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1. 发明授权

US08704353B2 Thermal management of stacked semiconductor chips with electrically non-functional interconnects 有权
标题翻译：具有电功能互连的堆叠半导体芯片的热管理
公开(公告)号：US08704353B2
公开(公告)日：2014-04-22
申请号：US13436066
申请日：2012-03-30
申请人： Michael Su , Bryan Black , Neil McLellan , Joe Siegel , Michael Alfano
发明人： Michael Su , Bryan Black , Neil McLellan , Joe Siegel , Michael Alfano
IPC分类号： H01L23/02
CPC分类号： H01L23/522 , H01L21/563 , H01L23/3677 , H01L25/0657 , H01L2924/0002 , H01L2924/00
摘要： A method of manufacturing is provided that includes fabricating a first plurality of electrically functional interconnects on a front side of a first semiconductor chip and fabricating a first plurality of electrically non-functional interconnects on a back side of the first semiconductor chip. Additional chips may be stacked on the first semiconductor chip.
摘要翻译：提供一种制造方法，其包括在第一半导体芯片的正面上制造第一多个电功能互连件，并且在第一半导体芯片的背面上制造第一多个电气非功能互连。另外的芯片可以堆叠在第一半导体芯片上。

2. 发明申请

US20130256913A1 DIE STACKING WITH COUPLED ELECTRICAL INTERCONNECTS TO ALIGN PROXIMITY INTERCONNECTS 审中-公开
标题翻译：具有耦合电气互连的DIE堆叠以对准接近互连
公开(公告)号：US20130256913A1
公开(公告)日：2013-10-03
申请号：US13436094
申请日：2012-03-30
申请人： Bryan Black , Michael Su , Neil McLellan , Joe Siegel , Michael Alfano
发明人： Bryan Black , Michael Su , Neil McLellan , Joe Siegel , Michael Alfano
IPC分类号： H01L23/538 , H01L21/58
CPC分类号： H01L25/0657 , H01L23/48 , H01L24/11 , H01L24/13 , H01L24/81 , H01L2224/03912 , H01L2224/0401 , H01L2224/11452 , H01L2224/1146 , H01L2224/1147 , H01L2224/13082 , H01L2224/131 , H01L2224/13111 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13164 , H01L2224/13562 , H01L2224/13611 , H01L2224/16 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/73204 , H01L2224/81193 , H01L2224/81203 , H01L2224/81815 , H01L2224/8191 , H01L2224/83102 , H01L2225/06513 , H01L2225/06531 , H01L2924/00014 , H01L2924/01047 , H01L2924/01029 , H01L2924/014
摘要： A method of manufacturing is provided that includes forming a first proximity interconnect on a first side of a first semiconductor chip and a first plurality of interconnect structures projecting from the first side. A second proximity interconnect is formed on a second side of a second semiconductor chip and a second plurality of interconnect structures are formed projecting from the second side. The second semiconductor chip is coupled to the first semiconductor chip so that the second side faces the first side and the first interconnect structures are coupled to the second interconnect structures. The first and second proximity interconnects cooperate to provide a proximity interface. The coupling of the first interconnect structures to the second interconnect structures provides desired vertical and lateral alignment of the first and second proximity interconnects.
摘要翻译：提供了一种制造方法，其包括在第一半导体芯片的第一侧上形成第一邻近互连和从第一侧突出的第一多个互连结构。第二接近互连形成在第二半导体芯片的第二侧上，并且第二多个互连结构形成为从第二侧突出。第二半导体芯片耦合到第一半导体芯片，使得第二侧面向第一侧，并且第一互连结构耦合到第二互连结构。第一和第二邻近互连协作以提供接近接口。第一互连结构与第二互连结构的耦合提供了第一和第二邻近互连的期望的垂直和横向对准。

