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    • 2. 发明授权
    • Cubic (zinc-blend) aluminum nitride and method of making same
    • 立方(锌 - 共混)氮化铝及其制造方法
    • US07074272B2
    • 2006-07-11
    • US10364811
    • 2003-02-10
    • Margarita P. ThompsonGregory W. Auner
    • Margarita P. ThompsonGregory W. Auner
    • C30B25/12C30B25/14
    • C30B23/02C30B29/403H01L29/2003H01L41/316Y10T117/10
    • Device quality, single crystal film of cubic zinc-blende aluminum nitride (AlN) is deposited on a cubic substrate, such as a silicon (100) wafer by plasma source molecular beam epitaxy (PSMBE). The metastable zinc-blende form of AlN is deposited on the substrate at a low temperature by a low energy plasma beam of high-energy activated aluminum ions and nitrogen ion species produced in a molecular beam epitaxy system by applying a pulsed d.c. power to a hollow cathode source. In this manner, films having a thickness of at least 800 Å were produced. The lattice parameter of as-deposited films was calculated to be approximately 4.373 Å which corresponds closely to the theoretical calculation (4.38 Å) for cubic zinc-blende AlN. An interfacial layer of silicon carbide, specifically the cubic 3C—SiC polytype, interposed between the epitaxial film of zinc-blende AlN and the Si(100) wafer provides a template for growth and a good lattice match. The epitaxial layer of zinc-blende AlN has been characterized for its physical and optical properties. As a result, experimental data confirmed that zinc-blende AlN is an indirect semiconductor and has a bandgap about 5.34 eV. Due to the extraordinary piezoelectric properties of zinc-blende AlN, an illustrative device embodiment is a surface acoustic wave (SAW) device comprising interdigitated electrodes deposited by conventional means on the surface of the epitaxial layer of zinc-blende AlN to convert an electrical signal to a surface acoustic wave and vice versa.
    • 通过等离子体源分子束外延(PSMBE)将器件质量的立方氮化锌(AlN)单晶膜沉积在诸如硅(100)晶片的立方体衬底上。 亚稳态的闪锌矿形式的AlN在低温下通过施加脉冲直流的分子束外延系统中产生的高能激活铝离子和氮离子种类的低能量等离子体束沉积在衬底上。 电源到空心阴极源。 以这种方式制备厚度至少为800的膜。 计算沉积膜的晶格参数约为4.373Å,这与立方zinc e e AlN的理论计算(4.38Å)相当。 插入在锌闪光体AlN的外延膜和Si(100)晶片之间的碳化硅界面层,特别是立方3C-SiC多型,提供了用于生长和良好晶格匹配的模板。 闪锌矿AlN的外延层的物理和光学性质已被表征。 结果,实验数据证实了闪锌矿AlN是间接的半导体,并具有约5.34eV的带隙。 由于锌闪光体AlN的非凡的压电性能,说明性的器件实施例是表面声波(SAW)器件,其包括通过常规方法在锌闪光体AlN的外延层的表面上沉积的叉指电极,以将电信号转换为 表面声波,反之亦然。
    • 3. 发明授权
    • Cubic (zinc-blende) aluminum nitride
    • 立方(闪锌矿)氮化铝
    • US06518637B1
    • 2003-02-11
    • US09544914
    • 2000-04-07
    • Margarita P. ThompsonGregory W. Auner
    • Margarita P. ThompsonGregory W. Auner
    • H01L2982
    • C30B23/02C30B29/403H01L29/2003H01L41/316Y10T117/10
    • Device quality, single crystal film of cubic zinc-blend aluminum nitride (AlN) is deposited on a cubic substrate, such as a silicon (100) wafer by plasma source molecular beam epitaxy (PSMBE). The metastable zinc-blend form of AlN is deposited on the substrate at a low temperature by a low energy plasma beam of high-energy activated aluminum ions and nitrogen ion species produced in a molecular beam epitaxy system by applying a pulsed d.c. power to a hollow cathode source. In this manner, films having a thickness of at least 800 Å were produced. The lattice parameter of as-deposited films was calculated to be approximately 4.373 Å which corresponds closely to the theoretical calculation (4.38 Å) for cubic zinc-blend AlN. An interfacial layer of silicon carbide, specifically the cubic 3C—SiC polytype, interposed between the epitaxial film of zinc-blend AlN and the Si(100) wafer provides a template for growth and a good lattice match. The epitaxial layer of zinc-blend AlN has been characterized for its physical and optical properties. As a result, experimental data confirmed that zinc-blend AlN is an indirect semiconductor and has a bandgap about 5.34 eV. Due to the extraordinary piezoelectric properties of zinc-blend AlN, an illustrative device embodiment is a surface acoustic wave (SAW) device comprising interdigitated electrodes deposited by conventional means on the surface of the epitaxial layer of zinc-blend AlN to convert an electrical signal to a surface acoustic wave and vice versa.
    • 通过等离子体源分子束外延(PSMBE)将器件质量的立方氮化锌(AlN)单晶膜沉积在诸如硅(100)晶片的立方体衬底上。 通过施加脉冲直流电压,在分子束外延系统中产生的高能激活铝离子和氮离子种类的低能量等离子体束,在低温下将AlN的亚稳态锌 - 锌混合物形式沉积在衬底上。 电源到空心阴极源。 以这种方式制备厚度至少为800的膜。 计算沉积膜的晶格参数约为4.373,这与立方zinc blend blend blend blend the the the the the the the。。。。。。。。。。。 介于锌 - 掺合AlN的外延膜和Si(100)晶片之间的碳化硅界面层,特别是立方3C-SiC多型,提供了用于生长和良好晶格匹配的模板。 锌掺杂AlN的外延层的特性在于其物理和光学性质。 结果,实验数据证实了锌掺杂AlN是间接的半导体,具有约5.34eV的带隙。 由于锌 - 掺混AlN的非凡的压电性能,说明性的器件实施例是表面声波(SAW)器件,其包括通过常规方法在锌 - 掺杂AlN的外延层的表面上沉积的叉指电极,以将电信号转换为 表面声波,反之亦然。