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1. 发明申请

WO1994024705A1 METAL SHEET PROCESSING METHOD AND LEAD FRAME PROCESSING METHOD, AND LEAD FRAME AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE 审中-公开
标题翻译：金属片处理方法和引线框架加工方法，以及引线框架和半导体器件制造方法和半导体器件
公开(公告)号：WO1994024705A1
公开(公告)日：1994-10-27
申请号：PCT/JP1994000550
申请日：1994-04-04
申请人： HITACHI CONSTRUCTION MACHINERY CO., LTD. , TADA, Nobuhiko , MIYANAGI, Naoki , SHIMOMURA, Yoshiaki , SAKURAI, Shigeyuki , NAGANO, Yoshinari
发明人： HITACHI CONSTRUCTION MACHINERY CO., LTD.
IPC分类号： H01L23/50
CPC分类号： B23K26/384 , B23K26/0619 , B23K26/067 , B23K26/18 , B23K26/382 , B23K26/40 , B23K2101/35 , B23K2103/50 , H01L21/4821 , H01L21/4828 , H01L2924/0002 , H05K3/027 , H05K3/061 , H05K3/202 , Y10T29/49121 , H01L2924/00
摘要： An object of this invention is to provide a metal sheet processing method and a lead frame processing method which are capable of processing a work to an excellent shape finely with a high dimensional accuracy without being influenced by heat input due to the irradiation of a laser beam. According to the present invention, a metal sheet (101) is coated at both surfaces thereof with photoresist films (1) first, and a laser beam (202) is then applied to the metal sheet (101) through the outer surface of the photoresist film (1) so as to form a plurality of discontinuous through bores (3) in rows with joint portions (6) as unprocessed portions left among the through bores (3). The opened portions (2) formed by the laser beam processing of the photoresist film (1) extend continuously to serve as an etching pattern. The surrounding wall portions (6) are then subjected to etching to remove the same and connect together the through bores (3) formed in rows, whereby clearances (303a) of a predetermined shape are formed. Instead of forming the through bores (3) and joint portions (6) in the metal sheet (101), the steps of forming non-through bores (51) in the metal sheet (101) with joint portions (52) left as unprocessed portions in their bottoms, and then subjecting the resultant product to etching may be taken.
摘要翻译：本发明的目的是提供一种金属片处理方法和引线框架加工方法，其能够以高尺寸精度精细地加工成优异的形状，而不受激光束照射引起的热输入的影响。根据本发明，首先在金属片（101）的两面涂覆有光致抗蚀剂膜（1），然后通过光致抗蚀剂的外表面向金属片（101）施加激光束（202）膜（1），以形成多个具有接合部分（6）的不连续贯通孔（3），作为未加工部分留在通孔（3）中。通过光致抗蚀剂膜（1）的激光束处理形成的开口部分（2）连续延伸以用作蚀刻图案。然后对周围的壁部（6）进行蚀刻以除去它们，并且将形成的通孔（3）连接在一起，由此形成预定形状的间隙（303a）。代替在金属板（101）中形成通孔（3）和接合部分（6），在金属板（101）中形成具有接合部分（52）的非贯通孔（51）的步骤作为未加工的其底部的部分，然后使所得产物进行蚀刻。

