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1. 发明申请

US20120075026A1 PACKAGED DEVICE WITH ACOUSTIC RESONATOR AND ELECTRONIC CIRCUITRY AND METHOD OF MAKING THE SAME 有权
标题翻译：具有声学谐振器和电子电路的封装器件及其制造方法
公开(公告)号：US20120075026A1
公开(公告)日：2012-03-29
申请号：US12891039
申请日：2010-09-27
申请人： Richard C. RUBY , Martha K. SMALL
发明人： Richard C. RUBY , Martha K. SMALL
IPC分类号： H03L1/04 , H01L21/50 , H03H9/17
CPC分类号： H03H9/1014 , H01L23/10 , H01L2924/0002 , H03H9/0538 , H03L1/04 , H01L2924/00
摘要： A device includes: a base substrate having a bonding pad and a peripheral pad, the peripheral pad encompassing the bonding pad; an acoustic resonator on the base substrate; a cap substrate having a bonding pad seal and a peripheral pad seal, the bonding pad seal bonding around the perimeter of the bonding pad and the peripheral pad seal bonding with the peripheral pad to define a hermetically sealed volume between the cap substrate and the base substrate, the cap substrate having a through hole therein over the bonding pad providing access for a connection to the bonding pad; a low-resistivity material layer region disposed on a portion of a surface of the cap substrate disposed inside the hermetically sealed volume, the material layer region being isolated from the bonding pad seal; and electronic circuitry disposed in the material layer region and electrical connected with the acoustic resonator.
摘要翻译：一种器件包括：具有接合焊盘和外围焊盘的基底衬底，所述外围焊盘包围所述接合焊盘; 在基底基板上的声共振器; 具有接合焊盘密封件和外围焊盘密封件的盖衬底，所述接合焊盘密封件围绕所述接合焊盘的周边结合，并且所述外围焊盘密封件与所述外围焊盘接合，以限定所述盖基板和所述基板之间的气密密封体积所述盖基板在所述焊盘上方具有通孔，所述通孔提供用于与所述焊盘的连接的通路; 所述低电阻率材料层区域设置在所述盖衬底的设置在所述密封体内的表面的一部分上，所述材料层区域与所述焊盘密封件隔离; 以及设置在材料层区域中并与声谐振器电连接的电子电路。

2. 发明授权

US08232845B2 Packaged device with acoustic resonator and electronic circuitry and method of making the same 有权
标题翻译：具有声谐振器和电子电路的封装器件及其制造方法
公开(公告)号：US08232845B2
公开(公告)日：2012-07-31
申请号：US12891039
申请日：2010-09-27
申请人： Richard C. Ruby , Martha K. Small
发明人： Richard C. Ruby , Martha K. Small
IPC分类号： H03B1/00
CPC分类号： H03H9/1014 , H01L23/10 , H01L2924/0002 , H03H9/0538 , H03L1/04 , H01L2924/00
摘要： A device includes: a base substrate having a bonding pad and a peripheral pad, the peripheral pad encompassing the bonding pad; an acoustic resonator on the base substrate; a cap substrate having a bonding pad seal and a peripheral pad seal, the bonding pad seal bonding around the perimeter of the bonding pad and the peripheral pad seal bonding with the peripheral pad to define a hermetically sealed volume between the cap substrate and the base substrate, the cap substrate having a through hole therein over the bonding pad providing access for a connection to the bonding pad; a low-resistivity material layer region disposed on a portion of a surface of the cap substrate disposed inside the hermetically sealed volume, the material layer region being isolated from the bonding pad seal; and electronic circuitry disposed in the material layer region and electrical connected with the acoustic resonator.
摘要翻译：一种器件包括：具有接合焊盘和外围焊盘的基底衬底，所述外围焊盘包围所述接合焊盘; 在基底基板上的声共振器; 具有接合焊盘密封件和外围焊盘密封件的盖衬底，所述接合焊盘密封件围绕所述接合焊盘的周边结合，并且所述外围焊盘密封件与所述外围焊盘接合，以限定所述盖基板和所述基板之间的气密密封体积所述盖基板在所述焊盘上方具有通孔，所述通孔提供用于与所述焊盘的连接的通路; 所述低电阻率材料层区域设置在所述盖衬底的设置在所述密封体内的表面的一部分上，所述材料层区域与所述焊盘密封件隔离; 以及设置在材料层区域中并与声谐振器电连接的电子电路。

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