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    • 1. 发明授权
    • Method and device for manufacturing single crystals
    • 单晶制造方法及装置
    • US6036776A
    • 2000-03-14
    • US145083
    • 1998-09-01
    • Toshiro KotookaYoshiyuki ShimanukiMakoto Kamogawa
    • Toshiro KotookaYoshiyuki ShimanukiMakoto Kamogawa
    • C30B15/00C30B15/14C30B29/06H01L21/208C30B35/00
    • C30B15/14Y10T117/1068Y10T117/1072Y10T117/1076Y10T117/1088
    • This invention provides a single-crystal manufacturing device which can perform the lifting of single crystals at a high speed, allowing single crystals with uniform qualities along their axes can be obtained.The method for manufacturing single crystals according to this invention are achieved by using a single-crystal manufacturing device provided with a combination of a heat shield plate 1 and an after-cooler 21. The heat shield plate 1, the thickness of the lower portion of which is 2-6 times that of a conventional heat shield plate, surrounds the single crystal 7 being lifted. The after-cooler 21 covers the top surface of the rim 1a of the heat shield plate 1 and encompasses the single crystal 7 being lifted. The amount of cooling water supplied to the after-cooler 21 is slowly increased until the time the single crystal is lifted to a preset length, and then the amount of cooling water is kept constant. By this means, the temperature gradients of the single crystal in the region near the solid-liquid boundary can be increased, and the shape of the single crystal lifted can be easily kept unchanged. Furthermore, the lifting speed of the single crystal is kept constant from the top to the bottom of the crystal. Compared with conventional methods, the single-crystal lifting speed can be multiplied by a value of 1.3-2.2. Therefore, single crystals with uniform qualities along their axes can be obtained.
    • 本发明提供一种能够高速地进行单晶提升的单晶体制造装置,能够得到沿其轴的质量均匀的单晶。 根据本发明的单晶制造方法通过使用设置有隔热板1和后冷却器21的组合的单晶制造装置来实现。隔热板1的下部的厚度 是常规隔热板的2-6倍,围绕提升的单晶7。 后冷却器21覆盖隔热板1的边缘1a的上表面并且包围提升的单晶7。 向后冷却器21供给的冷却水的量缓缓增加,直到单晶提升到预定长度为止,然后冷却水的量保持恒定。 通过这种方式,可以增加固液界面附近的单晶的温度梯度,提高单晶的形状可以容易地保持不变。 此外,单晶的提升速度从晶体的顶部到底部保持恒定。 与常规方法相比,单晶提升速度可以乘以1.3-2.2的值。 因此,可以获得沿其轴线均匀质量的单晶。
    • 3. 发明授权
    • Method for fabricating a single-crystal semiconductor
    • 制造单晶半导体的方法
    • US5997635A
    • 1999-12-07
    • US10626
    • 1998-01-22
    • Toshimichi KubotaToshiro KotookaMakoto Kamogawa
    • Toshimichi KubotaToshiro KotookaMakoto Kamogawa
    • C30B15/14C30B15/22C30B29/06H01L21/208C30B15/18
    • C30B15/14Y10T117/1004Y10T117/1052Y10T117/1068Y10T117/1072Y10T117/1088
    • An apparatus and a method for fabricating a single-crystal semiconductor by means of CZ method are provided for improving the quality control through the modification of thermal cycle of a pulled single-crystal semiconductor. The apparatus includes a ring after heater which is capable of elevation. The method decreases a temperature gradient to smaller than 20.degree. C./cm, and preferably under 15.degree. C./cm, when the pulled single-crystal semiconductor is cooled from 1200.degree. C. to 1000.degree. C. The after heater therefore heats the single-crystal semiconductor where there is a temperature of 100-300.degree. C. lower than the range of 1200-1000.degree. C. A thermal shelter is provided to retain a temperature gradient of larger than 20.degree. C./cm when the single-crystal semiconductor is within the temperature range between the melting point and 1250.degree. C. The after heater and the shelter can be raised to an upper portion when polysilicon blocks are charged and a twisting step is carried out.
    • 提供了一种通过CZ方法制造单晶半导体的装置和方法,用于通过改变拉制单晶半导体的热循环来改善质量控制。 该装置包括能够升高的加热器后环。 当将拉制的单晶半导体从1200℃冷却至1000℃时,该方法将温度梯度降低到小于20℃/ cm,优选在15℃/ cm以下。因此加热器因此加热 单晶半导体,其温度为100-300℃,低于1200-1000℃的范围。提供热保护层以保持大于20℃/ cm的温度梯度,当单个 晶体半导体在熔点和1250℃之间的温度范围内。当多晶硅块被充电并且进行扭转步骤时,后加热器和遮蔽物可以升高到上部。