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1. 发明申请

US20120291922A1 SOLDER PASTE 审中-公开
标题翻译：焊膏
公开(公告)号：US20120291922A1
公开(公告)日：2012-11-22
申请号：US13514076
申请日：2010-12-06
申请人： Eiji Iwamura , Kazushi Gotoh , Fumio Ishiga , Takayasu Yoshioka , Masayoshi Utsuno , Atsuo Nakamura , Teruo Okochi , Masaki Sanji , Takuji Sukekawa , Kenshi Ikedo , Yoshiyuki Andoh , Takeshi Shirai , Kimiaki Mori , Rie Wada , Kensuke Nakanishi , Masami Aihara , Seishi Kumamoto
发明人： Eiji Iwamura , Kazushi Gotoh , Fumio Ishiga , Takayasu Yoshioka , Masayoshi Utsuno , Atsuo Nakamura , Teruo Okochi , Masaki Sanji , Takuji Sukekawa , Kenshi Ikedo , Yoshiyuki Andoh , Takeshi Shirai , Kimiaki Mori , Rie Wada , Kensuke Nakanishi , Masami Aihara , Seishi Kumamoto
IPC分类号： B23K35/363
CPC分类号： B23K35/3613 , B23K35/362 , C22C12/00 , C22C13/00 , H05K3/3484
摘要： A solder paste according to an aspect of the invention includes, within a flux, an activator that has a dibasic acid with a molecular weight of 250 or less, a monobasic acid with a molecular weight of 150 or greater and 300 or less, and a dibasic acid with a molecular weight of 300 or greater and 600 or less; and at least one resin additive selected from the group consisting of high-density polyethylenes and polypropylenes. The solder paste has the resin additive in an amount of 4% by weight or greater and 12% by weight or less when the total amount of the flux is taken as 100% by weight, and has a viscosity of 400 Pa·s or greater at 80° C.
摘要翻译：根据本发明的一个方面的焊膏在助焊剂中包括具有分子量为250或更小的二元酸，分子量为150以上且300以下的一元酸的活化剂，以及分子量为300以上且600以下的二元酸; 和至少一种选自高密度聚乙烯和聚丙烯的树脂添加剂。当焊剂的总量为100重量％时，焊膏的树脂添加量为4重量％以上，12重量％以下，粘度为400Pa·s以上在80℃

2. 发明申请

US20100252144A1 SOLDERING FLUX AND SOLDER PASTE COMPOSITION 审中-公开
标题翻译：焊接焊剂和焊膏组合物
公开(公告)号：US20100252144A1
公开(公告)日：2010-10-07
申请号：US12744597
申请日：2008-11-25
申请人： Shunsuke Ishikawa , Akira Shinozuka , Masami Aihara
发明人： Shunsuke Ishikawa , Akira Shinozuka , Masami Aihara
IPC分类号： B23K35/34 , B23K35/36
CPC分类号： B23K35/3613 , B23K35/0244 , B23K35/025 , B23K35/362 , B23K2101/36 , H05K3/3489
摘要： There is provided a soldering flux in which the volatilized amount in reflow is reduced to enable soldering with a smaller environmental load while suppressing the stickiness of the flux residue and ensuring a high reliability. A solder paste composition using the same is also provided. The soldering flux comprises a base resin, an activating agent, and a solvent, wherein the solvent comprises an oil component having an iodine value of 120 to 170. Preferably, the content of the oil component is 22 to 80% by weight relative to the whole flux. Also, the oil component preferably contains at least one of drying oil and semidrying oil, and more preferably contains one or more kinds selected from tung oil, poppy-seed oil, walnut oil, safflower oil, sunflower oil, and soy bean oil. The solder paste composition comprises the soldering flux described above and a solder alloy powder.
摘要翻译：提供了一种助焊剂，其中回流中的挥发量降低，能够以更小的环境负荷进行焊接，同时抑制助焊剂残留物的粘性并确保高可靠性。还提供了使用其的焊膏组合物。助焊剂包括基础树脂，活化剂和溶剂，其中溶剂包含碘值为120至170的油组分。优选地，油组分的含量相对于所述油分成分为22〜80重量％整体通量。此外，油成分优选含有干油和半干油中的至少一种，更优选含有选自桐油，罂粟籽油，胡桃油，红花油，向日葵油，大豆油中的一种或多种。焊膏组合物包含上述助焊剂和焊料合金粉末。

