a polymer composition mainly constituted by (i) a hydrolyzate of at least one alkoxysilane represented by the following formula (I) and/or at least one halogenated silane represented by the following formula (II), and (ii) a readily decomposable resin, XnSi(OR)4−n  (I) XnSiX′4−n  (II) wherein X represents a hydrogen atom, a fluorine atom, an unfluorinated or fluorinated alkyl group of 1 to 8 carbon atoms, an aryl group or a vinyl group; R represents a hydrogen atom, an alkyl group of 1 to 8 carbon atoms, an aryl group or a vinyl group; X′ represents a halogen atom; and n is an integer of 0 to 3.
    • 一种用于形成具有低介电常数的含二氧化硅的膜的涂布液,其能够形成介电常数低至3或更低的低密度膜,并且不仅具有优异的氧等离子体的电阻和过程 提供适应性,但也适用于对基材的粘合性和膜强度。 进一步提供了通过使用上述涂布液而获得的具有上述特性的含二氧化硅膜的基材。 用于形成具有低介电常数的含二氧化硅膜的涂布液包括主要由(i)由下式(I)表示的至少一种烷氧基硅烷的水解产物和/或至少一种卤代硅烷代表的聚合物组合物 通过下式(II)和(ii)易分解性树脂,其中X表示氢原子,氟原子,1至8个碳原子的未氟化或氟化烷基,芳基或乙烯基; R表示氢原子,1〜8个碳原子的烷基,芳基或乙烯基; X'表示卤原子; n为0〜3的整数。