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1. 发明申请

US20060051988A1 Low-profile connector 有权
公开(公告)号：US20060051988A1
公开(公告)日：2006-03-09
申请号：US11260634
申请日：2005-10-28
申请人： Kenji Okura , Hirohisa Tanaka , Hidetoshi Takeyama , Hisanobu Tanaka , Masato Shinotani
发明人： Kenji Okura , Hirohisa Tanaka , Hidetoshi Takeyama , Hisanobu Tanaka , Masato Shinotani
IPC分类号： H01R12/00
CPC分类号： H01R13/6275 , H01R12/716 , H01R12/79
摘要： A low-profile connector for connecting two circuit boards of a-mobile equipment is constituted by a header and a socket. The header comprises a resin molded header body and a plurality of pairs of posts (conductive terminals) provided on the header body. The socket comprises a resin molded socket body and a plurality of sets of contacts provided on the socket body corresponding to the posts of the header. The header body and the socket body respectively have reinforcing member made of metal thin plate for reinforcing the header and the socket with respect to contortion or crack. Top end of the post is rolled to be reverse U-shape for contacting with the contact at two portions, in which a first contact portion is formed a part of a fitting portion of the contact at which the contact is held on the socket body and a second contact portion is a top end of a plate spring portion of the contact incurved for facing the first contact portion.

2. 发明授权

US06986670B2 Low-profile connector 有权
标题翻译：低调连接器
公开(公告)号：US06986670B2
公开(公告)日：2006-01-17
申请号：US10485110
申请日：2003-07-11
申请人： Kenji Okura , Hirohisa Tanaka , Hidetoshi Takeyama , Hisanobu Tanaka , Masato Shinotani
发明人： Kenji Okura , Hirohisa Tanaka , Hidetoshi Takeyama , Hisanobu Tanaka , Masato Shinotani
IPC分类号： H01R9/09
CPC分类号： H01R13/6275 , H01R12/716 , H01R12/79
摘要： A low-profile connector for connecting two circuit boards of mobile equipment is constituted by a header and a socket. The header comprises a resin molded header body and a plurality of pairs of posts (conductive terminals) provided on the header body. The socket comprises a resin molded socket body and a plurality of sets of contacts provided on the socket body corresponding to the posts of the header. The header body and the socket body respectively have reinforcing member made of metal thin plate for reinforcing the header and the socket with respect to contortion or crack. Top end of the post is rolled to be reverse U-shape for contacting with the contact at two portions, in which a first contact portion is formed a part of a fitting portion of the contact at which the contact is held on the socket body and a second contact portion is a top end of a plate spring portion of the contact incurved for facing the first contact portion.
摘要翻译：用于连接移动设备的两个电路板的低调连接器由插头和插座构成。集管包括设置在集管主体上的树脂模制集管主体和多对（导电端子）对。插座包括树脂模制插座主体和设置在插座主体上的对应于插头的柱的多组触点。集管主体和插座主体分别具有由金属薄板制成的加强构件，用于相对于扭曲或裂纹加强集管和插座。将柱的顶端卷成反向U形，用于在两部分处与接触件接触，其中第一接触部分形成接触件的装配部分的一部分，接触件在该部分处被保持在插座主体上，第二接触部分是接触面的第一接触部分的接触片的板簧部分的顶端。

3. 发明申请

US20050009383A1 Low-profile connector 有权
标题翻译：低调连接器
公开(公告)号：US20050009383A1
公开(公告)日：2005-01-13
申请号：US10485110
申请日：2003-07-11
申请人： Kenji Okura , Hirohisa Tanaka , Hidetoshi Takeyama , Hisanobu Tanaka , Masato Shinotani
发明人： Kenji Okura , Hirohisa Tanaka , Hidetoshi Takeyama , Hisanobu Tanaka , Masato Shinotani
IPC分类号： H01R12/22 , H01R12/00
CPC分类号： H01R13/6275 , H01R12/716 , H01R12/79
摘要： A low-profile connector for connecting two circuit boards of a emobile equipment is constituted by a header and a socket. The header comprises a resin molded header body and a plurality of pairs of posts provided on the header body. The socket comprises a resin molded socket body and a plurality of sets of contacts provided on the socket body corresponding to the posts of the header. The header body and the socket body respectively have reinforcing member made of metal thin plate for reinforcing the header and the socket with respect to contortion or crack. Top end of the post is rolled to be reverse U-shape for contacting with the contact at two portions, in which a first contact portion is formed a part of a fitting portion of the contact at which the contact is held on the socket body and a second contact portion is a top end of a plate spring portion of the contact incurved for facing the first contact portion.
摘要翻译：用于连接移动设备的两个电路板的小型连接器由头部和插座构成。集管包括设置在集管主体上的树脂模制集管主体和多对柱。插座包括树脂模制插座主体和设置在插座主体上的对应于插头的柱的多组触点。集管主体和插座主体分别具有由金属薄板制成的加强构件，用于相对于扭曲或裂纹加强集管和插座。将柱的顶端卷成反向U形，用于在两部分处与接触件接触，其中第一接触部分形成接触件的装配部分的一部分，接触件在该部分处被保持在插座主体上，第二接触部分是接触面的第一接触部分的接触片的板簧部分的顶端。