3. 发明申请

US20100064203A1 METHOD FOR MANAGING STORAGE APPARATUS, STORAGE APPARATUS AND STORAGE SYSTEM 审中-公开
标题翻译：管理存储设备，存储设备和存储系统的方法
公开(公告)号：US20100064203A1
公开(公告)日：2010-03-11
申请号：US12498532
申请日：2009-07-07
申请人： Masami Aihara
发明人： Masami Aihara
IPC分类号： G06F11/00
CPC分类号： G06F11/0775 , G06F11/0727
摘要： A method for managing a storage apparatus includes acquiring error information for each of physical addresses assigned to a logical address, and managing the error information for each of the physical addresses.
摘要翻译：用于管理存储装置的方法包括获取分配给逻辑地址的每个物理地址的错误信息，以及管理每个物理地址的错误信息。

4. 发明授权

US07567402B2 Storage device, control method thereof and program 失效
标题翻译：存储设备及其控制方法和程序
公开(公告)号：US07567402B2
公开(公告)日：2009-07-28
申请号：US11325669
申请日：2006-01-04
申请人： Masami Aihara
发明人： Masami Aihara
IPC分类号： G11B21/02
CPC分类号： G11B21/12
摘要： The storage device of the invention has a ramp mechanism which shakes out the head onto the disk medium, and causes the head to evacuate from the medium to hold it. The command queuing processing unit stores input/output commands into the command queue in the order of issuance by the host, and then, executes the commands in arrangement in the increasing order of the medium access time. Completion of commands is responded to the host in the order of completion of execution. The end of command is responded to the host in the order of end of execution. The emergency evacuation processing unit interrupts, upon receipt of an emergency evacuation command from the host during operation of the command queuing processing unit, operation of the command queuing processing unit and protects the head by causing the head to evacuate from the medium to the ramp mechanism.
摘要翻译：本发明的存储装置具有将头部摇动到盘介质上的斜坡机构，并使头从介质中排出以保持其。命令排队处理单元按照主机发布的顺序将输入/输出命令存储到命令队列中，然后按照媒体访问时间的增加顺序执行命令。按照完成执行的顺序对主机完成命令的响应。命令结束按照执行结束的顺序对主机进行响应。紧急疏散处理单元在命令排队处理单元的动作期间接收到来自主机的紧急撤离命令时，中断命令排队处理单元的动作，并通过使头部从介质排出到斜坡机构来保护头部。

5. 发明申请

US20080053572A1 Soldering flux and solder paste composition 审中-公开
标题翻译：焊剂和焊膏组成
公开(公告)号：US20080053572A1
公开(公告)日：2008-03-06
申请号：US11896691
申请日：2007-09-05
申请人： Masaki Sanji , Masayasu Yamamoto , Kensuke Nakanishi , Masami Aihara
发明人： Masaki Sanji , Masayasu Yamamoto , Kensuke Nakanishi , Masami Aihara
IPC分类号： B23K35/363
CPC分类号： B23K35/362 , B23K35/0244 , B23K35/025 , B23K35/3613
摘要： A soldering flux contains a base resin and an activating agent. The base resin contains a thermoplastic acrylic resin having a glass transition temperature of below −50° C. This enables to sufficiently suppress the occurrence of cracks in the flux residue after soldering, under the severe environment where the temperature difference is extremely large. The soldering flux has high reliability and excellent solderability, and is conventional with respect to the load against manufacturing cost and environment.
摘要翻译：助焊剂含有基础树脂和活化剂。基础树脂含有玻璃化转变温度低于-50℃的热塑性丙烯酸树脂。这样能够在温度差非常大的恶劣环境下充分抑制焊接后的焊剂残留物中的裂纹的发生。助焊剂具有高的可靠性和优异的可焊性，并且在制造成本和环境方面是常规的。

