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    • 3. 发明授权
    • High speed network interface
    • 高速网络接口
    • US08968026B2
    • 2015-03-03
    • US13342929
    • 2012-01-03
    • Mark W. GailusStephen W. EllsworthPrescott B. Atkinson
    • Mark W. GailusStephen W. EllsworthPrescott B. Atkinson
    • H01R24/00H01R13/66H01R24/64H01R107/00H05K1/02
    • H01R13/6633H01R24/64H01R2107/00H05K1/0243H05K2201/09163H05K2201/10189H05K2201/10446
    • A network interface adapted for high speed networks. The interface includes isolation circuits with a transformer containing two primary coils and two secondary coils. A wire making up each primary coil may be twisted with a wire making up a secondary. These two coils may then be co-wound on a common core. The transformer may be connected to a common mode choke. The isolation circuit may be packaged such that the transformer and coil are in a line, with isolation circuits for a plurality of pairs arranged in parallel. The interface circuit may be packaged in a connector housing, which also may be adapted for high speed performance. The housing may receive multiple isolation circuits in parallel. The housing may also include a mating contact portion in which mating contacts for signal conductors of each pair are positioned along the same side of a cavity.
    • 适用于高速网络的网络接口。 该接口包括具有包含两个初级线圈和两个次级线圈的变压器的隔离电路。 构成每个初级线圈的线可以用组成二次线的线扭绞。 然后可以将这两个线圈共同缠绕在共同的芯上。 变压器可以连接到共模扼流圈。 隔离电路可以被封装成使得变压器和线圈处于一条直线上,并具有用于多个并联布置的隔离电路。 接口电路可以封装在连接器壳体中,该壳体也可适用于高速性能。 外壳可以并联接收多个隔离电路。 壳体还可以包括配合接触部分,其中每对信号导体的配合触点沿着空腔的同一侧定位。
    • 4. 发明申请
    • ELECTRICAL CONNECTOR HAVING IMPEDANCE MATCHED INTERMEDIATE CONNECTION POINTS
    • 具有阻抗匹配中间连接点的电气连接器
    • US20130130554A1
    • 2013-05-23
    • US13298869
    • 2011-11-17
    • Donald A. GirardMark W. GailusJerry ProulxEdward Gerald Marvin
    • Donald A. GirardMark W. GailusJerry ProulxEdward Gerald Marvin
    • H01R24/28
    • H01R13/6473H01R13/6587
    • An electrical wafer for electrically connecting to a printed circuit board. The electrical wafer includes an insulative housing and at least one signal conductor disposed in the insulative housing. The at least one signal conductor includes an intermediate portion having a connection point. The connection point includes first and second ends, at least one of which has a width greater than a portion of the at least one signal conductor outside the connection point. The insulative housing has at least one aperture exposing at least a portion of the connection point. A portion of the connection point may be punched out, and a passive circuit element may be placed within the at least one aperture and mounted to the connection point. Multiple electrical wafers may be coupled together by a stiffener and connected to a backplane connector.
    • 一种用于电连接到印刷电路板的电晶片。 电晶片包括绝缘壳体和布置在绝缘壳体中的至少一个信号导体。 所述至少一个信号导体包括具有连接点的中间部分。 连接点包括第一和第二端,其中至少一个具有大于连接点外部的至少一个信号导体的一部分的宽度。 绝缘壳体具有暴露连接点的至少一部分的至少一个孔。 连接点的一部分可以被冲压掉,并且无源电路元件可以放置在至少一个孔内并且被安装到连接点。 多个电晶片可以通过加强件耦合在一起并连接到背板连接器。
    • 5. 发明申请
    • HIGH DENSITY ELECTRICAL CONNECTOR AND PCB FOOTPRINT
    • 高密度电气连接器和PCB盖板
    • US20110212632A1
    • 2011-09-01
    • US13070324
    • 2011-03-23
    • Philip T. StokoeMark W. GailusHuilin RenDonald A. Girard, JR.
