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1. 发明专利

JPH10135673A RADIATION SYSTEM FOR PRINTED CIRCUIT BOARD HAVING 800 MICRON FILM 失效
公开(公告)号：JPH10135673A
公开(公告)日：1998-05-22
申请号：JP29286097
申请日：1997-10-24
申请人： MECANISMOS AUX IND
发明人： ALBERTO ALAGONEZ CALETE
IPC分类号： H05K7/20 , H01L23/40 , H05K1/02
摘要： PROBLEM TO BE SOLVED: To radiate the heat generated from electronic components such as drivers or solid state relays by connecting these components to a power source printed circuit and making a Cu coated film of this circuit functioning as a radiator of the components. SOLUTION: In a service box, a power source printed circuit 11 has a mechanical and electrical support function for electronic components 14 and metal parts of the components contact with a Cu surface 20 of the printed circuit, functioning as a heat radiator. Thus the conventional radiator is not needed at all but the printed circuit 11 itself serves as a support for the electronic components 14 and electric connecting element and is used as a radiating element, intentionally utilizing the conduction power of conductive parts of the circuit 11.

2. 发明专利

JPH10135604A MANUFACTURE OF HYBRID PRINTED CIRCUITS WHOSE FILM THICKNESS IS 105-400 MICRON AND 17-105 MICRON 失效
公开(公告)号：JPH10135604A
公开(公告)日：1998-05-22
申请号：JP29080197
申请日：1997-10-23
申请人： MECANISMOS AUX IND
发明人： JOAN MARIA VIXADELA FELLER
IPC分类号： H05K1/00 , H05K1/02 , H05K3/06 , H05K3/10 , H05K3/42
摘要： PROBLEM TO BE SOLVED: To form a printed circuit at a time, by combining the etching process of a 35 micron surface with that of 400 micron surface, performing the processes continuously, and protecting the 35 micron film surface with ink, while the 400 micron film wiring is etched in a tunnel type etching equipment. SOLUTION: Programmed work (19) for forming holes is performed to a printed circuit. Graphite is deposited in previously formed holes (21). The cathode of a circuit is printed with ink (22). Electroplating with copper is performed (23). A positive circuit is protected with Sn/Pb alloy (29). The ink is cleaned (25). The single surface of a circuit of a 35 micron film is etched (12). The circuit of the 35 micron film is protected with ink (30). The other surface of a 400 micron film is etched (12). The ink is cleaned (25). The Sn/Pb is pickled (29). Solder masking work (17) between wirings is started by using a photosensitive screen.

3. 发明专利

JPH11320154A LASER WELDING METHOD FOR PIN JOINING ON PRINTED CIRCUIT BOARD 失效
公开(公告)号：JPH11320154A
公开(公告)日：1999-11-24
申请号：JP6603299
申请日：1999-03-12
申请人： MECANISMOS AUX IND
发明人： CUBERO PITEL JOSE ANTONIO
IPC分类号： B23K26/00 , B23K1/005 , B23K26/12 , B23K26/20 , B23K101/42 , H05K3/00 , H05K3/32 , H05K3/34 , H05K3/40
摘要： PROBLEM TO BE SOLVED: To form a metallurgically combined body through direct melting of a splicing metal without using a filler metal by accurately arranging a certain number of metal pieces in front of a laser head and controlling the power supply by means of the metal coating to be applied on a pin for soldering and the inert atmosphere. SOLUTION: This printed circuit board 26 formed with a board 24 and a copper ring is prepared and a pin 21 crosses it. A converging laser beam 19 is applied, for example, at the incident angle α of 30-40 degrees. Distance d is to adjust the melting amount of the short pin 21. The melting area of the short pin 21 should be superior to that of the copper ring 22 of the printed circuit board 26 in order to prevent the combined body from being damaged due to temperature change. The change range of d is experimentally set, for example, in the range of 0-5 mm. Normally, protective gas is used to avoid oxidation during welding.

4. 发明专利

JPH11330644A MECHANISM FOR PROTECTING FET WITH CONDUCTIVE LINES ON PRINTED CIRCUIT BOARD 失效
公开(公告)号：JPH11330644A
公开(公告)日：1999-11-30
申请号：JP4400199
申请日：1999-02-23
申请人： MECANISMOS AUX IND
发明人： LLOP TOUS JORDI , MESTIERI CLOTET ANTONINO , JOSEP LUIS PRANA BRAY
IPC分类号： H01L23/58 , H01H85/046 , H01L23/498 , H01L23/62 , H05K1/00 , H05K1/02
摘要： PROBLEM TO BE SOLVED: To provide a mechanism for preventing the possibility of a fire in the event of a short circuit with a little increase in cost. SOLUTION: A printed circuit board 10, having conductive lines 13, 14, 15 on the top face 11 of an insulation support 16, has a narrow line 15a at any one of the conductive lines 13-15, the range, height and thickness of the narrow line 15a are determined as a function of the maximum allowable current of the conductive line, more specifically, so that the conductive lines function as a fuse by themselves, without incorporating more elements in the conductive lines of the printed circuit board 10, and hence it is designed to narrow the conductive line 15 in part regarding its FET.

