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1. 发明授权

US06545250B2 Method and apparatus for the laser machining of workpieces 有权
标题翻译：用于激光加工工件的方法和装置
公开(公告)号：US06545250B2
公开(公告)日：2003-04-08
申请号：US09748632
申请日：2000-12-22
申请人： Andreas Hartmann , Frank Kretzschmar , Annett Klotzbach , Lothar Morgenthal , Dieter Pollack , Thomas Schwarz
发明人： Andreas Hartmann , Frank Kretzschmar , Annett Klotzbach , Lothar Morgenthal , Dieter Pollack , Thomas Schwarz
IPC分类号： B23K2602
CPC分类号： B23K26/04 , B23K26/043
摘要： The invention relates to a method and an apparatus for the laser machining of workpieces, a laser beam being two-dimensionally positionable with the aid of a laser machining head with respect to a surface of a workpiece and it being intended for the machining of the workpiece to take place with predeterminable contours. According to the object, it is to be possible for the forming of the contours to be realized with high positional accuracy at low cost and with little effort. To achieve this object, the laser beam is correspondingly guided by means of a laser machining head, in which at least one two-dimensionally pivotable scanner mirror is accommodated. The scanner mirror or two scanner mirrors is/are connected to an electronic evaluation and control unit. Before the actual machining, a set-actual value comparison is carried out with respect to the position of the workpiece with at least one predetermined contour with respect to the laser machining head. For this purpose, a light beam of a light source is focused and directed via one or else two scanner mirror(s) onto the surface of the workpiece and deflected along at least one axis by pivoting at least one of the scanner mirrors. The light reflected from the workpiece surface passes via the scanner mirror or mirrors onto an optical detector and is focused onto the latter. Taking into account the respective pivoting angle of the scanner mirror(s), the measuring signals of this optical detector are fed to the electronic evaluation and control unit, so that the deflection of the laser beam can be controlled during the machining in dependence on the actual position of the contour ascertained in this way for the machining.
摘要翻译：本发明涉及一种用于激光加工工件的方法和装置，激光束借助于激光加工头相对于工件的表面二维定位，并且用于加工工件以可预定的轮廓进行。根据该目的，能够以低成本和小的努力以高位置精度实现轮廓的形成。为了实现该目的，激光束通过激光加工头被相应地引导，其中容纳至少一个二维可枢转的扫描镜。扫描仪镜或两个扫描镜与电子评估和控制单元连接。在实际加工之前，相对于具有相对于激光加工头的至少一个预定轮廓的工件的位置执行设定实际值比较。为此，光源的光束被聚焦并经由一个或另外两个扫描镜反射到工件的表面上并且通过使至少一个扫描镜反射而沿至少一个轴线偏转。从工件表面反射的光通过扫描镜或反射镜通过光学检测器并聚焦到光学检测器上。考虑到扫描器反射镜的各自的旋转角度，该光学检测器的测量信号被馈送到电子评估和控制单元，使得激光束的偏转可以在加工期间根据以这种方式确定的轮廓的实际位置用于加工。

2. 发明授权

US5925271A Laser beam shaping device and process including a rotating mirror 失效
标题翻译：激光束成形装置和工艺包括旋转镜
公开(公告)号：US5925271A
公开(公告)日：1999-07-20
申请号：US687570
申请日：1996-08-09
申请人： Dieter Pollack , Lothar Morgenthal , Rudiger Arnold Gnann
发明人： Dieter Pollack , Lothar Morgenthal , Rudiger Arnold Gnann
IPC分类号： B23K26/02 , B23K26/08 , B23K26/082 , C21D1/09 , G02B26/10 , G02B27/09 , B23K26/10
CPC分类号： G02B27/0933 , B23K26/02 , B23K26/08 , B23K26/082 , C21D1/09 , G02B26/10
摘要： The invention relates to a device for laser beam shaping, and in particular to a device for laser beam surface machining. The device includes at least one stationary beam-shaping mirror and at least one rotary mirror that is rotatably supported about a rotational axis and can be selectively driven for rotation. As viewed in the direction of propagation of the laser beam, the at least one static beam shaping mirror is disposed first, followed by the at least one rotary mirror. A perpendicular to a beam deflecting surface of the rotary mirror is inclined at a particular angle relative to the rotational axis by a tapered disc. The tapered disc is fastened to the side of the rotary mirror remote from the laser beam to provide the desired angle of inclination, and the beam deflecting surface of the rotary mirror may be made smooth. One of the stationary and rotary mirrors is configured so that the resulting outline of the beam on the surface to be treated includes an ellipse.
摘要翻译： PCT No.PCT / DE95 / 00167 Sec。 371日期：1996年8月9日 102（e）日期1996年8月9日PCT提交1995年2月8日PCT公布。公开号WO95 / 21720 PCT 日期1995年8月17日本发明涉及一种用于激光束成形的装置，特别涉及一种用于激光束表面加工的装置。该装置包括至少一个固定光束整形反射镜和至少一个旋转镜，该反射镜围绕旋转轴线可旋转地支撑并且可选择性地驱动以旋转。从激光束的传播方向观察，首先设置至少一个静态光束整形反射镜，随后设置至少一个旋转镜。垂直于旋转镜的光束偏转表面的垂直方向以锥形盘相对于旋转轴线以特定角度倾斜。锥形盘被紧固到远离激光束的旋转镜的侧面以提供所需的倾斜角度，并且可以使旋转镜的光束偏转表面平滑。固定镜和旋转镜中的一个被配置为使得待处理表面上的光束的所得轮廓包括椭圆。

