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1. 发明授权

US07149077B2 Solid electrolytic capacitor with face-down terminals, manufacturing method of the same, and lead frame for use therein 有权
标题翻译：具有面朝下端子的固体电解电容器及其制造方法和用于其中的引线框架
公开(公告)号：US07149077B2
公开(公告)日：2006-12-12
申请号：US11274400
申请日：2005-11-15
申请人： Masami Ishijima
发明人： Masami Ishijima
IPC分类号： H01G4/228 , H01G9/10
CPC分类号： H01G9/012 , H01G2/065 , H01G9/042 , H01G9/15
摘要： A face-down terminal solid electrolytic capacitor with the increased strength between electrode terminals and a casing resin is provided. The face-down terminal solid electrolytic capacitor has a structure where a mold structure in which a lead frame and capacitor elements fixed to the lead frame are overmolded with a casing resin is cut along cutting planes respectively passing through an anode terminal forming portion and a cathode terminal forming portion of the lead frame so that end surfaces of an anode terminal and a cathode terminal are exposed. In the lead frame, the anode terminal forming portion 21 and the cathode terminal forming portion 22 are provided so as to face each other. The anode terminal forming portion has a concave portion 21j on the board mount side and a convex portion 21t on the opposite side, which are formed by deforming part of the anode terminal forming portion in a direction perpendicular to a board mount surface. The concave portion is applied with plating. The convex portion has a flat portion parallel to the board mount surface and serving as a welding margin, an inclined portion 21b continuous with the flat portion and inclined so as to approach the board mount surface as going away from the flat portion, and projecting portions 21a on lateral sides of the convex portion. By cutting along a cutting plane 23a, the anode terminal is formed so as to have a cut end surface, a fillet surface 24a, and a board mount surface as exposed surfaces.
摘要翻译：提供了一种具有增加的电极端子和外壳树脂之间的强度的面向下端子的固体电解电容器。面朝下端子固体电解电容器具有这样的结构，其中将固定到引线框架的引线框架和电容器元件用壳体树脂包覆成型的模具结构沿着分别通过阳极端子形成部分和阴极的切割平面切割端子形成部分，使阳极端子和阴极端子的端面露出。在引线框架中，阳极端子形成部分21和阴极端子形成部分22设置成彼此面对。阳极端子形成部分在板安装侧具有凹部21j和相反侧的凸部21t，它们通过使阳极端子形成部分的一部分在垂直于板安装表面的方向变形而形成。凹部用电镀施加。凸部具有平行于板安装表面并用作焊接边缘的平坦部分，与平坦部分连续的倾斜部分21b，并且倾斜以便远离平板部分接近板安装表面，并且突出在凸部的侧面上的部分21a。通过沿着切割平面23a切割，阳极端子形成为具有切割端面，圆角表面24a和作为露出表面的板安装表面。

2. 发明申请

US20060126273A1 Solid electrolytic capacitor with face-down terminals, manufacturing method of the same, and lead frame for use therein 有权
公开(公告)号：US20060126273A1
公开(公告)日：2006-06-15
申请号：US11274400
申请日：2005-11-15
申请人： Masami Ishijima
发明人： Masami Ishijima
IPC分类号： H01G9/00
CPC分类号： H01G9/012 , H01G2/065 , H01G9/042 , H01G9/15
摘要： A face-down terminal solid electrolytic capacitor with the increased strength between electrode terminals and a casing resin is provided. The face-down terminal solid electrolytic capacitor has a structure where a mold structure in which a lead frame and capacitor elements fixed to the lead frame are overmolded with a casing resin is cut along cutting planes respectively passing through an anode terminal forming portion and a cathode terminal forming portion of the lead frame so that end surfaces of an anode terminal and a cathode terminal are exposed. In the lead frame, the anode terminal forming portion 21 and the cathode terminal forming portion 22 are provided so as to face each other. The anode terminal forming portion has a concave portion 21j on the board mount side and a convex portion 21t on the opposite side, which are formed by deforming part of the anode terminal forming portion in a direction perpendicular to a board mount surface. The concave portion is applied with plating. The convex portion has a flat portion parallel to the board mount surface and serving as a welding margin, an inclined portion 21b continuous with the flat portion and inclined so as to approach the board mount surface as going away from the flat portion, and projecting portions 21a on lateral sides of the convex portion. By cutting along a cutting plane 23a, the anode terminal is formed so as to have a cut end surface, a fillet surface 24a, and a board mount surface as exposed surfaces.

