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    • 1. 发明授权
    • Profile measuring apparatus
    • 型材测量仪器
    • US08670128B2
    • 2014-03-11
    • US13138247
    • 2010-01-26
    • Masato KannakaEiji TakahashiMasakazu Kajita
    • Masato KannakaEiji TakahashiMasakazu Kajita
    • G01B9/02
    • G01B9/02021G01B9/02003G01B9/02027G01B11/06G01B11/2441G01B2290/65G01B2290/70
    • A shape determining device (X) splits the original light beam from a light source (Y) into two light beams, directs the light beams to the front and back surfaces of the object (1) to be determined, and performs optical heterodyne interference using the split light beams at the front and back surfaces of the object (1) to be determined. In the shape determining device (X), each of the split light beams is further split into a main light beam and a subordinate light beam, the subordinate light beam interferes with the main light beam at each of the front and back surfaces before and after the illumination of the object (1) to be determined, the signals after the interference are phase-detected, and the difference between the phases acquired by the phase detection is detected at each of the front and back surfaces of the object (1) to be determined. In the shape determining device (X), optical modulation for performing the optical heterodyne interference is performed before the optical heterodyne interference of the split light beams after the split light beams are directed to the front and back surfaces of the object (1) to be determined. Furthermore, in the shape determining device (X), a measurement optical system before the phase detection and after the split light beams are directed to the front and back surfaces of the object (1) to be determined is maintained integrally.
    • 形状确定装置(X)将来自光源(Y)的原始光束分成两束,将光束引导到物体(1)的正面和背面以确定,并且使用 在待确定物体(1)的前表面和后表面处的分束光束。 在形状确定装置(X)中,每个分束光束进一步被分割成主光束和从属光束,从属光束在前后表面的每一个前后干涉主光束 要确定的物体(1)的照明,干涉后的信号被相位检测,并且通过相位检测获得的相位之间的差异在物体(1)的前表面和后表面被检测到 确定。 在形状确定装置(X)中,在将分束光束分散在物体(1)的前后表面之前的分束光束的光学外差干涉之前进行用于执行光学外差干涉的光调制 决心。 此外,在形状确定装置(X)中,在相位检测之前和分割光束之后的测量光学系统被引导到待确定的物体(1)的前表面和后表面一体地保持。
    • 5. 发明授权
    • Apparatus and method for measuring shape
    • 用于测量形状的装置和方法
    • US07715022B2
    • 2010-05-11
    • US11707151
    • 2007-02-16
    • Tsutomu MorimotoEiji TakahashiMasato Kannaka
    • Tsutomu MorimotoEiji TakahashiMasato Kannaka
    • G01B11/24G01B11/30
    • G01B11/24
    • A shape measuring apparatus and a shape measuring method suited for measuring an edge profile of a thin sample such as a semiconductor wafer or the like is provided. A distribution of surface angle and an edge profile of a measurement site is calculated by emitting light at sequentially different angle to the measurement site of a wafer by sequentially switching and lighting a plurality of LEDs each disposed at one of plurality of positions in one plane by an LED driving circuit, obtaining an image data showing a luminance distribution of the reflected light form the measurement site through a camera by a calculator each time light is emitted and, estimating an emitting angle of the light when the luminance of the reflected light becomes peak based on image data and emitting angle of the light corresponding to each LED by the calculator.
