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    • 1. 发明授权
    • Gate electrodes for millimeter-wave operation and methods of fabrication
    • 用于毫米波操作的栅电极和制造方法
    • US08741715B2
    • 2014-06-03
    • US12432478
    • 2009-04-29
    • Marcia MooreSten Heikman
    • Marcia MooreSten Heikman
    • H01L21/336
    • H01L21/0272H01L21/28587H01L29/66462
    • A transistor device having a tiered gate electrode fabricated with methods using a triple layer resist structure. The triple layer resist stack is deposited on a semiconductor structure. An exposure pattern is written onto the resist stack using an e-beam writer, for example. The exposure dose is non-uniform across the device. Portions of the three resist layers are removed with a sequential development process, resulting in tiered resist structure. A conductive material is deposited to form the gate electrode. The resulting “Air-T” gate also has a three-tiered structure. The fabrication process is well-suited for the production of gates small enough for use in millimeter wave devices.
    • 具有使用三层抗蚀剂结构的方法制造的分层栅电极的晶体管器件。 三层抗蚀剂叠层沉积在半导体结构上。 例如,使用电子束写入器将曝光图案写入抗蚀剂叠层。 曝光剂量在整个装置上是不均匀的。 通过顺序显影处理去除三个抗蚀剂层的部分,产生分层的抗蚀剂结构。 沉积导电材料以形成栅电极。 所形成的“Air-T”门也具有三层结构。 制造工艺非常适合生产足够小以用于毫米波器件的门。