4. 发明授权

US07112091B2 Low-profile connector 有权
标题翻译：低调连接器
公开(公告)号：US07112091B2
公开(公告)日：2006-09-26
申请号：US11260634
申请日：2005-10-28
申请人： Kenji Okura , Hirohisa Tanaka , Hidetoshi Takeyama , Hisanobu Tanaka , Masato Shinotani
发明人： Kenji Okura , Hirohisa Tanaka , Hidetoshi Takeyama , Hisanobu Tanaka , Masato Shinotani
IPC分类号： H01R9/09
CPC分类号： H01R13/6275 , H01R12/716 , H01R12/79
摘要： A low-profile connector for connecting two circuit boards of a-mobile equipment is constituted by a header and a socket. The header comprises a resin molded header body and a plurality of pairs of posts (conductive terminals) provided on the header body. The socket comprises a resin molded socket body and a plurality of sets of contacts provided on the socket body corresponding to the posts of the header. The header body and the socket body respectively have reinforcing member made of metal thin plate for reinforcing the header and the socket with respect to contortion or crack. Top end of the post is rolled to be reverse U-shape for contacting with the contact at two portions, in which a first contact portion is formed a part of a fitting portion of the contact at which the contact is held on the socket body and a second contact portion is a top end of a plate spring portion of the contact incurved for facing the first contact portion.
摘要翻译：用于连接移动设备的两个电路板的小型连接器由头部和插座构成。集管包括设置在集管主体上的树脂模制集管主体和多对（导电端子）对。插座包括树脂模制插座主体和设置在插座主体上的对应于插头的柱的多组触点。集管主体和插座主体分别具有由金属薄板制成的加强构件，用于相对于扭曲或裂纹加强集管和插座。将柱的顶端卷成反向U形，用于在两部分处与接触件接触，其中第一接触部分形成接触件的装配部分的一部分，接触件在该部分处被保持在插座主体上，第二接触部分是接触面的第一接触部分的接触片的板簧部分的顶端。

5. 发明授权

US07157709B2 Infrared sensor package 有权
标题翻译：红外传感器封装
公开(公告)号：US07157709B2
公开(公告)日：2007-01-02
申请号：US10484406
申请日：2003-06-24
申请人： Ryo Taniguchi , Yuji Takada , Masahiro Kodoh , Masato Shinotani , Hisanobu Tanaka , Atsushi Hironaka
发明人： Ryo Taniguchi , Yuji Takada , Masahiro Kodoh , Masato Shinotani , Hisanobu Tanaka , Atsushi Hironaka
IPC分类号： G01J5/34
CPC分类号： G01J5/02 , G01J5/0205 , G01J5/04 , G01J5/045 , G01J5/34
摘要： An infrared sensor package has a dielectric support which is molded from a plastic material to have a sensor mount for securing a pyroelectric element as well as an IC mount for securing an IC chip that processes a signal from the pyroelectric element. The support is molded over to be integral with metal parts. The metal parts include sensor conductors for interconnection of the pyroelectric element with the IC chip, and I/O conductors for interconnection of the IC chip with I/O pins. The sensor conductors as well as the I/O conductors are both molded into and integrally with the dielectric support.
摘要翻译：红外传感器封装具有由塑料材料模制的电介质支架，以具有用于固定热电元件的传感器座以及用于固定处理来自热电元件的信号的IC芯片的IC安装座。支撑件被模制成与金属部件一体。金属部件包括用于将热电元件与IC芯片互连的传感器导体，以及IC芯片与I / O引脚相互连接的I / O导体。传感器导体以及I / O导体都被模制成和与电介质支撑体一体。

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