3. 发明授权

US09522442B2 Method for the cutting machining of workpieces using a laser beam 有权
标题翻译：使用激光束切割加工工件的方法
公开(公告)号：US09522442B2
公开(公告)日：2016-12-20
申请号：US12988883
申请日：2009-05-28
申请人： Matthias Luetke , Lothar Morgenthal , Thomas Himmer , Eckhard Beyer
发明人： Matthias Luetke , Lothar Morgenthal , Thomas Himmer , Eckhard Beyer
IPC分类号： B23K26/00 , B23K26/08 , B23K26/40
CPC分类号： B23K26/402 , B23K2103/40 , B23K2103/42 , B23K2103/50
摘要： A method is for cutting machining of a workpiece using a laser beam. The method includes (a) directing the focused laser beam onto a surface of the workpiece for a formation of a kerf; and (b) removing a material exclusively by ablation. The laser beam has a power density in a focal point of at least 1*107 W/cm2. The laser beam has a feed speed taking account of an absorption capability of the material to be removed of at least 150 m/min up to a maximum of 1200 m/min.
摘要翻译：一种用于使用激光束切割加工工件的方法。该方法包括（a）将聚焦的激光束引导到工件的表面上以形成切口; 和（b）仅通过消融去除材料。激光束的焦点功率密度至少为1×10 7 W / cm 2。激光束的进给速度考虑到要去除的材料的吸收能力至少为150m / min，最高达1200m / min。

4. 发明申请

US20080190903A1 Method For Machining Workpieces By Using Laser Radiation 审中-公开
标题翻译：使用激光辐射加工工件的方法
公开(公告)号：US20080190903A1
公开(公告)日：2008-08-14
申请号：US11813717
申请日：2006-01-12
申请人： Annett Klotzbach , Veiko Fleischer , Lothar Morgenthal
发明人： Annett Klotzbach , Veiko Fleischer , Lothar Morgenthal
IPC分类号： B23K26/08
CPC分类号： B23K26/0838 , B23K26/0823 , B23K26/0846 , B23K2101/16 , B23K2103/42 , B23K2103/50
摘要： The invention relates to a method for machining workpieces by using laser radiation, wherein the workpieces to be machined are moved during the machining and at least one laser beam is deflected with respect to two axes aligned orthogonally to one another. It is therefore the object of the invention to form large-area machining contours with as high a machining speed and as great an accuracy as possible. In the method in accordance with the invention, a procedure is followed that a laser beam is deflected within a working field with respect to two axes aligned orthogonally to one another. Positional coordinates of the respective machining contour are moreover associated in an electronic evaluation and control unit with virtual machining segments in which the machining is carried out sequentially. The borders of individual machining segments are predetermined so that the maximum spacing of mutually oppositely disposed borders of the respective machining segments does not exceed 50% of the maximum length of the working field for the laser beam in the feed direction of the moved workpiece.
摘要翻译：本发明涉及一种用于通过使用激光辐射加工工件的方法，其中待加工的工件在加工期间移动，并且至少一个激光束相对于彼此正交对准的两个轴线偏转。因此，本发明的目的是形成具有尽可能高的加工速度和高精度的大面积加工轮廓。在根据本发明的方法中，遵循的过程是激光束相对于彼此正交排列的两个轴在工作场内偏转。此外，相应的加工轮廓的位置坐标与具有虚拟加工段的电子评估和控制单元相关联，其中依次进行加工。单个加工段的边界是预定的，使得相应加工段的相互相对设置的边界的最大间距不超过激光束在移动的工件的进给方向上的工作场的最大长度的50％。

