专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US09039915B2 Etching solution compositions for metal laminate films 有权
标题翻译：金属层压薄膜的蚀刻溶液组成
公开(公告)号：US09039915B2
公开(公告)日：2015-05-26
申请号：US13201955
申请日：2010-02-23
申请人： Kenji Kuroiwa , Kazuaki Nagashima , Masaru Kato , Masahiro Nohara
发明人： Kenji Kuroiwa , Kazuaki Nagashima , Masaru Kato , Masahiro Nohara
IPC分类号： C03C25/68 , C23F1/20 , C23F1/26 , C23F1/44 , H01L21/3213
CPC分类号： C23F1/20 , C23F1/26 , C23F1/44 , H01L21/32134
摘要： Disclosed are etching solution compositions that comprise fluorine compounds and iron ions, which are used for bulk etching of metal laminate films wherein a layer comprising aluminum or an aluminum alloy is laminated on top and a layer comprising titanium or a titanium alloy on bottom, and an etching method using said etching solution compositions.
摘要翻译：公开了包含氟化合物和铁离子的蚀刻溶液组合物，其用于金属层压膜的体蚀刻，其中包含铝或铝合金的层在顶部层压，并且包括底部包含钛或钛合金的层，以及使用所述蚀刻溶液组合物的蚀刻方法。

2. 发明申请

US20140212234A1 DRILL AND METHOD FOR FORMING HOLE 有权
标题翻译：用于形成孔的钻孔和方法
公开(公告)号：US20140212234A1
公开(公告)日：2014-07-31
申请号：US14229096
申请日：2014-03-28
申请人： Teruo SAWABE , Koji SAITO , Masaru KATO
发明人： Teruo SAWABE , Koji SAITO , Masaru KATO
IPC分类号： B23B51/00 , B23B51/06 , B23B51/02
CPC分类号： B23B51/0018 , B23B51/00 , B23B51/02 , B23B51/06 , B23B2226/275 , B23B2250/12 , B23B2251/248 , Y10T408/03 , Y10T408/44 , Y10T408/90473 , Y10T408/909
摘要： A drill capable of performing high-quality drilling machining on a material which is hard to be cut such as CFRP is provided. The drill includes a drill body 4 having a shank portion 2 at a rear side of the drill main body and a cutting portion 3 at a front side of the drill main body, a first land A to a fourth land D at the cutting portion 3, a first cutting portion groove 5a to a fourth cutting portion groove 5d provided between the lands of the first land A to the fourth land D, a pilot blade 6 formed at the tip of the cutting portion 3, a diameter-enlarging spiral thread portion 9 continuously following the pilot blade 6, a finished spiral thread portion 12 continuously following the diameter-enlarging spiral thread portion 9, a diameter-enlarging spiral blade portion 18, and a finishing spiral blade portion 19.
摘要翻译：提供了能够对难以切割的材料（例如CFRP）进行高质量钻孔加工的钻头。钻头包括钻头主体4，钻头主体4在钻头主体的后侧具有柄部分2，在钻头主体的前侧具有切割部分3，在切割部分3处具有第一焊盘A到第四焊盘D 设置在第一焊盘A到第四焊盘D的焊盘之间的第一切割部分槽5a至第四切割部分凹槽5d，形成在切割部分3的尖端处的引导刮刀6，直径扩大的螺旋螺纹部分连续跟随导向叶片6，连续跟随扩径螺旋部分9，直径扩大的螺旋叶片部分18和整理螺旋叶片部分19的成品螺旋螺纹部分12。

3. 发明申请

US20120119352A1 ELECTROLESS GOLD PLATING SOLUTION FOR FORMING FINE GOLD STRUCTURE, METHOD OF FORMING FINE GOLD STRUCTURE USING SAME, AND FINE GOLD STRUCTURE FORMED USING SAME 有权
标题翻译：用于形成细金结构的电镀金解决方案，使用其形成精细金结构的方法和使用其形成的精细金结构
公开(公告)号：US20120119352A1
公开(公告)日：2012-05-17
申请号：US13255392
申请日：2010-03-10
申请人： Ryota Iwai , Tomoaki Tokuhisa , Masaru Kato , Tokihiro Yokoshima , Masahiro Aoyagi , Yasuhiro Yamaji , Katsuya Kikuchi , Hiroshi Nakagawa
发明人： Ryota Iwai , Tomoaki Tokuhisa , Masaru Kato , Tokihiro Yokoshima , Masahiro Aoyagi , Yasuhiro Yamaji , Katsuya Kikuchi , Hiroshi Nakagawa
IPC分类号： H01L23/48 , C09D1/00 , H01L21/768
CPC分类号： H05K3/187 , C23C18/1605 , C23C18/1607 , C23C18/165 , C23C18/1834 , C23C18/1844 , C23C18/1851 , C23C18/44
摘要： An electroless gold plating solution with which one or more openings formed in a resist overlying a substrate can be filled in a short time, the openings having a width on the order of micrometer, in particular, 100 μm or smaller, in terms of the width of the exposed substrate area, and having a height of 3 μm or larger. The electroless gold plating solution contains a deposition accelerator for deposition in fine areas, and a microfine pattern of 100 μm or finer is formed therefrom.
摘要翻译：可以在短时间内填充形成在覆盖基板的抗蚀剂中形成的一个或多个开口的无电镀金液，所述开口宽度在数量级以上，特别是100μm以下的暴露的基板区域，并且具有3μm或更大的高度。无电镀金液含有用于在微细区域中沉积的沉积促进剂，由此形成100μm以上的微细图案。

