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1. 发明授权

US5690544A Wafer polishing apparatus having physical cleaning means to remove particles from polishing pad 失效
标题翻译：具有用于从抛光垫去除颗粒的物理清洁装置的晶片抛光装置
公开(公告)号：US5690544A
公开(公告)日：1997-11-25
申请号：US623936
申请日：1996-03-28
申请人： Michio Sakurai
发明人： Michio Sakurai
IPC分类号： B24B57/02 , B24B53/007 , B24B53/017 , H01L21/304 , B24B21/18 , B24B33/00 , B24B47/26 , B24B55/00
CPC分类号： B24B53/017
摘要： The invention relates to an apparatus for polishing wafers in the fabrication of semiconductor integrated circuits. The apparatus has a turntable on which a polishing pad of polyurethane foam is placed. The pad has a multiplicity of cavities in the polishing surface. In periodically dressing the pad, abrasive grains of diamond fall off the dressing tool, and some of the fallen abrasive grains remain in the cavities in the pad surface even though the pad surface is washed by water. According to the invention the polishing apparatus includes a cleaning device to drive abrasive grains out of the cavities. The cleaning device has a cylindrical body which rotates above the polishing pad. In an embodiment the cleaning device is a rotary brush having a multiplicity of needle-like parts of a synthetic resin on the cylindrical outer surface. The needle-like parts intrude into the cavities in the pad surface and flip abrasive grains out of the cavities. In another embodiment the cleaning device has an elastic covering on the cylindrical body. The elastic covering is squeezed into the cavities to temporarily close the opening of the cavities and reduce the air pressure in the cavities. When the elastic covering leaves the cavities a rush of the air into the cavities drives diamond grains out of the cavities.
摘要翻译：本发明涉及一种在制造半导体集成电路中抛光晶片的装置。该装置具有放置聚氨酯泡沫的抛光垫的转台。该抛光垫在抛光表面中具有多个空腔。在定期修整垫片时，金刚石的磨粒从修整工具脱落，并且一些掉落的磨料颗粒保留在垫表面的空腔中，即使垫表面被水洗涤。根据本发明，抛光装置包括将磨料颗粒驱出空腔的清洁装置。清洁装置具有在抛光垫上方旋转的圆柱体。在一个实施例中，清洁装置是在圆筒形外表面上具有合成树脂的多个针状部分的旋转刷。针状部件侵入垫表面中的空腔并将磨料颗粒从空腔中翻出。在另一个实施例中，清洁装置在圆柱体上具有弹性覆盖物。弹性覆盖物被挤压到空腔中以临时闭合空腔的开口并且减小空腔中的空气压力。当弹性覆盖物离开空腔时，空气涌入空腔将金刚石颗粒驱出空腔。

2. 发明授权

US07847211B2 Light radiating conditions selecting method, light radiating conditions selecting device, and soldering device 有权
标题翻译：光照条件选择方法，光照条件选择装置，焊接装置
公开(公告)号：US07847211B2
公开(公告)日：2010-12-07
申请号：US11512824
申请日：2006-08-30
申请人： Tomoko Fukunaka , Masashi Ishiguro , Kenji Takahashi , Shinsuke Kurahashi , Michio Sakurai
发明人： Tomoko Fukunaka , Masashi Ishiguro , Kenji Takahashi , Shinsuke Kurahashi , Michio Sakurai
IPC分类号： B23K1/005 , B23K26/20 , G06F19/00
CPC分类号： G06F17/5036 , H05K1/0201 , H05K1/116 , H05K3/3494 , H05K3/429 , H05K2203/107 , H05K2203/304
摘要： A method and device capable of properly selecting light radiating conditions in soldering work where components are soldered onto a board with light radiation applied to a solder joint. The device for selecting the light radiation conditions may contain a) an input device for entering information on; b) a storage for storing at least any one of databases on light radiation power and light radiation time for soldering; c) a calculator for determining light radiating conditions according to the information entered through the input device and the database stored in the storage; and d) an output device for outputting the light radiating conditions determined by the calculator. The input device may further comprise i) a component; ii) a board on which the component is soldered; and iii) solder for soldering the component.
摘要翻译：一种方法和装置，其能够在焊接工作中适当地选择光辐射条件，其中组件被焊接到板上，施加到焊接点上的光辐射。用于选择光辐射条件的装置可以包含：a）用于输入信息的输入装置; b）用于存储用于焊接的光辐射功率和光辐射时间上的数据库中的至少任一个的存储器; c）计算器，用于根据通过输入设备输入的信息和存储在存储器中的数据库来确定光照条件; 以及d）用于输出由所述计算器确定的所述光辐射条件的输出装置。输入设备还可以包括：i）组件; ii）组件焊接在其上的板; 和iii）用于焊接部件的焊料。

3. 发明申请

US20070050158A1 Light radiating conditions selecting method, light radiating conditions selecting device, and soldering device 有权
标题翻译：光照条件选择方法，光照条件选择装置，焊接装置
公开(公告)号：US20070050158A1
公开(公告)日：2007-03-01
申请号：US11512824
申请日：2006-08-30
申请人： Tomoko Fukunaka , Masashi Ishiguro , Kenji Takahashi , Shinsuke Kurahashi , Michio Sakurai
发明人： Tomoko Fukunaka , Masashi Ishiguro , Kenji Takahashi , Shinsuke Kurahashi , Michio Sakurai
IPC分类号： G06F19/00
CPC分类号： G06F17/5036 , H05K1/0201 , H05K1/116 , H05K3/3494 , H05K3/429 , H05K2203/107 , H05K2203/304
摘要： The light radiating conditions selecting device contains a) an input device for entering at least any one item of information on i) a component; ii) a board on which the component is soldered; and iii) solder for soldering the component; b) a storage for storing at least any one of databases on light radiation power and light radiation time for soldering; c) a calculator for determining light radiating conditions according to the information entered through the input device and the database stored in the storage; d) and an output device for outputting the light radiating conditions determined by the calculator.
摘要翻译：光辐射条件选择装置包括：a）输入装置，用于输入至少一个信息项，i）元件; ii）组件焊接在其上的板; 和iii）用于焊接部件的焊料; b）用于存储用于焊接的光辐射功率和光辐射时间上的数据库中的至少任一个的存储器; c）计算器，用于根据通过输入设备输入的信息和存储在存储器中的数据库来确定光照条件; d）和用于输出由计算器确定的光辐射条件的输出装置。