3. 发明申请

US20050146842A1 Chip type solid electrolytic capacitor having plated fillet surface and method of manufacturing the same 有权
标题翻译：具有电镀圆角面的片式固体电解电容器及其制造方法
公开(公告)号：US20050146842A1
公开(公告)日：2005-07-07
申请号：US11014020
申请日：2004-12-15
申请人： Satoshi Abe , Masami Ishijima
发明人： Satoshi Abe , Masami Ishijima
IPC分类号： H01G9/004 , H01G2/06 , H01G4/228 , H01G9/00 , H01G9/012 , H01G9/04 , H01G9/042 , H01G9/10 , H01G9/15
CPC分类号： H01G9/012 , H01G2/065 , H01G9/042 , H01G9/10 , H01G11/56 , Y02E60/13 , Y10T29/417
摘要： In a chip type solid electrolytic capacitor, an anode terminal is provided with an anode terminal lower surface exposed from a package lower surface and an anode terminal end surface adjacent to the anode terminal lower surface and exposed from a first package end surface. The cathode terminal is also provided with a cathode terminal lower surface and a cathode terminal end surface. The anode terminal end surface is provided with an anode terminal dent surface upwardly extending from the boundary with the anode terminal lower surface. The anode terminal dent surface is plated. The cathode terminal end surface is also provided with a cathode terminal dent surface which is plated.
摘要翻译：在片式固体电解电容器中，阳极端子设置有从封装下表面露出的阳极端子下表面和与阳极端子下表面相邻并暴露于第一封装端表面的阳极端子表面。阴极端子还具有阴极端子下表面和阴极端子端面。阳极端子表面设置有从阳极端子下表面的边界向上延伸的阳极端子凹陷表面。阳极端子凹坑表面被镀覆。阴极端子表面还设置有电镀的阴极端子凹坑表面。

4. 发明授权

US08614879B2 Solid electrolytic capacitor and its manufacturing method 有权
标题翻译：固体电解电容器及其制造方法
公开(公告)号：US08614879B2
公开(公告)日：2013-12-24
申请号：US13205329
申请日：2011-08-08
申请人： Masanori Takahashi , Satoshi Iwai , Masami Ishijima
发明人： Masanori Takahashi , Satoshi Iwai , Masami Ishijima
IPC分类号： H01G9/00
CPC分类号： H01G9/0036 , H01G9/025 , H01G9/028 , H01G9/15 , Y10T29/417
摘要： A solid electrolytic capacitor according to an aspect of the present invention includes an anode conductor including a porous valve metal body, a dielectric layer formed on a surface of the anode conductor, and a solid electrolyte layer including a conductive polymer layer formed on a surface of the dielectric layer, in which the solid electrolyte layer includes a first solid electrolyte layer formed on a surface of the dielectric layer, and a second solid electrolyte layer formed on a surface of the first solid electrolyte layer, and at least one continuous or discontinuous layer containing an amine compound exists between the first and second solid electrolyte layers, and inside the second solid electrolyte layer.
摘要翻译：根据本发明的一个方面的固体电解电容器包括：阳极导体，其包括多孔阀金属体，形成在阳极导体的表面上的电介质层和固体电解质层，所述固体电解质层包括形成在固体电解质层包括形成在电介质层的表面上的第一固体电解质层的电介质层和形成在第一固体电解质层的表面上的第二固体电解质层，以及至少一个连续或不连续层含有胺化合物存在于第一和第二固体电解质层之间以及第二固体电解质层的内部。

