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1. 发明授权

US07354484B2 Liquid processing apparatus and liquid processing method 失效
公开(公告)号：US07354484B2
公开(公告)日：2008-04-08
申请号：US11892429
申请日：2007-08-22
申请人： Takehiko Orii , Masahiro Mukoyama , Hiromitsu Nanba
发明人： Takehiko Orii , Masahiro Mukoyama , Hiromitsu Nanba
IPC分类号： B08B5/04 , B08B9/00 , B08B9/027 , B08B3/00
CPC分类号： H01L21/67051
摘要： A cleaning processing apparatus comprises a spin chuck for holding a wafer W, an under plate being positioned to face the back surface of the wafer W with a prescribed gap provided therebetween, a support member for supporting the under plate, and a nozzle hole formed to extended through the plate member and the support member. A chemical liquid, a pure water and a gas can be supplied into a nozzle hole through opening-closing valves, and the chemical liquid and the pure water remaining inside the nozzle hole can be sucked by a sucking device. A pure water remaining inside the nozzle hole is sucked and removed by using the sucking device after the processing of the wafer W with a pure water and, then, a gas is spurted onto the back surface of the wafer W.

2. 发明授权

US07063094B2 Substrate processing apparatus 有权
标题翻译：基板加工装置
公开(公告)号：US07063094B2
公开(公告)日：2006-06-20
申请号：US10223686
申请日：2002-08-20
申请人： Masaru Amai , Masahiro Mukoyama , Takayuki Toshima
发明人： Masaru Amai , Masahiro Mukoyama , Takayuki Toshima
IPC分类号： B08B9/02
CPC分类号： H01L21/67051 , B08B3/04 , Y10S134/902
摘要： A substrate processing apparatus includes a substrate processing part 46 for processing a substrate by a processing liquid and a processing-liquid recovery path 137 allowing of a passage of the processing liquid discharged from the substrate processing part 46. The processing-liquid recovery path 137 is provided with foreign substance removal lines 181, 182 including filters 200, 201 for removing an foreign substance from the processing liquid and cleaners 201, 211 for cleaning the filters 200, 201 respectively. With this constitution, it is possible to cancel the blocking of foreign substances in pipes etc. and also possible to lengthen the life span of the filters.
摘要翻译：基板处理装置包括用于通过处理液处理基板的基板处理部46和允许从基板处理部46排出的处理液的通过的处理液回收路径137。处理液回收路径137设置有异物去除管线181,182，其包括用于从处理液中除去异物的过滤器200,201以及分别用于清洁过滤器200,201的清洁器201,211。通过这种结构，可以消除管等中的异物的堵塞，并且也可以延长过滤器的使用寿命。

3. 发明授权

US07472713B2 Substrate processing apparatus 有权
标题翻译：基板加工装置
公开(公告)号：US07472713B2
公开(公告)日：2009-01-06
申请号：US11413150
申请日：2006-04-28
申请人： Masaru Amai , Masahiro Mukoyama , Takayuki Toshima
发明人： Masaru Amai , Masahiro Mukoyama , Takayuki Toshima
IPC分类号： B08B3/04
CPC分类号： H01L21/67051 , B08B3/04 , Y10S134/902
摘要： A substrate processing apparatus includes a substrate processing part 46 for processing a substrate by a processing liquid and a processing-liquid recovery path 137 allowing of a passage of the processing liquid discharged from the substrate processing part 46. The processing-liquid recovery path 137 is provided with foreign substance removal lines 181, 182 including filters 200, 201 for removing an foreign substance from the processing liquid and cleaners 201, 211 for cleaning the filters 200, 201 respectively. With this constitution, it is possible to cancel the blocking of foreign substances in pipes etc. and also possible to lengthen the life span of the filters.
摘要翻译：基板处理装置包括：基板处理部46，用于通过处理液处理基板;以及处理液回收路径137，允许从基板处理部46排出的处理液的通过。处理液回收路径137为设置有用于从处理液中除去异物的过滤器200,201以及分别清洗过滤器200,201的清洗器201,211的异物除去管线181,182。通过这种结构，可以消除管等中的异物的堵塞，并且也可以延长过滤器的使用寿命。