3. 发明申请

US20130256895A1 STACKED SEMICONDUCTOR COMPONENTS WITH UNIVERSAL INTERCONNECT FOOTPRINT 审中-公开
标题翻译：具有通用互连功能的堆叠半导体器件
公开(公告)号：US20130256895A1
公开(公告)日：2013-10-03
申请号：US13436124
申请日：2012-03-30
申请人： Michael Su , Bryan Black , Joe Siegel , Neil McLellan , Michael Alfano
发明人： Michael Su , Bryan Black , Joe Siegel , Neil McLellan , Michael Alfano
IPC分类号： H01L23/538 , H01L21/768
CPC分类号： H01L24/11 , H01L21/563 , H01L24/03 , H01L24/05 , H01L24/10 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/94 , H01L25/0657 , H01L25/50 , H01L2224/0345 , H01L2224/03452 , H01L2224/0361 , H01L2224/03912 , H01L2224/0401 , H01L2224/05681 , H01L2224/05687 , H01L2224/10 , H01L2224/10135 , H01L2224/10165 , H01L2224/11 , H01L2224/1146 , H01L2224/1147 , H01L2224/13111 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13164 , H01L2224/13169 , H01L2224/14131 , H01L2224/14132 , H01L2224/14136 , H01L2224/16146 , H01L2224/16235 , H01L2224/17181 , H01L2224/2732 , H01L2224/27334 , H01L2224/29076 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/81007 , H01L2224/81139 , H01L2224/8114 , H01L2224/81193 , H01L2224/81203 , H01L2224/81815 , H01L2224/83102 , H01L2224/83855 , H01L2224/92125 , H01L2224/92143 , H01L2224/94 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06568 , H01L2225/06593 , H01L2924/15311 , H01L2924/15312 , H01L2924/15313 , H01L2924/00014 , H01L2924/04953 , H01L2924/01082 , H01L2924/01047 , H01L2924/01029 , H01L2924/00012 , H01L2924/00
摘要： A method of manufacturing is provided that includes fabricating a first set of interconnect structures on a side of a first semiconductor substrate. The first semiconductor substrate is operable to have at least one of plural semiconductor substrates stacked on the side. The first set of interconnect structures is arranged in a pattern. Each of the plural semiconductor substrates has a second set of interconnect structures arranged in the pattern, one of the plural semiconductor substrates has a smallest footprint of the plural semiconductor substrates. The pattern has a footprint smaller than the smallest footprint of the plural semiconductor substrates.
摘要翻译：提供一种制造方法，其包括在第一半导体衬底的侧面上制造第一组互连结构。第一半导体衬底可操作以具有堆叠在一侧的多个半导体衬底中的至少一个。第一组互连结构以图案布置。多个半导体衬底中的每一个具有以图案布置的第二组互连结构，多个半导体衬底中的一个半导体衬底的占用面积最小。该图案的占地面积小于多个半导体衬底的最小占地面积。

4. 发明申请

US20130256872A1 THERMAL MANAGEMENT OF STACKED SEMICONDUCTOR CHIPS WITH ELECTRICALLY NON-FUNCTIONAL INTERCONNECTS 有权
标题翻译：具有电子非功能互连的堆叠半导体芯片的热管理
公开(公告)号：US20130256872A1
公开(公告)日：2013-10-03
申请号：US13436066
申请日：2012-03-30
申请人： Michael Su , Bryan Black , Neil McLellan , Joe Siegel , Michael Alfano
发明人： Michael Su , Bryan Black , Neil McLellan , Joe Siegel , Michael Alfano
IPC分类号： H01L23/48 , H01L21/50
CPC分类号： H01L23/522 , H01L21/563 , H01L23/3677 , H01L25/0657 , H01L2924/0002 , H01L2924/00
摘要： A method of manufacturing is provided that includes fabricating a first plurality of electrically functional interconnects on a front side of a first semiconductor chip and fabricating a first plurality of electrically non-functional interconnects on a back side of the first semiconductor chip. Additional chips may be stacked on the first semiconductor chip.
摘要翻译：提供一种制造方法，其包括在第一半导体芯片的正面上制造第一多个电功能互连件，并且在第一半导体芯片的背面上制造第一多个电气非功能互连。另外的芯片可以堆叠在第一半导体芯片上。

