专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

FR376890A 未知
公开(公告)号：FR376890A
公开(公告)日：1907-08-23
申请号：FR376890D
申请日：1907-04-18
申请人： MATHIAS WEISS , STANISLAUS JUNGWIRTH
发明人： WEISS MATHIAS , JUNGWIRTH STANISLAUS
IPC分类号： F01L25/04

2. 发明授权

US09564555B2 Opto-electronic semiconductor module and method for the production thereof 有权
标题翻译：光电子半导体模块及其制造方法
公开(公告)号：US09564555B2
公开(公告)日：2017-02-07
申请号：US12673800
申请日：2008-08-11
申请人： Steffen Köhler , Moritz Engl , Frank Singer , Stefan Grötsch , Thomas Zeiler , Mathias Weiss
发明人： Steffen Köhler , Moritz Engl , Frank Singer , Stefan Grötsch , Thomas Zeiler , Mathias Weiss
IPC分类号： B63B45/00 , H01L25/10 , H01L25/075 , H01L25/13 , H05B33/02 , F21V5/00 , H01L33/48 , H01L33/58 , H01L33/44 , H01L33/46 , H01L33/60
CPC分类号： H01L33/483 , H01L25/0753 , H01L33/44 , H01L33/46 , H01L33/58 , H01L33/60 , H01L2924/0002 , H01L2933/0058 , H01L2924/00
摘要： An optoelectronic semiconductor module includes a chip carrier, a light emitting semiconductor chip mounted on the chip carrier and a cover element with an at least partly light transmissive cover plate, which is arranged on the side of the semiconductor chip facing away from the chip carrier, and has a frame part, wherein the frame part laterally encloses the semiconductor chip, is joined to the cover plate in a joining-layer free fashion and is joined to the chip carrier on its side remote from the cover plate.
摘要翻译：光电子半导体模块包括芯片载体，安装在芯片载体上的发光半导体芯片和具有至少部分透光的盖板的覆盖元件，该盖元件布置在半导体芯片背离芯片载体的一侧，并且具有框架部分，其中横向包围半导体芯片的框架部分以接合层的方式接合到盖板并且在远离盖板的一侧与芯片载体相连接。

3. 发明授权

US5865051A Procedure and apparatus for the optimized manufacture of coil springs on automatic spring winding machines 失效
标题翻译：自动弹簧卷绕机上螺旋弹簧优化制造的程序和设备
公开(公告)号：US5865051A
公开(公告)日：1999-02-02
申请号：US849604
申请日：1997-06-03
申请人： Uwe Otzen , Hans-Jurgen Schorcht , Mathias Weiss
发明人： Uwe Otzen , Hans-Jurgen Schorcht , Mathias Weiss
IPC分类号： B21F35/00 , B21C47/18 , B21F3/02 , B21F23/00 , B65H51/20 , B21B37/00
CPC分类号： B21F23/00 , B21C47/18 , B21F3/02 , B65H51/20
摘要： Procedure and apparatus for the optimized manufacture of coil springs on automatic spring winding machines. It is the object of the present invention to offer both a procedure and an apparatus by which even in case of fluctuating values of the wire parameters high accuracies during the spring manufacture are guaranteed and simultaneously the scrap is minimized. The solution to this problem is that prior to the winding the wire parameters are determined and the measuring results are used directly for the adjustment of the position of the winding pins or winding rollers and/or the pitch wedge, and that the wire between the uncoiling device and the guiding assembly forms a loop whereby the lateral deflection of this wire loop is measured by a recognition unit and the uncoiling device carries out an additional movement controlled by the recognition unit. The invention is suitable for continuous inspection and correction of errors occurring on spring wires for the optimized manufacture of coil springs on automatic spring winding machines.
摘要翻译： PCT No.PCT / DE95 / 01733 Sec。 371日期：1997年6月3日 102（e）日期1997年6月3日PCT提交1995年12月6日PCT公布。第WO96 / 17701号公报日期1996年6月13日自动弹簧卷绕机优化制造螺旋弹簧的程序和设备。本发明的目的是提供一种程序和装置，通过该程序和装置，即使在弹簧制造期间，即使在弹簧制造期间，线材参数的波动值高精度也被保证并且同时将废料最小化。解决这个问题的方法是，在卷绕之前，确定电线参数，并且测量结果直接用于调整绕组销或卷绕辊和/或节距楔的位置，并且开卷之间的电线装置和导向组件形成环，由此通过识别单元测量该线环的横向偏转，并且展开装置执行由识别单元控制的附加运动。本发明适用于在弹簧丝上发生的错误的连续检查和校正，以优化自动弹簧卷绕机上的螺旋弹簧的制造。