4. 发明申请

US20120031764A1 MICROCRYSTALLINE-TO-AMORPHOUS GOLD ALLOY AND PLATED FILM, AND PLATING SOLUTION FOR THOSE, AND PLATED FILM FORMATION METHOD 审中-公开
标题翻译：微晶 - 非晶态金合金和镀膜，以及这些镀层解决方案，以及镀膜形成方法
公开(公告)号：US20120031764A1
公开(公告)日：2012-02-09
申请号：US13202050
申请日：2010-02-17
申请人： Tetsuya Osaka , Yutaka Okinaka , Kazutaka Senda , Ryota Iwai , Masaru Kato
发明人： Tetsuya Osaka , Yutaka Okinaka , Kazutaka Senda , Ryota Iwai , Masaru Kato
IPC分类号： C25D3/48 , C25D7/00
CPC分类号： C25D3/62
摘要： Disclosed is a microcrystalline-to-amorphous gold alloy-plated film having excellent electrical properties and excellent mechanical properties. Physical properties including both the advantageous properties of a crystalline structure and the advantageous properties of an amorphous structure can be obtained by allowing a microcrystalline phase and an amorphous phase to exist in a mixed state at a specific ratio. The average particle diameter of the microcrystals is 30 nm or smaller, the volume fraction of the microcrystals is 10 to 90%, the knoop hardness is Hk 180 or more, the specific resistivity is 200 μΩ-cm or less. In the film, hardness and abrasion resistance can be improved while maintaining a good specific resistivity value and chemical stability both inherent to gold at practically insignificant levels. Therefore, the film is useful as a material for connecting an electric or electronic component such as a connector and a relay.
摘要翻译：公开了具有优异的电性能和优异的机械性能的微晶 - 非晶金合金镀膜。可以通过使微晶相和非晶相以特定比例以混合状态存在来获得包括晶体结构的有利性质和非晶结构的有利特性的物理性质。微晶的平均粒径为30nm以下，微晶的体积分数为10〜90％，Knoop硬度为Hk 180以上，电阻率为200μΩ·cm-cm以下。在膜中，可以提高硬度和耐磨性，同时保持金属固有的良好的电阻率值和化学稳定性，几乎不起作用。因此，该膜作为用于连接诸如连接器和继电器的电气或电子部件的材料是有用的。

5. 发明授权

US07591911B2 Plated film of gold-cobalt amorphous alloy, electroplating bath, and method for electroplating 失效
标题翻译：金 - 钴非晶合金镀膜，电镀浴，电镀方法
公开(公告)号：US07591911B2
公开(公告)日：2009-09-22
申请号：US11529537
申请日：2006-09-29
申请人： Kazutaka Senda , Masaru Kato , Tetsuya Osaka , Yutaka Okinaka
发明人： Kazutaka Senda , Masaru Kato , Tetsuya Osaka , Yutaka Okinaka
IPC分类号： C22C45/00
CPC分类号： C22C5/02 , B32B15/018 , C22C9/00 , C22C45/003 , C22C45/02 , C25D3/562 , C25D3/62 , C25D7/00 , H01H1/023 , H01R13/03 , H05K3/244
摘要： A gold-cobalt based amorphous alloy plated film consisting of a homogeneous amorphous phase not having microcrystals is formed by electroplating conducted by use of an electroplating bath containing a gold cyanide salt in a concentration of 0.01 to 0.1 mol/dm3 in terms of gold, a cobalt salt in a concentration of 0.02 to 0.2 mol/dm3 in terms of cobalt, and a tungstate in a concentration of 0.1 to 0.5 mol/dm3 in terms of tungsten. The gold-cobalt based amorphous alloy plated film obtained consists of a homogeneous amorphous phase not having microcrystals, and has an enhanced hardness while retaining the good contact resistance and chemical stability intrinsic of gold on such levels as to be free of problems on a practical use basis; therefore, the gold-cobalt based amorphous alloy plated film is effective for use as a contact material in electric and electronic component parts such as relays.
摘要翻译：由不含微晶的均匀非晶相构成的金钴系非晶合金镀膜通过使用含有浓度为0.01〜0.1mol / dm 3的金氰化物金的电镀浴进行电镀而形成，以金为单位，钴盐，以钴计，浓度为0.02〜0.2mol / dm 3，钨浓度为0.1〜0.5mol / dm 3的钨酸盐。获得的金 - 钴基非晶态合金镀膜由不具有微晶的均匀非晶相组成，并且具有增强的硬度，同时保持金的良好接触电阻和化学稳定性，使得在实际使用中没有问题基础; 因此，金钴系非晶合金镀膜可以有效地用作电气和电子部件如继电器中的接触材料。