5. 发明授权

US10290606B2 Interposer with identification system 有权
公开(公告)号：US10290606B2
公开(公告)日：2019-05-14
申请号：US13529736
申请日：2012-06-21
申请人： Michael Alfano , Joe Siegel , Michael Z. Su , Bryan Black , Julius Din
发明人： Michael Alfano , Joe Siegel , Michael Z. Su , Bryan Black , Julius Din
IPC分类号： H01L21/50 , H01L23/52 , H01L23/00 , H01L23/498 , H01L23/538 , H01L23/544 , H01L21/66 , H01L25/065 , H01L23/14
摘要： Various interposers and method of manufacturing related thereto are disclosed. In one aspect, a method of manufacturing is provided that includes coupling an identification structure to an interposer. The identification structure is operable to provide identification information about the interposer. The identification structure is programmable to create or alter the identification information.

6. 发明授权

US4544356A Reciprocating dental prophylactic angular device 失效
标题翻译：往复式牙科预防角度装置
公开(公告)号：US4544356A
公开(公告)日：1985-10-01
申请号：US671739
申请日：1984-11-15
申请人： John M. Gardella , Casimir Ciepierski , Michael Alfano , Tiang-Shing Chang
发明人： John M. Gardella , Casimir Ciepierski , Michael Alfano , Tiang-Shing Chang
IPC分类号： A61C17/00 , A61C1/07
CPC分类号： A61C17/005
摘要： A dental prophylactic device has a handle section containing a drive member and a driven section at a substantial angle to the handle section containing a driven member also at an angle to the driving member. The handle section includes a longitudinally oscillatable cam follower supported parallel to the handle axis. When the cam follower is translated around the axis by the rotation of the drive shaft, it is caused to oscillate by one end contacting the stationary cam follower track. The other end engages a slot parallel to the axis of a cam at an angle to the cam follower thereby causing the cam to oscillate back and forth over an arc of at least 50.degree. to approximately 150.degree., maintaining the connection between the cam follower and the cam by the use of the slot which permits the cam follower, in effect, to move up and down with respect to the cam as it oscillates. The cam oscillates a cup which may contain prophylactic material and the reversing action limits the ability of the material to be thrown out of the cup and obviates unintended movement of the cup over the surface of a tooth which occurs in the case of rotation in a single direction. A special sealing ring and its compartment, remotely located from the head of the spindle, provides an excellent seal.
摘要翻译：牙科预防装置具有手柄部分，该手柄部分包含驱动部件和被驱动部分，所述驱动部件和被驱动部分与手柄部分成大体角度，该部分包含与驱动部件成一定角度的从动部件。手柄部分包括平行于手柄轴线支撑的纵向可摆动的凸轮从动件。当凸轮从动件通过驱动轴的旋转绕轴线平移时，通过与固定凸轮从动轨道接触的一端使其摆动。另一端与凸轮从动件的角度平行于凸轮的轴线接合，从而使凸轮在至少50°至大约150°的弧度上来回摆动，保持凸轮从动件和通过使用允许凸轮从动件的槽的凸轮在实际上相对于凸轮在其摆动时上下移动。凸轮摆动可能含有预防材料的杯子，并且反向动作限制了材料被抛出杯子的能力，并避免了杯子在牙齿表面上的意想不到的移动，这种情况在单一旋转的情况下发生方向。一个特殊的密封环及其隔间，远离主轴头部，提供了极好的密封。

