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1. 发明申请

US20050227073A1 Conductive electrolessly plated powder and method for making same 审中-公开
标题翻译：导电无电镀粉末及其制造方法
公开(公告)号：US20050227073A1
公开(公告)日：2005-10-13
申请号：US10820024
申请日：2004-04-08
申请人： Masaaki Oyamada , Shinji Abe , Akihiro Kawazoe
发明人： Masaaki Oyamada , Shinji Abe , Akihiro Kawazoe
IPC分类号： B22F1/02 , B22F9/24 , B32B15/02 , C23C18/16 , C23C18/18 , C23C18/36 , C23C18/44
CPC分类号： C23C18/44 , B22F1/025 , B22F9/24 , C23C18/1635 , C23C18/1831 , C23C18/1879 , C23C18/30 , C23C18/36 , Y10T428/2991 , Y10T428/2993 , Y10T428/2998
摘要： A conductive electroless plated powder includes core particles and a nickel film formed by an electroless plating process on the surface of each core particle, wherein crystal grain boundaries in the nickel film are primarily oriented in the direction of the thickness of the nickel film. An electroless gold plating film may be deposited on the nickel film as the top layer. The nickel film is formed by electroless plating using glycine or ethylenediamine as a complexing agent.
摘要翻译：导电性无电解电镀粉末包括芯颗粒和通过化学镀处理在每个芯颗粒的表面上形成的镍膜，其中镍膜中的晶粒边界主要沿镍膜厚度的方向取向。作为顶层，可以在镍膜上沉积化学镀金膜。通过使用甘氨酸或乙二胺作为络合剂的无电镀形成镍膜。

2. 发明授权

US08696946B2 Conductive powder, conductive material containing the same, and method for producing the same 有权
标题翻译：导电粉末，含有导电粉末的导电材料及其制造方法
公开(公告)号：US08696946B2
公开(公告)日：2014-04-15
申请号：US13988510
申请日：2011-11-21
申请人： Chihiro Matsumoto , Masaaki Oyamada
发明人： Chihiro Matsumoto , Masaaki Oyamada
IPC分类号： H01B1/02 , H01B1/22 , H01B5/00 , H01R11/01
CPC分类号： H01B1/02 , H01B1/026 , H01R13/03 , H01R13/2414
摘要： A conductive powder improving various performances as compared to conventional conductive powders is described. The conductive power includes conductive particles, each of which have a metal or alloy film formed on the surface of a core particle. The conductive particle has thereon protrusions protruding from the surface of the film. Each protrusion includes a particle chain including particles of the metal or alloy linked in a row. It is preferred that the metal or alloy is nickel or a nickel alloy. It is also preferred that the ratio of the total area of the exposed portions of the film to the projection area of the conductive particle is 60% or less.
摘要翻译：描述了与传统的导电粉末相比提高各种性能的导电粉末。导电功率包括导电颗粒，每个导电颗粒在芯颗粒的表面上形成有金属或合金膜。导电颗粒具有从膜的表面突出的突起。每个突起包括包括连续连接的金属或合金的颗粒的颗粒链。金属或合金优选为镍或镍合金。也优选膜的露出部分的总面积与导电性粒子的投影面积的比例为60％以下。

3. 发明申请

US20130256606A1 CONDUCTIVE POWDER, CONDUCTIVE MATERIAL CONTAINING THE SAME, AND METHOD FOR PRODUCING THE SAME 有权
标题翻译：导电性粉末，含有它们的导电材料及其制造方法
公开(公告)号：US20130256606A1
公开(公告)日：2013-10-03
申请号：US13988510
申请日：2011-11-21
申请人： Chihiro Matsumoto , Masaaki Oyamada
发明人： Chihiro Matsumoto , Masaaki Oyamada
IPC分类号： H01B1/02
CPC分类号： H01B1/02 , H01B1/026 , H01R13/03 , H01R13/2414
摘要： A conductive powder improving various performances as compared to conventional conductive powders is described. The conductive power includes conductive particles, each of which have a metal or alloy film formed on the surface of a core particle. The conductive particle has thereon protrusions protruding from the surface of the film. Each protrusion includes a particle chain including particles of the metal or alloy linked in a row. It is preferred that the metal or alloy is nickel or a nickel alloy. It is also preferred that the ratio of the total area of the exposed portions of the film to the projection area of the conductive particle is 60% or less.
摘要翻译：描述了与传统的导电粉末相比提高各种性能的导电粉末。导电功率包括导电颗粒，每个导电颗粒在芯颗粒的表面上形成有金属或合金膜。导电颗粒具有从膜的表面突出的突起。每个突起包括包括连续连接的金属或合金的颗粒的颗粒链。金属或合金优选为镍或镍合金。也优选膜的露出部分的总面积与导电性粒子的投影面积的比例为60％以下。