6. 外观设计

USD572670S1 Light emitting diode 有权
公开(公告)号：USD572670S1
公开(公告)日：2008-07-08
申请号：US29266467
申请日：2006-09-22
申请人： Masato Ono , Hiroshi Miyairi , Masaru Kato , Kazunori Watanabe
设计人： Masato Ono , Hiroshi Miyairi , Masaru Kato , Kazunori Watanabe

7. 发明申请

US20080084693A1 Lighting system 有权
标题翻译：照明系统
公开(公告)号：US20080084693A1
公开(公告)日：2008-04-10
申请号：US11544706
申请日：2006-10-10
申请人： Junichi Shimada , Youichi Kawakami , Motokazu Yamada , Masaru Kato
发明人： Junichi Shimada , Youichi Kawakami , Motokazu Yamada , Masaru Kato
IPC分类号： F21V5/00
CPC分类号： F21V5/04 , F21S8/026 , F21S8/04 , F21V5/003 , F21V9/00 , F21V13/02 , F21V29/763 , F21V29/89 , F21W2131/301 , F21W2131/304 , F21W2131/402 , F21Y2103/10 , F21Y2105/10 , F21Y2113/13 , F21Y2115/10
摘要： The lighting system according to the present invention includes an electrical wiring substrate in which a connector to a power source is formed, a plurality of LED chips mounted in a predetermined array pattern on the electrical wiring substrate, a deflection lens array disposed in proximity to the LED chips between the LED chip and the predetermined illumination region and a housing for receiving the electrical wiring substrate and the deflection lens array. A plurality of deflection lenses are integrally molded in the deflection lens array to lead lights from the LED chips to the predetermined illumination region in a state where the lights from the LED chips are superposed with each other. The lights emitted from the LED chips are collected in a state where they all are superposed in a common, single illumination region through the deflection lenses.
摘要翻译：根据本发明的照明系统包括：电布线基板，其中形成有连接到电源的连接器，在电布线基板上以预定的阵列图案安装的多个LED芯片;偏转透镜阵列， LED芯片和预定照明区域之间的LED芯片和用于接收电布线基板和偏转透镜阵列的壳体。多个偏转透镜一体地模制在偏转透镜阵列中，以使来自LED芯片的光彼此重叠的状态将LED从LED芯片引导到预定的照明区域。从LED芯片发出的光线通过偏转透镜以共同的单个照明区域重叠的状态被收集。