7. 发明申请

US20130341783A1 INTERPOSER WITH IDENTIFICATION SYSTEM 审中-公开
标题翻译：具有识别系统的插件
公开(公告)号：US20130341783A1
公开(公告)日：2013-12-26
申请号：US13529736
申请日：2012-06-21
申请人： Michael Alfano , Joe Siegel , Michael Z. Su , Bryan Black , Julius Din
发明人： Michael Alfano , Joe Siegel , Michael Z. Su , Bryan Black , Julius Din
IPC分类号： H01L21/50 , H01L23/52
CPC分类号： H01L23/49827 , H01L22/14 , H01L22/20 , H01L23/147 , H01L23/49822 , H01L23/5382 , H01L23/544 , H01L24/16 , H01L24/97 , H01L25/0652 , H01L25/0655 , H01L2223/5444 , H01L2223/54446 , H01L2223/54453 , H01L2223/54473 , H01L2223/54486 , H01L2224/1134 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13164 , H01L2224/13169 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/94 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2924/01322 , H01L2924/12042 , H01L2924/15311 , H01L2224/81 , H01L2924/01047 , H01L2924/00012 , H01L2924/01029 , H01L2924/00014 , H01L2924/00
摘要： Various interposers and method of manufacturing related thereto are disclosed. In one aspect, a method of manufacturing is provided that includes coupling an identification structure to an interposer. The identification structure is operable to provide identification information about the interposer. The identification structure is programmable to create or alter the identification information.
摘要翻译：公开了各种插入件及其制造方法。一方面，提供一种制造方法，其包括将识别结构耦合到插入器。识别结构可操作以提供关于插入器的识别信息。识别结构是可编程的，以创建或改变识别信息。

8. 发明申请

US20130342231A1 SEMICONDUCTOR SUBSTRATE WITH ONBOARD TEST STRUCTURE 审中-公开
标题翻译：具有板载测试结构的半导体衬底
公开(公告)号：US20130342231A1
公开(公告)日：2013-12-26
申请号：US13529754
申请日：2012-06-21
申请人： Michael Alfano , Joel Siegel , Michael Z. Su , Bryan Black , Neil McLellan
发明人： Michael Alfano , Joel Siegel , Michael Z. Su , Bryan Black , Neil McLellan
IPC分类号： G01R1/04 , H05K3/30 , G01R31/00
CPC分类号： G01R31/2884 , H01L22/34 , H01L23/147 , H01L23/49816 , H01L23/49827 , H01L2224/13 , H05K1/0268 , H05K1/141 , H05K2201/10378 , H05K2203/162 , Y10T29/4913
摘要： Various interposers and methods of manufacturing related thereto are disclosed. In one aspect, a method of manufacturing is provided that includes fabricating a first test structure onboard an interposer that has a first side and second side opposite the first side. Additional test structures may be fabricated.
摘要翻译：公开了各种插入件及其制造方法。一方面，提供一种制造方法，其包括制造具有与第一侧相对的第一侧和第二侧的插入件上的第一测试结构。可以制造附加的测试结构。

9. 发明授权

US4581015A Multimedication syringe 失效
标题翻译：多重注射器
公开(公告)号：US4581015A
公开(公告)日：1986-04-08
申请号：US608884
申请日：1984-05-10
申请人： C. Michael Alfano
发明人： C. Michael Alfano
IPC分类号： A61M5/178 , A61M5/20 , A61M5/31 , A61M39/04
CPC分类号： A61M5/3129 , A61M39/04 , A61M5/1782 , A61M5/204 , A61M5/3137
摘要： A multimedication syringe for temporary storage and injection of at least two fluid substances comprising a hollow tubular housing having a generally cylindrical wall, an open rear end and a generally tapered partially closed front end defining a discharge passage; a plunger including a portion sized for moving axially within the housing through substantially the entire length thereof, the portion including a plug surrounding the portion for engaging the inner surface of the housing in a fluid-tight manner, the plunger for forcing fluid in the housing out the discharge passage when the plunger is moved axially within the housing from the open end toward the discharge passage; and a resealable tube in the wall of the housing for transmitting fluid into the housing.
摘要翻译：一种用于临时储存和注入至少两种流体物质的多用途注射器，包括具有大致圆柱形壁，敞开的后端和限定排出通道的大致锥形的部分封闭的前端的中空管状壳体; 柱塞，其包括尺寸适于在壳体内基本上在其整个长度上轴向移动的部分，该部分包括围绕该部分的塞子，用于以流体密封的方式与壳体的内表面接合，柱塞用于迫使流体在壳体当所述柱塞从所述开口端朝向所述排出通道在所述壳体内轴向移动时，排出所述排出通道; 以及在壳体的壁中的可重新密封的管，用于将流体传送到壳体中。

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