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    • 4. 发明申请
    • Dual light source machining method and system
    • 双光源加工方法和系统
    • US20050029240A1
    • 2005-02-10
    • US10914274
    • 2004-08-09
    • Mark DuganAli SaidPhilippe Bado
    • Mark DuganAli SaidPhilippe Bado
    • B23K26/06B23K26/42C03C23/00B23K26/14
    • C03C23/0025B23K26/0613B23K26/0619B23K26/0624B23K26/57B23K26/60B41M5/24
    • Disclosed herein is a system useful for machining a workpiece, and having a first light source to generate a first beam for application to a first portion of the workpiece and ablation thereof, a second light source to generate a second beam for application to a second portion of the workpiece and heating thereof, and a positioning apparatus to direct the first and second beams to the first and second portions of the workpiece, respectively. The first light source may include a machining laser, and the second light source include a softening laser. A method of machining the workpiece includes the steps of removing a first portion of the workpiece by directing the first beam to the workpiece wherein the first beam has an intensity sufficient to ablate material from the workpiece, and heating a second portion of the workpiece to a ductile state by directing the second beam to the workpiece.
    • 本文公开了一种用于加工工件的系统,并且具有第一光源以产生用于施加到工件的第一部分并消融的第一光束,第二光源以产生用于施加到第二部分的第二光束 以及定位装置,分别将第一和第二光束引导到工件的第一和第二部分。 第一光源可以包括加工激光器,并且第二光源包括软化激光器。 加工工件的方法包括以下步骤:通过将第一梁引导到工件来去除工件的第一部分,其中第一梁具有足以从工件烧蚀材料的强度,以及将工件的第二部分加热到 通过将第二光束引导到工件上的延性状态。