4. 发明授权

US07275553B2 Liquid processing apparatus and liquid processing method 有权
标题翻译：液体处理装置和液体处理方法
公开(公告)号：US07275553B2
公开(公告)日：2007-10-02
申请号：US10409615
申请日：2003-04-09
申请人： Takehiko Orii , Masahiro Mukoyama , Hiromitsu Nanba
发明人： Takehiko Orii , Masahiro Mukoyama , Hiromitsu Nanba
IPC分类号： B08B3/00 , B08B3/04 , C23C16/00
CPC分类号： H01L21/67051
摘要： A cleaning processing apparatus comprises a spin chuck for holding a wafer W, an under plate being positioned to face the back surface of the wafer W with a prescribed gap provided therebetween, a support member for supporting the under plate, and a nozzle hole formed to extended through the plate member and the support member. A chemical liquid, a pure water and a gas can be supplied into a nozzle hole through opening-closing valves, and the chemical liquid and the pure water remaining inside the nozzle hole can be sucked by a sucking device. A pure water remaining inside the nozzle hole is sucked and removed by using the sucking device after the processing of the wafer W with a pure water and, then, a gas is spurted onto the back surface of the wafer W.
摘要翻译：一种清洁处理装置，包括用于保持晶片W的旋转卡盘，设置在与晶片W的背面对置的底板，其间设有规定的间隙，支撑底板的支撑部件和形成为延伸穿过板构件和支撑构件。可以通过开闭阀将化学液体，纯水和气体供给到喷嘴孔中，并且可以通过吸引装置吸引残留在喷嘴孔内的化学液体和纯水。在用纯水处理晶片W之后，通过使用吸附装置吸引残留在喷嘴孔内的纯水，然后将气体喷射到晶片W的背面。

5. 发明申请

US20080006299A1 Liquid processing apparatus and liquid processing method 失效
标题翻译：液体处理装置和液体处理方法
公开(公告)号：US20080006299A1
公开(公告)日：2008-01-10
申请号：US11892429
申请日：2007-08-22
申请人： Takehiko ORII , Masahiro MUKOYAMA , Hiromitsu NANBA
发明人： Takehiko ORII , Masahiro MUKOYAMA , Hiromitsu NANBA
IPC分类号： B08B5/04 , C23G1/36
CPC分类号： H01L21/67051
摘要： A cleaning processing apparatus comprises a spin chuck for holding a wafer W, an under plate being positioned to face the back surface of the wafer W with a prescribed gap provided therebetween, a support member for supporting the under plate, and a nozzle hole formed to extended through the plate member and the support member. A chemical liquid, a pure water and a gas can be supplied into a nozzle hole through opening-closing valves, and the chemical liquid and the pure water remaining inside the nozzle hole can be sucked by a sucking device. A pure water remaining inside the nozzle hole is sucked and removed by using the sucking device after the processing of the wafer W with a pure water and, then, a gas is spurted onto the back surface of the wafer W.
摘要翻译：一种清洁处理装置，包括用于保持晶片W的旋转卡盘，设置在与晶片W的背面对置的底板，其间设有规定的间隙，支撑底板的支撑部件和形成为延伸穿过板构件和支撑构件。可以通过开闭阀将化学液体，纯水和气体供给到喷嘴孔中，并且可以通过吸引装置吸引残留在喷嘴孔内的化学液体和纯水。在用纯水处理晶片W之后，通过使用吸附装置吸引残留在喷嘴孔内的纯水，然后将气体喷射到晶片W的背面。

6. 发明申请

US20060196531A1 Substrate processing apparatus 有权
公开(公告)号：US20060196531A1
公开(公告)日：2006-09-07
申请号：US11413150
申请日：2006-04-28
申请人： Masaru Amai , Masahiro Mukoyama , Takayuki Toshima
发明人： Masaru Amai , Masahiro Mukoyama , Takayuki Toshima
IPC分类号： B08B3/00
CPC分类号： H01L21/67051 , B08B3/04 , Y10S134/902
摘要： A substrate processing apparatus includes a substrate processing part 46 for processing a substrate by a processing liquid and a processing-liquid recovery path 137 allowing of a passage of the processing liquid discharged from the substrate processing part 46. The processing-liquid recovery path 137 is provided with foreign substance removal lines 181, 182 including filters 200, 201 for removing an foreign substance from the processing liquid and cleaners 201, 211 for cleaning the filters 200, 201 respectively. With this constitution, it is possible to cancel the blocking of foreign substances in pipes etc. and also possible to lengthen the life span of the filters.

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