5. 发明授权

US5685999A Compact laser machining head with integrated on-line path control for laser machining of material 失效
标题翻译：紧凑型激光加工头，具有集成的在线路径控制，用于激光加工材料
公开(公告)号：US5685999A
公开(公告)日：1997-11-11
申请号：US531839
申请日：1995-09-21
申请人： Guenter Wiedemann , Dirk Grueneberg , Lothar Morgenthal , Walter Schwabe , Klaus Barthel , Ruediger Arnold Gnann
发明人： Guenter Wiedemann , Dirk Grueneberg , Lothar Morgenthal , Walter Schwabe , Klaus Barthel , Ruediger Arnold Gnann
IPC分类号： B23K26/04 , B23K26/08 , B23K26/14 , B23K26/142 , B23K26/00
CPC分类号： B23K26/032 , B23K26/04 , B23K26/043 , B23K26/0846 , B23K26/142 , B23K26/1462
摘要： A compact laser machining head is used for laser machining of material, in particular for laser-supported material machining methods for 2D and 3d laser machining. This laser machining head includes a sensor for geometry recognition and/or following contours, one or a plurality of mirrors and/or mirror systems with a mirror housing and mirror holder, a defined interface with the beam guidance system of the machine, and further required structural elements, connections and lines. In this compact laser machining head, the sensor is structurally completely integrated into the laser machining head, is seated, together with other auxiliary devices of the laser machining head tied to the working direction, rotatable around the rotary shaft of the sensor. The laser machining head contains a protocol memory and a comparator unit which are disposed and connected in such a way that the data of the sensor can be compared and evaluated, in parallel with the control of the machining process, with the data of the protocol memory in the comparator unit for the purpose of quality control and affecting the machining process.
摘要翻译：紧凑型激光加工头用于材料的激光加工，特别是用于2D和3D激光加工的激光辅助材料加工方法。该激光加工头包括用于几何识别和/或跟随轮廓的传感器，一个或多个反射镜和/或镜子系统，其具有反射镜壳体和反射镜保持器，与机器的光束引导系统的限定的界面，并且还需要结构元件，连接和线路。在这种紧凑的激光加工头中，传感器在结构上完全集成到激光加工头中，与激光加工头的其他辅助装置一起安置在激光加工头上，可以围绕传感器的旋转轴旋转。激光加工头包含协议存储器和比较器单元，其以这样的方式布置和连接，使得可以与加工过程的控制并行地与协议存储器的数据比较和评估传感器的数据在比较单元中进行质量控制并影响加工过程。

6. 发明申请

US20110155708A1 Method for the Cutting Machining of Workpieces Using a Laser Beam 有权
标题翻译：使用激光束切割加工工件的方法
公开(公告)号：US20110155708A1
公开(公告)日：2011-06-30
申请号：US12988883
申请日：2009-05-28
申请人： Matthias Luetke , Lothar Morgenthal , Thomas Himmer , Eckhard Beyer
发明人： Matthias Luetke , Lothar Morgenthal , Thomas Himmer , Eckhard Beyer
IPC分类号： B23K26/00
CPC分类号： B23K26/402 , B23K2103/40 , B23K2103/42 , B23K2103/50
摘要： A method is for cutting machining of a workpiece using a laser beam. The method includes (a) directing the focused laser beam onto a surface of the workpiece for a formation of a kerf; and (b) removing a material exclusively by ablation. The laser beam has a power density in a focal point of at least 1*107 W/cm2. The laser beam has a feed speed taking account of an absorption capability of the material to be removed of at least 150 m/min up to a maximum of 1200 m/min.
摘要翻译：一种用于使用激光束切割加工工件的方法。该方法包括（a）将聚焦的激光束引导到工件的表面上以形成切口; 和（b）仅通过消融去除材料。激光束的焦点功率密度至少为1×10 7 W / cm 2。激光束的进给速度考虑到要去除的材料的吸收能力至少为150m / min，最高达1200m / min。

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