6. 发明申请

US20050259217A1 Optical switching device using holographic polymer dispersed liquid crystals 失效
公开(公告)号：US20050259217A1
公开(公告)日：2005-11-24
申请号：US10850714
申请日：2004-05-20
申请人： Jibing Lin , Suning Tang , Yuanji Tang , Masami Aihara
发明人： Jibing Lin , Suning Tang , Yuanji Tang , Masami Aihara
IPC分类号： G02F1/13 , G02F1/1334 , G02F1/13357 , G02F1/31
CPC分类号： G02F1/13342 , G02F1/133615 , G02F1/31 , G02F2203/06
摘要： A thin holographic optical switch used in a liquid crystal display device contains opposing transparent substrates transparent electrodes between the substrates and a diffraction grating between the electrodes. The diffraction grating contains regions of transparent polymerized photopolymers and cholesteric liquid crystal micro-droplets. Refractive indexes of the photopolymers and liquid crystal are substantially the same when the electrodes have the same potential. The holographic optical switch transmits broadband LED light when the potential difference between the electrodes is zero and is polarization independent. The holographic optical switch diffracts broadband LED light when the potential difference between the electrodes is non-zero and is polarization independent.

7. 发明授权

US06339751B1 Circuit design support apparatus and a method 失效
标题翻译：电路设计支持设备及方法
公开(公告)号：US06339751B1
公开(公告)日：2002-01-15
申请号：US09153910
申请日：1998-09-16
申请人： Naomi Takeda , Shozo Isobe , Yuichiro Matsuoka , Masami Aihara , Seiichi Nishio
发明人： Naomi Takeda , Shozo Isobe , Yuichiro Matsuoka , Masami Aihara , Seiichi Nishio
IPC分类号： G06F1750
CPC分类号： G06F17/5022
摘要： A circuit design support apparatus partially converts a description of a circuit model to simulate the circuit operation. A register signal replacement section replaces a register signal with a variable in a process related with the register signal of the description and inserts a declaration of the variable in the process instead of a declaration of the register signal in the description. A clock signal simplification section replaces a clock signal with a variable in a clock signal reference process of the description and unifies a clock signal update process to the clock signal reference process in the description.
摘要翻译：电路设计支持设备部分地转换电路模型的描述以模拟电路操作。寄存器信号替换部分用与描述的寄存器信号相关的处理中的变量替换寄存器信号，并且在描述中插入变量的声明而不是寄存器信号的声明。时钟信号简化部分用描述的时钟信号参考处理中的变量替换时钟信号，并将时钟信号更新处理与描述中的时钟信号参考处理相统一。

8. 发明授权

US08679263B2 Solder bonding structure and soldering flux 有权
标题翻译：焊接结构和焊剂
公开(公告)号：US08679263B2
公开(公告)日：2014-03-25
申请号：US12918169
申请日：2009-02-19
申请人： Masami Aihara
发明人： Masami Aihara
IPC分类号： B23K35/34
CPC分类号： B23K1/0016 , B23K35/0222 , B23K35/0244 , B23K35/025 , B23K35/36 , B23K35/3612 , B23K35/3613 , C21D2251/00 , H05K3/3442 , H05K3/3484 , H05K3/3489 , H05K2201/068 , Y02P10/212
摘要： Disclosed is a solder bonding structure which is capable of retaining sufficient solder bonding strength and ensuring high bonding reliability even in severe environments having an extremely large temperature difference. In the solder bonding structure, an electronic component 4 is mounted on a main surface 1a of a substrate having an electrode section 2 and an insulating film 3, and the electrode section 2 and the electronic component 4 are electrically bonded to each other through a solder section 5, and a flux residue 6 exuded from the solder section 5 is present between the electronic component 4 and the insulating film 3. The flux contains an acrylic resin, an activating agent, and a thixotropic agent having a hydroxyl group. The glass transition point of the acrylic resin is not higher than −40° C., or not lower than the softening temperature of the flux residue. The flux residue has a maximum value of 300×10−6/K or less of linear thermal expansion coefficient within a temperature range from −40° C. to the softening temperature of the flux residue.
摘要翻译：公开了一种能够保持足够的焊接接合强度并且即使在具有非常大的温度差的恶劣环境中也确保高的接合可靠性的焊接接合结构。在焊接结构中，电子部件4安装在具有电极部2和绝缘膜3的基板的主面1a上，电极部2和电子部件4通过焊料彼此电接合并且在电子部件4和绝缘膜3之间存在从焊料部5渗出的焊剂残渣6。焊剂含有丙烯酸树脂，活化剂和具有羟基的触变剂。丙烯酸树脂的玻璃化转变点不高于-40℃，或不低于焊剂残留物的软化温度。焊剂残留物在-40℃至焊剂残留物的软化温度范围内的线性热膨胀系数的最大值为300×10 -6 / K以下。