4. 发明申请

US20060073335A1 Conductive electrolessly plated powder and method for making same 审中-公开
标题翻译：导电无电镀粉末及其制造方法
公开(公告)号：US20060073335A1
公开(公告)日：2006-04-06
申请号：US11258173
申请日：2005-10-26
申请人： Masaaki Oyamada , Shinji Abe , Akihiro Kawazoe
发明人： Masaaki Oyamada , Shinji Abe , Akihiro Kawazoe
IPC分类号： B32B5/16 , B32B15/02
CPC分类号： C23C18/32 , B22F1/025 , B22F9/24 , C23C18/1635 , C23C18/1651 , C23C18/1889 , C23C18/208 , C23C18/285 , C23C18/30 , C23C18/36 , C23C18/42 , C23C18/44 , Y10T428/2991 , Y10T428/2993 , Y10T428/2998
摘要： A conductive electroless plated powder includes core particles and a nickel film formed by an electroless plating process on the surface of each core particle, wherein crystal grain boundaries are not recognized in the cross section in the direction of the thickness of the nickel film when observed with a scanning electron microscope at a magnification of up to 100,000. A method for making such a conductive electroless plated powder is also disclosed.
摘要翻译：导电性无电镀粉末包括芯颗粒和通过化学镀处理在每个芯颗粒的表面上形成的镍膜，其中当用镍膜观察时，在镍膜的厚度方向上的横截面中不能识别晶界，扫描电子显微镜放大至100,000。还公开了制造这种导电无电镀粉末的方法。

5. 发明申请

US20050227074A1 Conductive electrolessly plated powder and method for making same 审中-公开
标题翻译：导电无电镀粉末及其制造方法
公开(公告)号：US20050227074A1
公开(公告)日：2005-10-13
申请号：US10820025
申请日：2004-04-08
申请人： Masaaki Oyamada , Shinji Abe , Akihiro Kawazoe
发明人： Masaaki Oyamada , Shinji Abe , Akihiro Kawazoe
IPC分类号： B22F1/02 , B22F9/24 , B32B15/02 , C23C18/18 , C23C18/36 , C23C18/44
CPC分类号： C23C18/32 , B22F1/025 , B22F9/24 , C23C18/1635 , C23C18/1651 , C23C18/1889 , C23C18/208 , C23C18/285 , C23C18/30 , C23C18/36 , C23C18/42 , C23C18/44 , Y10T428/2991 , Y10T428/2993 , Y10T428/2998
摘要： A conductive electroless plated powder includes core particles and a nickel film formed by an electroless plating process on the surface of each core particle, wherein crystal grain boundaries are not recognized in the cross section in the direction of the thickness of the nickel film when observed with a scanning electron microscope at a magnification of up to 100,000. A method for making such a conductive electroless plated powder is also disclosed.
摘要翻译：导电性无电镀粉末包括芯颗粒和通过化学镀处理在每个芯颗粒的表面上形成的镍膜，其中当用镍膜观察时，在镍膜的厚度方向上的横截面中不能识别晶界，扫描电子显微镜放大至100,000。还公开了制造这种导电无电镀粉末的方法。

6. 发明授权

US06770369B1 Conductive electrolessly plated powder, its producing method, and conductive material containing the plated powder 有权
标题翻译：导电无电镀粉末，其制造方法和含有电镀粉末的导电材料
公开(公告)号：US06770369B1
公开(公告)日：2004-08-03
申请号：US09926060
申请日：2001-08-22
申请人： Masaaki Oyamada , Shinji Abe
发明人： Masaaki Oyamada , Shinji Abe
IPC分类号： B32B516
CPC分类号： H01R13/03 , B22F1/025 , C23C18/1635 , C23C18/1651 , C23C18/30 , C23C18/36 , C23C18/54 , Y10T428/2991 , Y10T428/2993 , Y10T428/2998
摘要： A conductive electrolessly plated powder used, for example, for bonding a small electrode of an electronic device, its producing method, and a conductive material containing the plated powder. Conventionally, there has been known, as conductive powders, metallic powders such as of nickel, carbon powders, and conductive plating powders the resin core particles of which are coated with a metal, e.g., nickel. However, there has been no conductive electrolessly plated powders having a good conductivity with respect to connection between conductive patterns having an oxide coating thereon or between electrodes and no methods for producing such powders industrially. The conductive electrolessly plated powder of the present invention consists of resin spherical core particles the average size of which is 1 to 20 &mgr;m and each of which has a nickel or nickel alloy coating formed by electroless plating. The coating includes small projections of 0.05 to 4 &mgr;m on its outermost layer and the coating is substantially continuous with the small projections. A method of producing such a powder is also disclosed.
摘要翻译：用于例如用于接合电子器件的小电极的导电无电镀粉末，其制造方法和含有电镀粉末的导电材料。通常，作为导电粉末已知有如镍，碳粉末和导电性电镀粉末的金属粉末，其树脂核心颗粒用金属例如镍涂覆。然而，没有关于在其上或电极之间具有氧化物涂层的导电图案之间的连接具有良好导电性的导电无电镀粉末，并且没有用于在工业上制造这种粉末的方法。本发明的导电无电镀粉末由平均粒径为1〜20μm的树脂球形核粒子组成，并且各自具有通过无电镀形成的镍或镍合金涂层。该涂层在其最外层上包括0.05至4μm的小突起，并且涂层与小突起基本连续。还公开了制备这种粉末的方法。

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