    • 提供了适合于测量诸如半导体晶片等的薄样品的边缘轮廓的形状测量装置和形状测量方法。 通过顺序地切换和照亮各自设置在一个平面中的多个位置中的一个位置的多个LED,通过以与晶片的测量位置顺序不同的角度发射光来计算测量部位的表面角度和边缘轮廓的分布, LED驱动电路,每次发光时,通过计算机获得表示通过照相机形成测量部位的反射光的亮度分布的图像数据,并且当反射光的亮度变得高峰时,估计光的发射角度 基于图像数据和通过计算器发射对应于每个LED的光的角度。
    • 6. 发明申请
    • SHAPE DETERMINING DEVICE
    • 形状确定装置
    • US20120002213A1
    • 2012-01-05
    • US13138294
    • 2010-01-28
    • Masato KannakaEiji TakahashiMasakazu KajitaHideki MatsuokaHidetoshi TsunakiNoritaka MoriokaKazuhiko TaharaTakuya Atsumi
    • Masato KannakaEiji TakahashiMasakazu KajitaHideki MatsuokaHidetoshi TsunakiNoritaka MoriokaKazuhiko TaharaTakuya Atsumi
    • G01B11/06G01B9/02
    • G01B11/0608G01B11/2441
    • An object of the present invention is to measure thickness distribution with precision by using a simple device configuration without being affected by vibrations of a to-be-measured object. In the present invention, for each of the front and the back surfaces of a to-be-measured object 1, each of light beams obtained by branching into two an emitted light beam from a laser light source 2 is further branched into two. Then, the light beams are reflected in reference surfaces and measurement points 1a and 1b mutually in a front and back relation, so that non-interference light beams Pax and Pbx each of which contains the reference light beam and the object light beam as mutually orthogonal polarization components are acquired. Then, each light beam is branched into a plurality. Onto one or more of the branched light beams, phase shift is performed in which a change is imparted to the phase difference between the orthogonal polarization components by using wavelength plates a261, a263, and a264 and the like. Then, in the branched light beams after the phase shift, common polarization components are extracted with adopting as a reference the polarization directions of the reference light beam and the object light beam so that interference light beams Qa1 to Qa4 and Qb1 to Qb4 are acquired. From their intensities, the phase difference between the polarization components of the reference light beam and the object light beam in the non-interference light beam is calculated. Then, thickness distribution in a to-be-measured object 1 is calculated from the distribution of the phase difference.
    • 本发明的目的是通过使用简单的装置结构来精确地测量厚度分布,而不受被测物体的振动的影响。 在本发明中,对于被测量物体1的前表面和背面的每一个,通过将从激光光源2分离为两个发射光束而获得的每个光束进一步分为两个。 然后,光束在参考面和测量点1a和1b中以前后相互反映,使得不干涉光束Pax和Pbx各自包含参考光束和物体光束相互正交 获得偏振分量。 然后,将各光束分支成多个。 在一个或多个分支光束中,执行相移,其中通过使用波长板a261,a263和a264等对正交偏振分量之间的相位差赋予变化。 然后,在相移后的分支光束中,以参考基准光束和物体光束的偏振方向为参考,提取公共偏振分量,从而获得干涉光束Qa1至Qa4和Qb1至Qb4。 根据其强度,计算参考光束的偏振分量与非干涉光束中的物体光束之间的相位差。 然后,根据相位差的分布计算被测量物体1的厚度分布。
    • 8. 发明申请
    • Apparatus and method for measuring shape
    • 用于测量形状的装置和方法
    • US20070195314A1
    • 2007-08-23
    • US11707151
    • 2007-02-16
    • Tsutomu MorimotoEiji TakahashiMasato Kannaka
    • Tsutomu MorimotoEiji TakahashiMasato Kannaka
    • G01J1/04
    • G01B11/24
    • A shape measuring apparatus and a shape measuring method suited for measuring an edge profile of a thin sample such as a semiconductor wafer or the like is provided. A distribution of surface angle and an edge profile of a measurement site is calculated by emitting light at sequentially different angle to the measurement site of a wafer by sequentially switching and lighting a plurality of LEDs each disposed at one of plurality of positions in one plane by an LED driving circuit, obtaining an image data showing a luminance distribution of the reflected light form the measurement site through a camera by a calculator each time light is emitted and, estimating an emitting angle of the light when the luminance of the reflected light becomes peak based on image data and emitting angle of the light corresponding to each LED by the calculator.
    • 提供了适合于测量诸如半导体晶片等的薄样品的边缘轮廓的形状测量装置和形状测量方法。 通过顺序地切换和照亮各自设置在一个平面中的多个位置中的一个位置的多个LED,通过以与晶片的测量位置顺序不同的角度发射光来计算测量部位的表面角度和边缘轮廓的分布, LED驱动电路,每次发光时,通过计算机获得表示通过照相机形成测量部位的反射光的亮度分布的图像数据,并且当反射光的亮度变得高峰时,估计光的发射角度 基于图像数据和通过计算器发射对应于每个LED的光的角度。