4. 发明授权

US4523175A Dual shaft rotary electric device 失效
标题翻译：双轴旋转电器
公开(公告)号：US4523175A
公开(公告)日：1985-06-11
申请号：US579665
申请日：1984-02-13
申请人： Michio Sakurai
发明人： Michio Sakurai
IPC分类号： H01C10/20 , H01C10/36 , H01H19/00 , H01C10/16 , H01H19/58
CPC分类号： H01C10/36 , H01H2019/143
摘要： A dual shaft rotary electric device comprises inner and outer concentric shafts, slider supports attached to the inner and outer shafts respectively, sliders attached to the slider supports respectively, and insulating substrates stacked in the longitudinal direction of the dual shaft arrangement and respectively correspondingly to said sliders. An insulating spacer is inserted between the insulating substrates, and is held in place by opposite arms of a front side plate.
摘要翻译：双轴旋转电气装置包括内部和外部同心轴，分别附接到内部轴和外部轴的滑块支撑件，分别附接到滑块支架的滑块和沿双轴装置的纵向方向堆叠的绝缘衬底，并且分别对应于所述滑块绝缘间隔件插入在绝缘基板之间，并通过前侧板的相对臂保持在适当位置。

5. 发明授权

US06287750B1 Method of manufacturing semiconductor device in which opening can be formed with high precision 失效
标题翻译：可以高精度地形成开口的半导体装置的制造方法
公开(公告)号：US06287750B1
公开(公告)日：2001-09-11
申请号：US08838654
申请日：1997-04-09
申请人： Michio Sakurai
发明人： Michio Sakurai
IPC分类号： G03F740
CPC分类号： H01L21/76802 , H01L21/31116 , H01L21/31144
摘要： In a method of manufacturing a semiconductor device, an inorganic insulating layer is formed to cover a conductive layer, a polyimide layer is formed to cover the inorganic insulating layer, and a photo-resist layer is formed to cover the polyimide layer. An opening portion is formed by use of development or a wet etching to pass through the photo-resist layer and the polyimide layer to the inorganic insulating film. Then, after the photo-resist layer is removed, heat treatment is performed of the polyimide layer. Subsequently, the inorganic insulating film is etched using the polyimide layer having the opening portion as a mask. The photo-resist layer has a film thickness in a range of 4 to 10 &mgr;m, and the polyimide layer has a film thickness in a range of 5 to 20 &mgr;m.
摘要翻译：在制造半导体器件的方法中，形成无机绝缘层以覆盖导电层，形成覆盖无机绝缘层的聚酰亚胺层，形成覆盖聚酰亚胺层的光致抗蚀剂层。通过显影或湿蚀刻形成开口部分，以将光致抗蚀剂层和聚酰亚胺层通过无机绝缘膜。然后，除去光致抗蚀剂层后，对聚酰亚胺层进行热处理。随后，使用具有开口部分的聚酰亚胺层作为掩模来蚀刻无机绝缘膜。光致抗蚀剂层的膜厚在4〜10μm的范围内，聚酰亚胺层的膜厚在5〜20μm的范围内。

6. 发明授权

US5700348A Method of polishing semiconductor substrate 失效
标题翻译：抛光半导体衬底的方法
公开(公告)号：US5700348A
公开(公告)日：1997-12-23
申请号：US758761
申请日：1996-12-03
申请人： Michio Sakurai
发明人： Michio Sakurai
IPC分类号： B08B3/08 , B24B37/00 , H01L21/304 , H01L21/3105 , H01L21/00 , B24B1/00
CPC分类号： H01L21/31053
摘要： In a CMP (chemical and mechanical polishing) method in which an insulating film is formed on one surface (back surface) of a semiconductor substrate and then the insulating film is chemically and mechanically polished with abrasive, an insulating thin film is formed on the surface of the semiconductor substrate on which no insulating film is provided and silicon is exposed to the outside, and a hydrophilic film is formed on the surface of the insulating thin film. Thereafter, the CMP is conducted to polish the insulating film on the back surface, and then the abrasive is chemically and physically removed. Accordingly, by providing the hydrophilic thin film on the back surface of the semiconductor substrate, it is avoidable that the abrasive on the back surface of the semiconductor substrate is partially dried and the abrasive grains are fixed to the back surface, so that the effect of removing the abrasive in the subsequent step can be improved.
摘要翻译：在半导体衬底的一个表面（背面）上形成绝缘膜，然后用研磨剂对绝缘膜进行化学和机械抛光的CMP（化学和机械抛光）方法中，在表面上形成绝缘薄膜在其上没有设置绝缘膜并且硅暴露于外部的半导体衬底，并且在绝缘薄膜的表面上形成亲水膜。此后，进行CMP以抛光后表面上的绝缘膜，然后化学和物理地除去研磨剂。因此，通过在半导体基板的背面设置亲水性薄膜，可以避免半导体基板的背面上的研磨剂被部分干燥，磨粒固定在背面，因此，可以改善在后续步骤中去除磨料。

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