2. 发明申请

WO1994013015A1 LEAD FRAME MANUFACTURING METHOD 审中-公开
标题翻译：引导框架制造方法
公开(公告)号：WO1994013015A1
公开(公告)日：1994-06-09
申请号：PCT/JP1993001707
申请日：1993-11-22
申请人： HITACHI CONSTRUCTION MACHINERY CO., LTD. , TADA, Nobuhiko , MIYANAGI, Naoki , SHIMOMURA, Yoshiaki , SAKURAI, Shigeyuki , OKUMURA, Shinya , NAGANO, Yoshinari
发明人： HITACHI CONSTRUCTION MACHINERY CO., LTD.
IPC分类号： H01L23/50
CPC分类号： H01L21/4828 , B23K26/361 , H01L21/4821 , H01L23/49541 , H01L24/48 , H01L24/73 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/01039 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/1532 , H01L2924/181 , Y10T29/49121 , Y10T29/515 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599 , H01L2924/00
摘要： A method of manufacturing a lead frame (1) from a metal plate, wherein outer leads (4) of the lead frame (1) and outer portions (3b) of inner leads (3) are formed by etching metal plate (11). The inner portions (3a) of the inner leads are then laser beam machined with the connecting portions (7) left as they are so that the front end portions of the inner leads (3) are joined. A mechanical surface treatment and a chemical surface treatment are then conducted, and dross (10), spatters (9) and oxide film which are deposited or formed during the laser beam machining operation are thereby removed. The portions which are on the inner side of the inner leads (3), and which are connected to the terminals of a semiconductor device, are then plated with gold to form plated terminal portions (3A). The region excluding the region of the outer leads (4) is coated with a solder plating protecting film, and the outer leads (4) are solder plated. The connecting portions (7) left at the front ends of the inner leads (3) are then cut off by laser beam machining, and the inner leads (3) are thus separated from one another to form a final lead frame pattern. The solder plating protecting film is then removed, and the lead frame is washed and dried. This enables the occurrence of bend, which is ascribed to the thermal deformation of the lead frame during the laser beam machining operation, of the inner leads (3) within the plate surfaces to be prevented, and the manufacturing of lead frames to be done with a high precision. The invention can solve various problems with the laser beam machining.
摘要翻译：通过蚀刻金属板（11）形成从金属板制造引线框架（1）的方法，其中引线框架（1）的外引线（4）和内引线（3）的外部部分（3b）形成。然后，内引线的内部（3a）被激光加工，其中连接部分（7）保持原样，使得内引线（3）的前端部接合。然后进行机械表面处理和化学表面处理，由此去除在激光加工操作期间沉积或形成的浮渣（10），飞溅物（9）和氧化膜。然后，在内部引线（3）的内侧的与半导体器件的端子连接的部分用金镀以形成电镀端子部（3A）。除了外引线（4）的区域之外的区域涂覆有焊料保护膜，并且外引线（4）被焊接镀覆。然后通过激光束加工将留在内引线（3）前端的连接部分（7）切断，内引线（3）彼此分开形成最终引线框架图案。然后除去焊料保护膜，并将引线框架洗涤并干燥。这样可以防止在板表面内的引线框架在激光束加工操作期间的热变形引起的弯曲发生，并且制造用于精度高。本发明可以解决激光束加工的各种问题。

3. 发明申请

WO1996012300A1 DEVICE AND METHOD FOR MACHINING DAM BAR 审中-公开
标题翻译：用于加工AM棒的装置和方法
公开(公告)号：WO1996012300A1
公开(公告)日：1996-04-25
申请号：PCT/JP1995002064
申请日：1995-10-09
申请人： HITACHI CONSTRUCTION MACHINERY CO., LTD. , TADA, Nobuhiko , OGATA, Kojiro , MIYANAGI, Naoki , SHIMOMURA, Yoshiaki , SAKURAI, Shigeyuki , NAGANO, Yoshinari , OKUMURA, Shinya , MINOMOTO, Yasushi
发明人： HITACHI CONSTRUCTION MACHINERY CO., LTD.
IPC分类号： H01L23/50
CPC分类号： B23K26/0736 , B23K26/083 , B23K26/38 , H01L21/4842 , H01L2224/45144 , H01L2224/48091 , H05K13/0092 , H01L2924/00014 , H01L2924/00
摘要： A dam bar (5) is cut by detecting the arranging state of leads (3) with a photoelectric detector (41) and deciding the oscillating timing of pulsed laser light (13A) by processing the detecting signal of the detector (41), and then, relatively moving the axis (13C) of the laser light (13A) at a speed (V0) by means of a machining table (21) while the laser light (13A) is oscillated. At the time of cutting the dam bar (5), the spot (13B) of the laser light (13A) is formed across the width (W1) of the bar (5) by making the length of the spot (13B) two times or more longer than the width (W1) of the dam bar (5) by means of a beam length converter (11a) and width of the spot (13B) 1/2 or more wider than and 4/5 or more narrower than the length of the dam bar (5) by means of a beam width converter (11b), and then, making the length direction of the spot (13B) nearly coincident with that of the leads (3) by appropriately operating a beam rotating device (11c). Thus the cutting accuracy and cut shape of the dam bar (5) are improved.
摘要翻译：通过利用光电检测器（41）检测引线（3）的布置状态并通过处理检测器（41）的检测信号来确定脉冲激光（13A）的振荡定时来切断阻挡条（5），以及然后在激光（13A）振荡的同时通过加工台（21）使激光（13A）的轴线（13C）以速度（V0）相对移动。在切割堤坝（5）时，通过使点（13B）的长度两倍，在杆（5）的宽度（W1）上形成激光（13A）的点（13B）或更长于通过光束长度转换器（11a）的阻挡条（5）的宽度（W1），并且光斑（13B）的宽度比所述光斑长度转换器通过光束宽度转换器（11b）的阻挡条（5）的长度，然后通过适当地操作光束旋转装置（13）使光斑（13B）的长度方向与引线（3）的长度方向几乎一致 11C）。因此，堤坝（5）的切割精度和切割形状得到改善。