5. 发明授权

US06975503B2 Chip type solid electrolytic capacitor having plated fillet surface and method of manufacturing the same 有权
公开(公告)号：US06975503B2
公开(公告)日：2005-12-13
申请号：US11014020
申请日：2004-12-15
申请人： Satoshi Abe , Masami Ishijima
发明人： Satoshi Abe , Masami Ishijima
IPC分类号： H01G9/004 , H01G2/06 , H01G4/228 , H01G9/00 , H01G9/012 , H01G9/04 , H01G9/042 , H01G9/10 , H01G9/15
CPC分类号： H01G9/012 , H01G2/065 , H01G9/042 , H01G9/10 , H01G11/56 , Y02E60/13 , Y10T29/417
摘要： In a chip type solid electrolytic capacitor, an anode terminal is provided with an anode terminal lower surface exposed from a package lower surface and an anode terminal end surface adjacent to the anode terminal lower surface and exposed from a first package end surface. The cathode terminal is also provided with a cathode terminal lower surface and a cathode terminal end surface. The anode terminal end surface is provided with an anode terminal dent surface upwardly extending from the boundary with the anode terminal lower surface. The anode terminal dent surface is plated. The cathode terminal end surface is also provided with a cathode terminal dent surface which is plated.

6. 发明申请

US20120044615A1 SOLID ELECTROLYTIC CAPACITOR AND ITS MANUFACTURING METHOD 有权
标题翻译：固体电解电容器及其制造方法
公开(公告)号：US20120044615A1
公开(公告)日：2012-02-23
申请号：US13205329
申请日：2011-08-08
申请人： Masanori TAKAHASHI , Satoshi IWAI , Masami ISHIJIMA
发明人： Masanori TAKAHASHI , Satoshi IWAI , Masami ISHIJIMA
IPC分类号： H01G9/04 , H01G9/15
CPC分类号： H01G9/0036 , H01G9/025 , H01G9/028 , H01G9/15 , Y10T29/417
摘要： A solid electrolytic capacitor according to an aspect of the present invention includes an anode conductor including a porous valve metal body, a dielectric layer formed on a surface of the anode conductor, and a solid electrolyte layer including a conductive polymer layer formed on a surface of the dielectric layer, in which the solid electrolyte layer includes a first solid electrolyte layer formed on a surface of the dielectric layer, and a second solid electrolyte layer formed on a surface of the first solid electrolyte layer, and at least one continuous or discontinuous layer containing an amine compound exists between the first and second solid electrolyte layers, and inside the second solid electrolyte layer.
摘要翻译：根据本发明的一个方面的固体电解电容器包括：阳极导体，其包括多孔阀金属体，形成在阳极导体的表面上的电介质层和固体电解质层，所述固体电解质层包括形成在固体电解质层包括形成在电介质层的表面上的第一固体电解质层的电介质层和形成在第一固体电解质层的表面上的第二固体电解质层，以及至少一个连续或不连续层含有胺化合物存在于第一和第二固体电解质层之间以及第二固体电解质层的内部。

7. 发明申请

US20080106854A1 Lead frame, method of manufacturing a face-down terminal solid electrolytic capacitor using the lead frame, and face-down terminal solid electrolytic capacitor manufactured by the method 有权
标题翻译：引线框架，使用引线框架制造面朝下端子固体电解电容器的方法以及通过该方法制造的面朝下端子固体电解电容器
公开(公告)号：US20080106854A1
公开(公告)日：2008-05-08
申请号：US11593217
申请日：2006-11-06
申请人： Masami Ishijima
发明人： Masami Ishijima
IPC分类号： H01G9/012 , H01G2/02 , B29C65/00
CPC分类号： H01G9/012 , H01G2/065 , H01G9/10 , Y10T29/41 , Y10T29/417 , Y10T156/1052
摘要： In a lead frame for use in fabricating a face-down terminal solid electrolytic capacitor having a capacitor element an anode terminal, and a cathode terminal, a frame body has a connecting portion for being connected to the capacitor element. The connecting portion extends from a cathode terminal forming portion in a first direction to a position near an anode terminal forming portion. The anode terminal forming portion is connected to the frame body and used for forming the anode terminal. The cathode terminal forming portion is connected to the frame body and used for forming the cathode terminal. The anode terminal forming and the cathode terminal forming portions are spaced to each other in the first direction on a principal surface of the frame body.
摘要翻译：在用于制造具有电容器元件的阳极端子和阴极端子的面朝下端子固体电解电容器的引线框架中，框体具有用于连接到电容器元件的连接部分。连接部从第一方向的阴极端子形成部延伸到靠近阳极端子形成部的位置。阳极端子形成部分连接到框体并用于形成阳极端子。阴极端子形成部分连接到框体并用于形成阴极端子。阳极端子形成部分和阴极端子形成部分在框体的主表面上沿第一方向彼此间隔开。