    • Philip T. StokoeMark W. GailusHuilin RenDonald A. Girard, JR.
    • H01R12/51H05K1/11H01R24/00
    • H01R12/721H01R13/6587
    • An interconnection system that includes a daughter card and backplane electrical connectors, each mounted to a printed circuit board at a connector footprint. The backplane connector has conductive elements with transition regions that allow the mating contact portions to be positioned on a uniform pitch while contact tail portions can be shaped to improve signal integrity or to provide a more compact and/or mechanically robust footprint. The conductive elements in both connectors are configured such that the contact tails of the ground conductors align from column to column, but the planar portions of the ground conductors in one column align with a pair of signal conductors in the other column, which improves mechanical and signal integrity. Mechanical integrity may be improved by forming the connector footprints with pads for the ground conductors that span multiple columns.
    • 一种互连系统,其包括子卡和背板电连接器,每个连接器以连接器占用面积安装到印刷电路板。 背板连接器具有导电元件,其具有过渡区域,其允许配合接触部分以均匀的间距定位,而接触尾部可被成形以改善信号完整性或提供更紧凑和/或机械坚固的覆盖区。 两个连接器中的导电元件构造成使得接地导体的接触尾部从列到列对准,但是一列中的接地导体的平面部分与另一列中的一对信号导体对准,这改善了机械和 信号完整性。 可以通过用跨接多列的接地导体的焊盘形成连接器覆盖区来改善机械完整性。
    • 8. 发明申请
    • HIGH FREQUENCY BROADSIDE-COUPLED ELECTRICAL CONNECTOR
    • 高频宽带连接电气连接器
    • US20090291593A1
    • 2009-11-26
    • US12533867
    • 2009-07-31
    • Prescott AtkinsonBrian KirkMark W. Gailus
    • Prescott AtkinsonBrian KirkMark W. Gailus
    • H01R13/648
    • H01R13/6461H01R12/585H01R12/724H01R12/735H01R13/504H01R13/514H01R13/6471H01R13/6477H01R13/658H01R13/6585H01R13/6587H01R13/6598H01R24/62H01R24/68
    • An improved broadside coupled, open pin field connector. The connector incorporates lossy material to selectively dampen resonance within pairs of conductive members connected to ground when the connector is mounted to a printed circuit board. The material may also decrease crosstalk and mode conversion. The lossy material is selectively positioned to substantially dampen resonances along pairs that may be connected to ground without unacceptably attenuating signals carried by other pairs. The lossy material may be selectively positioned near mating contact portions of the conductive members. Multiple techniques are described for selectively positioning the lossy material, including molding, inserting lossy members into a housing or coating surfaces of the connector housing. The lossy material alternatively may be positioned between broad sides of conductive members of a pair. By using material of relatively low loss, loss when the conductive members are used to carry signals is relatively low, but an appreciable attenuation of resonances is provided on pairs connected to ground. As a result, an overall improvement of signal to noise ratio is achieved.
    • 一个改进的宽边耦合,开放引脚现场连接器。 当连接器安装到印刷电路板上时,连接器包含有损耗材料以选择性地抑制连接到地面的成对的导电构件内的谐振。 该材料还可以减少串扰和模式转换。 选择性地定位有损耗材料以基本上抑制可能连接到地面的成对的谐振,而不会有不可接受地衰减由其他对承载的信号。 有损材料可以选择性地定位在导电构件的匹配接触部分附近。 描述了用于选择性地定位有损材料的多种技术,包括模制,将有损构件插入到连接器壳体的壳体或涂层表面中。 有损耗材料可替代地位于一对导电构件的宽侧之间。 通过使用相对较低损耗的材料,当导电构件用于承载信号时的损耗相对较低,但是在连接到地面的对上提供明显的谐振衰减。 结果,实现了信噪比的全面提高。