4. 发明申请

WO1995029035A1 LASER BEAM MACHINING APPARATUS AND LASER BEAM MACHINING METHOD AND DAM BAR MACHINING METHOD 审中-公开
标题翻译：激光束加工设备和激光束加工方法及AM棒加工方法
公开(公告)号：WO1995029035A1
公开(公告)日：1995-11-02
申请号：PCT/JP1995000674
申请日：1995-04-06
申请人： HITACHI CONSTRUCTION MACHINERY CO., LTD. , SHIMOMURA, Yoshiaki , MIYANAGI, Naoki , TADA, Nobuhiko , NAGANO, Yoshinari , OKUMURA, Shinya , SAKURAI, Shigeyuki
发明人： HITACHI CONSTRUCTION MACHINERY CO., LTD.
IPC分类号： B23K26/00
CPC分类号： B23K26/032 , B23K26/0648 , B23K26/0665
摘要： The detecting light is applied from a detecting light source (122) to a work (1), and the light reflected from the work is detected by a photodetector (126), and the light emitted from the plume produced due to the laser beam machining is also detected by the photodetector (126) at the same time. In a laser beam controller (26), a detection signal from the photodetector (126) is binarized and a rectangular wave signal TP is generated, and a triggering signal TP2 for the oscillation of a machining laser beam is generated on the basis of the rectangular wave signal TP. During this time, a signal generated due to the emission of light from the plume is eliminated in a gate circuit 245 on the basis of a gate signal GP generated by feeding back the triggering signal TP2, to generate a triggering signal TPG. By delaying the triggering signal TPG by a delay time TD, a triggering signal TP1 is generated, and a triggering signal TP2 is generated synchronously with this triggering signal TP1. This prevents unnecessary laser beam machining due to the light emitted during a laser beam machining.
摘要翻译：检测光从检测光源（122）施加到工件（1），并且由光检测器（126）检测从工件反射的光，并且由于激光束加工产生的从羽流发射的光也由光电检测器（126）同时检测。在激光束控制器（26）中，来自光电检测器（126）的检测信号被二值化，并且产生矩形波信号TP，并且基于矩形产生用于加工激光束的振荡的触发信号TP2 波信号TP。在此期间，基于通过反馈触发信号TP2产生的栅极信号GP，在门电路245中消除了由于来自羽流的光的发射而产生的信号，以产生触发信号TPG。通过将触发信号TPG延迟延迟时间TD，产生触发信号TP1，并且与该触发信号TP1同步地产生触发信号TP2。这防止了由激光束加工期间发射的光引起的不必要的激光束加工。

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