8. 发明授权

US06903921B2 Chip-type solid electrolytic capacitor superior in productivity and reliability thereof 有权
标题翻译：片状固体电解电容器的生产率和可靠性优异
公开(公告)号：US06903921B2
公开(公告)日：2005-06-07
申请号：US10881823
申请日：2004-06-29
申请人： Masami Ishijima
发明人： Masami Ishijima
IPC分类号： H01G9/15 , H01G9/00 , H01G9/012 , H01G9/04
CPC分类号： H01G9/012 , Y10T29/417
摘要： In a chip-type solid electrolytic capacitor including a capacitor element, anode terminal and cathode terminal are electrically connected to the capacitor element. A casing resin covers the capacitor element and the anode and cathode terminals. Each of the anode and cathode terminals has a bottom mount surface to be mounted on a circuit board and an exposed surface substantially perpendicular to the bottom mount surface and exposed at a side surface of the casing resin. Each of the exposed surfaces is subjected to plating to have a plated portion.
摘要翻译：在包括电容器元件的芯片型固体电解电容器中，阳极端子和阴极端子电连接到电容器元件。壳体树脂覆盖电容器元件和阳极和阴极端子。阳极和阴极端子中的每一个具有安装在电路板上的底部安装表面和基本上垂直于底部安装表面的暴露表面并暴露在壳体树脂的侧表面处。每个暴露的表面经过电镀以具有电镀部分。

9. 发明申请

US20050002148A1 Chip-type solid electrolytic capacitor superior in productivity and reliability thereof 有权
公开(公告)号：US20050002148A1
公开(公告)日：2005-01-06
申请号：US10881823
申请日：2004-06-29
申请人： Masami Ishijima
发明人： Masami Ishijima
IPC分类号： H01G9/15 , H01G9/00 , H01G9/012 , H01G9/04 , H01G4/228
CPC分类号： H01G9/012 , Y10T29/417
摘要： In a chip-type solid electrolytic capacitor including a capacitor element, anode terminal and cathode terminal are electrically connected to the capacitor element. A casing resin covers the capacitor element and the anode and cathode terminals. Each of the anode and cathode terminals has a bottom mount surface to be mounted on a circuit board and an exposed surface substantially perpendicular to the bottom mount surface and exposed at a side surface of the casing resin. Each of the exposed surfaces is subjected to plating to have a plated portion.

10. 发明授权

US07542267B2 Lead frame, method of manufacturing a face-down terminal solid electrolytic capacitor using the lead frame, and face-down terminal solid electrolytic capacitor manufactured by the method 有权
标题翻译：引线框架，使用引线框架制造面朝下端子固体电解电容器的方法以及通过该方法制造的面朝下端子固体电解电容器
公开(公告)号：US07542267B2
公开(公告)日：2009-06-02
申请号：US11593217
申请日：2006-11-06
申请人： Masami Ishijima
发明人： Masami Ishijima
IPC分类号： H01G9/00
CPC分类号： H01G9/012 , H01G2/065 , H01G9/10 , Y10T29/41 , Y10T29/417 , Y10T156/1052
摘要： In a lead frame for use in fabricating a face-down terminal solid electrolytic capacitor having a capacitor element an anode terminal, and a cathode terminal, a frame body has a connecting portion for being connected to the capacitor element. The connecting portion extends from a cathode terminal forming portion in a first direction to a position near an anode terminal forming portion. The anode terminal forming portion is connected to the frame body and used for forming the anode terminal. The cathode terminal forming portion is connected to the frame body and used for forming the cathode terminal. The anode terminal forming and the cathode terminal forming portions are spaced to each other in the first direction on a principal surface of the frame body.
摘要翻译：在用于制造具有电容器元件的阳极端子和阴极端子的面朝下端子固体电解电容器的引线框架中，框体具有用于连接到电容器元件的连接部分。连接部从第一方向的阴极端子形成部延伸到靠近阳极端子形成部的位置。阳极端子形成部分连接到框体并用于形成阳极端子。阴极端子形成部分连接到框体并用于形成阴极端子。阳极端子形成部分和阴极端子形成部分在框体的主表面上沿第一方向彼此间隔开。

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