9. 发明申请

US20120291921A1 FLUX FOR SOLDER PASTE, AND SOLDER PASTE 审中-公开
标题翻译：焊膏，焊膏
公开(公告)号：US20120291921A1
公开(公告)日：2012-11-22
申请号：US13513880
申请日：2010-12-06
申请人： Eiji Iwamura , Kazushi Gotoh , Shinsuke Nagasaka , Takayasu Yoshioka , Masayoshi Utsuno , Atsuo Nakamura , Teruo Okochi , Masaki Sanji , Takuji Sukekawa , Kenshi Ikedo , Yoshiyuki Andoh , Takeshi Shirai , Kimiaki Mori , Rie Wada , Kensuke Nakanishi , Masami Aihara , Seishi Kumamoto
发明人： Eiji Iwamura , Kazushi Gotoh , Shinsuke Nagasaka , Takayasu Yoshioka , Masayoshi Utsuno , Atsuo Nakamura , Teruo Okochi , Masaki Sanji , Takuji Sukekawa , Kenshi Ikedo , Yoshiyuki Andoh , Takeshi Shirai , Kimiaki Mori , Rie Wada , Kensuke Nakanishi , Masami Aihara , Seishi Kumamoto
IPC分类号： B23K35/363
CPC分类号： B23K35/362 , B23K35/0222 , B23K35/0244 , B23K35/025 , B23K35/3613 , C22C13/00 , H05K3/3489
摘要： A flux for a solder paste according to an aspect of the invention includes an acrylic resin obtained by radically copolymerizing a (meth)acrylate having a C6-C15 alkyl group and a (meth)acrylate other than the above-mentioned (meth)acrylate; and rosins. The weight ratio of the acrylic resin is 0.5 or greater and 1.2 or less when the weight of the rosins is taken as 1, and the flux for a solder paste is fluidized by application of a shear force of 10 Pa or greater and 150 Pa or less.
摘要翻译：根据本发明的一个方面的用于焊膏的焊剂包括通过使具有C6-C15烷基的（甲基）丙烯酸酯和除上述（甲基）丙烯酸酯之外的（甲基）丙烯酸酯）自由基共聚得到的丙烯酸类树脂; 和松香。当松香的重量为1时，丙烯酸树脂的重量比为0.5以上且1.2以下，通过施加10Pa以上且150Pa以下的剪切力使焊膏的焊剂流动，或减。

10. 发明申请

US20090015135A1 LIGHT EMITTING DEVICE 审中-公开
标题翻译：发光装置
公开(公告)号：US20090015135A1
公开(公告)日：2009-01-15
申请号：US12211362
申请日：2008-09-16
申请人： Masami Aihara , Makio Naito , Hiroya Abe
发明人： Masami Aihara , Makio Naito , Hiroya Abe
IPC分类号： H01J1/62
CPC分类号： H01L33/502 , H01L33/501 , H01L33/644 , H01L2224/48091 , H01L2224/48247 , H01L2224/49107 , H01L2924/181 , H05B33/22 , H01L2924/00014 , H01L2924/00012
摘要： A semiconductor light emitting element which is primarily composed of GaN and which emits blue light is provided with a fluorescent layer, and the fluorescent layer includes fluorescent particles formed of a YAG fluorescent substance. By synthesis between yellow light emitted from the fluorescent particles and the blue light, white light is obtained. Fine particles, such as silica, adhere to the peripheries of the fluorescent particles forming the fluorescent layer, and between the particles, air layers are formed. The air layers each function as a heat insulating layer and can suppress an increase in temperature of the fine particles when an environmental temperature is increased. Hence, luminous efficiency of the fluorescent particles is not likely to vary, and the change in luminescent color can be suppressed.
摘要翻译：主要由GaN构成并发出蓝色光的半导体发光元件设置有荧光层，荧光层包括由YAG荧光物质形成的荧光粒子。通过在从荧光颗粒发射的黄色光和蓝色光之间合成，获得白光。诸如二氧化硅的细颗粒附着在形成荧光层的荧光颗粒的周围，并且在颗粒之间形成空气层。空气层各自用作绝热层，并且可以抑制当环境温度升高时细颗粒的温度升高。因此，荧光体的发光效率不可能变化，能够抑制发光色的变化。

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