4. 发明申请

US20100230697A1 OPTO-ELECTRONIC SEMICONDUCTOR MODULE AND METHOD FOR THE PRODUCTION THEREOF 有权
标题翻译： OPTO-ELECTRONIC SEMICONDUCTOR MODULLE AND METHOD FOR PRODUCTION THEREOF
公开(公告)号：US20100230697A1
公开(公告)日：2010-09-16
申请号：US12673800
申请日：2008-08-11
申请人： Steffen Köhler , Moritz Engl , Frank Singer , Stefan Grötsch , Thomas Zeiler , Mathias Weiss
发明人： Steffen Köhler , Moritz Engl , Frank Singer , Stefan Grötsch , Thomas Zeiler , Mathias Weiss
IPC分类号： H01L33/48 , H01L33/60 , H01L21/50
CPC分类号： H01L33/483 , H01L25/0753 , H01L33/44 , H01L33/46 , H01L33/58 , H01L33/60 , H01L2924/0002 , H01L2933/0058 , H01L2924/00
摘要： An optoelectronic semiconductor module includes a chip carrier, a light emitting semiconductor chip mounted on the chip carrier and a cover element with an at least partly light transmissive cover plate, which is arranged on the side of the semiconductor chip facing away from the chip carrier, and has a frame part, wherein the frame part laterally encloses the semiconductor chip, is joined to the cover plate in a joining-layer free fashion and is joined to the chip carrier on its side remote from the cover plate.
摘要翻译：光电子半导体模块包括芯片载体，安装在芯片载体上的发光半导体芯片和具有至少部分透光的盖板的覆盖元件，该盖元件布置在半导体芯片背离芯片载体的一侧，并且具有框架部分，其中横向包围半导体芯片的框架部分以接合层的方式接合到盖板并且在远离盖板的一侧与芯片载体相连接。

5. 发明申请

US20120167968A1 METHOD FOR PRODUCING SOLAR CELLS HAVING SELECTIVE EMITTER 审中-公开
标题翻译：用于生产具有选择性发射体的太阳能电池的方法
公开(公告)号：US20120167968A1
公开(公告)日：2012-07-05
申请号：US13259835
申请日：2010-03-26
申请人： Jan Lossen , Mathias Weiss , Karsten Meyer , Tobias Wuetherich
发明人： Jan Lossen , Mathias Weiss , Karsten Meyer , Tobias Wuetherich
IPC分类号： H01L31/0352 , H01L31/18
CPC分类号： H01L31/068 , H01L21/2255 , H01L31/1804 , Y02E10/547 , Y02P70/521
摘要： A method is described for manufacturing solar cells having a selective emitter. Wafers free of saw damage are initially provided. A doping source is then applied over the entire surface of the wafer and the dopant is initially lightly diffused into the wafer until a first layer resistance area is obtained. The applied doping source is subsequently structured, only those areas which essentially correspond to the sections on the wafer to be subsequently contacted remaining as a result of the structuring. An additional second diffusion from the remaining areas of the doping source into the wafer volume is conducted until a second layer resistance area for the selective emitter is obtained and simultaneous redistribution of the dopant introduced during the first diffusion with the goal of reducing the doping concentration in the area near the surface which is no longer covered by the doping source, provided that the layer resistance values of the first layer resistance area are greater than those of the second layer resistance area.
摘要翻译：描述了一种用于制造具有选择性发射极的太阳能电池的方法。最初提供没有锯损坏的晶片。然后将掺杂源施加在晶片的整个表面上，并且掺杂剂最初轻微地扩散到晶片中，直到获得第一层电阻区域。随后构造所施加的掺杂源，因为结构化的结果，仅剩下与晶片上随后接触的部分基本对应的那些区域。进行从掺杂源的剩余区域到晶片体积的另外的第二扩散，直到获得用于选择性发射极的第二层电阻区域并且在第一扩散期间引入的掺杂剂的同时再分配，目的是降低掺杂浓度第一层电阻区域的层电阻值大于第二层电阻面积的层电阻值，而不再被掺杂源覆盖的表面附近的区域。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式