5. 发明专利

JPH09121089A ELECTRONIC PART INTEGRATION BODY IN SERVICE BOX 失效
公开(公告)号：JPH09121089A
公开(公告)日：1997-05-06
申请号：JP20613996
申请日：1996-08-05
申请人： MECANISMOS AUX IND
发明人： NOLLA MAGRINA FRANCESCO
IPC分类号： H05K5/00 , B60R16/02 , B60R16/023 , H05K1/00 , H05K1/02 , H05K1/14 , H05K1/18 , H05K3/34 , H05K3/36 , H05K5/02 , H05K7/10
摘要： PROBLEM TO BE SOLVED: To reduce the cost of a system as a whole by integrating electronic parts by using the combination of a power source circuit on a printed circuit board having a conductive section with a specific thickness and a mixed board with specific thickness which is incorporated with a signal circuit or electronic parts having a specific thickness. SOLUTION: Since all parts which are to be connected to each other in advance are connected to each other on one or more printed circuit boards, a signal circuit and a power source circuit can be integrated on the printed board. For example, electronic parts can be integrated on a 400-μm thick printed board, a mixed printed circuit board having a 105-μm thick layer on one surface and a 400-μm thick layer on the other surface, or a 35-μm thick printed circuit board connected to a 400-m thick printed board. In a general system in which the signal circuit or an electronic module 12 is integrated with the power source circuit, a switch 11 is connected to the module 12 through wiring in a service box 10 and a load 14 is scattered to various points from the switch 11 through the wiring.

6. 发明专利

JPH10224011A METHOD FOR MANUFACTURING PRINTED CIRCUIT 失效
公开(公告)号：JPH10224011A
公开(公告)日：1998-08-21
申请号：JP30293197
申请日：1997-11-05
申请人： MECANISMOS AUX IND
发明人： KROEBEL NIETO RODOLFO
IPC分类号： H05K3/00 , H05K3/06 , H05K3/20
摘要： PROBLEM TO BE SOLVED: To reduce the loss of a conductive surface generated by the manufacture of a circuit, to simplify the manufacture to improve the speed by performing a chemical cutting to the upper base part of a copper sheet and forming a path between lines, filling a dielectric material into the path between lines, and performing a chemical cutting to the lower base part newly. SOLUTION: A path between lines or a groove 13 is formed at an upper base part 11 of a copper sheet 10 by performing chemical, flat cutting. After the path between lines 13 is formed, injection molding is performed by a dielectric substance 14 such as dielectric or heat-insulating plastic on an entire surface, and the path between lines 13 is entirely filled with the dielectric material 14 except the support base part of the dielectric material 14. Then, the copper sheet 10 is rotated, a chemical flat cutting or a cutting is made to a position that is symmetrical to the path between lines or the groove 13 on a lower substrate 12, thus forming a wiring 15. This sort of formation effectively protects the path between lines 13 and at the same time can set the wall of the path between lines or the groove 13 nearly vertically.

7. 发明专利

JPH07122848A IMPROVEMENT OF METHOD OF MANUFACTURING SERVICE BOX AND ITS CONSTITUENT 失效
公开(公告)号：JPH07122848A
公开(公告)日：1995-05-12
申请号：JP16900994
申请日：1994-06-27
申请人： MECANISMOS AUX IND
发明人： JIYOSEFU MAA ARUTESU BARAANIYA , RODORUFUO KUROEBERU NIETO
IPC分类号： H05K5/00 , B23K35/26 , H05K1/03 , H05K3/28 , H05K3/34
摘要： PURPOSE: To improve the quality of a service box and the manufacturing method thereof itself, by improving the welding work in a printed circuit and the surface finishing of the printed circuit. CONSTITUTION: In the processing of the manufacturing and the welding of a printed circuit board, the special alloy in correspondence with the expression 95An-5Sb or 52Sn-45Pb-3Sb wherein the melting point is 183 deg.C or more is used. In the manufacturing process of the printed circuit board, the substrate, wherein the outer surface is glass and the inner surface is epoxy paper, is used. In the finishing process of the printed wiring board, the special varnish comprising waterproof/corrosion inhibitor for the liquid, which is dried by evaporation and has photosensitivity, is used.

8. 发明专利

ES1044594Y 未知
公开(公告)号：ES1044594Y
公开(公告)日：2000-09-16
申请号：ES9902921
申请日：1999-11-19
申请人： MECANISMOS AUX IND
发明人： ROSET ROVIRA JOSE MARIA
IPC分类号： H01R13/629 , H01R11/09

9. 发明专利

ES1044530Y 未知
公开(公告)号：ES1044530Y
公开(公告)日：2000-09-01
申请号：ES9902830
申请日：1999-11-10
申请人： MECANISMOS AUX IND
发明人： ROSET ROVIRA JOSE MARIA
IPC分类号： H01R13/42 , H01R13/436
摘要： The electric connector assembly is comprised of a body which is intended to house electric terminals associated to corresponding cables and an clement for locking said terminals. The locking element is coupled to the connector by sliding and forms part of one of the walls of the connector.

10. 发明专利

ES1044100Y 未知
公开(公告)号：ES1044100Y
公开(公告)日：2000-08-16
申请号：ES9902114
申请日：1999-08-06
申请人： MECANISMOS AUX IND
发明人： FERRER GIRO SANTIAGO
IPC分类号： H01R13/629 , H01R24/00 , H01R13/46

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