8. 发明申请

US20070087426A1 Novel transferase and amylase, process for producing the enzymes, use thereof, and gene coding for the same 审中-公开
标题翻译：新型转移酶和淀粉酶，用于生产酶的方法，其用途及其编码基因
公开(公告)号：US20070087426A1
公开(公告)日：2007-04-19
申请号：US11526632
申请日：2006-09-26
申请人： Masaru Kato , Yutaka Miura , Masako Kettoku , Akihiro Iwamatsu , Kazuo Kobayashi , Toshihiro Komeda
发明人： Masaru Kato , Yutaka Miura , Masako Kettoku , Akihiro Iwamatsu , Kazuo Kobayashi , Toshihiro Komeda
IPC分类号： C12N9/10 , C07H21/04
CPC分类号： C12N9/2411 , C12N9/1048 , C12N9/2408 , C12N9/2414 , C12N9/2417 , C12P19/14
摘要： The invention provides a novel transferase that acts on a saccharide, as a substrate, composed of at least three sugar units wherein at least three glucose residues on the reducing end are linked α-1,4 so as to transfer the α-1,4 lingages to a α-1, α-1 linkages; a process for producing the transferase; a gene coding for the same; and a process for producing an oligosaccharide by using the same. Also provided are a novel amylase that has a principal activity of acting on a saccharide, as a substrate, composed of at least three sugar units wherein at least three sugar units on the reducing end side are glucose units and the linkage between the first and the second glucose units is α-1, α-1 while the linkage between the second and the third glucose units is α-1,4 so as to liberate α, α-trehalose by hydrolyzing the α-1,4 linkage and another activity of hydrolyzing the α-1,4 linkage within the molecular chain of the substrate and that liberates disaccharides and/or monosaccharides as the principal final products; a process for producing the amylase; a gene coding for the same; and a process for producing α, α-trehalose by using a combination of the transferase and the amylase.
摘要翻译：本发明提供了一种新的转移酶，其作用为由至少三个糖单元组成的作为底物的糖，其中还原端上的至少三个葡萄糖残基与α-1,4连接以转移α-1,4 属于α-1，α-1键; 生产转移酶的方法; 编码相同的基因; 以及使用该寡糖的方法。还提供了一种新的淀粉酶，其具有作用于由至少三个糖单元组成的糖类作为底物的主要活性，其中还原端侧的至少三个糖单元是葡萄糖单元，第一和第第二葡萄糖单位是α-1，α-1，而第二和第三葡萄糖单元之间的连接是α-1,4，以便通过水解α-1,4键和另一种活性的α-1,4键来释放α，α-海藻糖水解基质分子链内的α-1,4键，释放出二糖和/或单糖作为主要的最终产物; 淀粉酶的制造方法; 编码相同的基因; 以及通过使用转移酶和淀粉酶的组合产生α，α-海藻糖的方法。

9. 发明授权

US07022878B2 Organic borate compounds and the nonaqueous electrolytes and lithium secondary batteries using the compounds 失效
标题翻译：有机硼酸盐化合物和使用该化合物的非水电解质和锂二次电池
公开(公告)号：US07022878B2
公开(公告)日：2006-04-04
申请号：US10972404
申请日：2004-10-26
申请人： Juichi Arai , Hideaki Katayama , Mitsuru Kobayashi , Hiroyuki Yamaguchi , Hideki Takahashi , Masaru Kato
发明人： Juichi Arai , Hideaki Katayama , Mitsuru Kobayashi , Hiroyuki Yamaguchi , Hideki Takahashi , Masaru Kato
IPC分类号： C07F5/02
CPC分类号： H01M10/0568 , B60L11/1803 , B60L11/1851 , B60L2240/36 , C07F5/022 , C07F5/04 , H01M6/164 , H01M10/052 , H01M10/0525 , H01M10/0569 , H01M10/48 , H01M2300/0034 , H01M2300/0037 , Y02E60/122 , Y02T10/7011 , Y02T10/705
摘要： Organic borates having the formula: The borates are highly soluble in solvent of low dielectric constant. Also disclosed are nonaqueous electrolytes made from these organic borates; lithium secondary batteries with improved high-temperature storage characteristics; and electric appliances that comprises the battery and are free of protection circuits.
摘要翻译：具有下式的有机硼酸盐：硼酸盐在低介电常数的溶剂中高度可溶。还公开了由这些有机硼酸盐制成的非水电解质; 锂二次电池具有改善的高温储存特性; 以及包括电池并且没有保护电路的电器。

10. 发明授权

US07011431B2 Lighting apparatus 有权
公开(公告)号：US07011431B2
公开(公告)日：2006-03-14
申请号：US10419936
申请日：2003-04-22
申请人： Masato Ono , Kazunori Watanabe , Masaru Kato
发明人： Masato Ono , Kazunori Watanabe , Masaru Kato
IPC分类号： F21V7/00
CPC分类号： F21V29/51 , F21S4/20 , F21S8/033 , F21S8/06 , F21V3/00 , F21V7/0008 , F21V7/22 , F21V14/02 , F21V21/30 , F21V29/004 , F21V29/75 , F21V29/76 , F21V29/763 , F21Y2115/10
摘要： To provide a lighting apparatus that includes a simple and small moving mechanism capable of changing the light emanation direction and that has superior heat dissipation properties, the lighting apparatus includes a light-emitting unit, and a heat dissipation unit for dissipating heat generated by the light-emitting unit during light emission, wherein a heat transfer unit is connected between the light-emitting unit and the heat dissipation unit, and the light-emitting unit is in surface contact with the heat transfer unit and is connected with the heat transfer unit to be rotatable with one point or one line in the center.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式