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1. 发明授权

US07466880B2 Optical via to pass signals through a printed circuit board 有权
标题翻译：光通孔通过印刷电路板传递信号
公开(公告)号：US07466880B2
公开(公告)日：2008-12-16
申请号：US11779116
申请日：2007-07-17
申请人： Lisa A. Windover
发明人： Lisa A. Windover
IPC分类号： G02B6/12
CPC分类号： H04B10/801 , G02B6/4214 , G02B6/43 , H05K1/0274
摘要： An optical via within a printed circuit board (PCB) to route optical signals from one level to another through the PCB. The optical signals entering the optical via from an optoelectronic device, or other source, may be routed by an optical waveguide to enter other optical vias to a destination for different purposes. The source of optical signals may be mounted to the PCB or it may be at a distance, with the optical signals being coupled to or away from the optical via by means of optical waveguides.
摘要翻译：印刷电路板（PCB）中的光通孔，用于通过PCB将光信号从一个层级传输到另一层。从光电子器件或其他源进入光通路的光信号可以由光波导路由，以进入用于不同目的的目的地的其他光学通孔。光信号源可以安装到PCB上，或者它可以在一定距离处，其中光信号通过光波导耦合到或远离光通孔。

2. 发明授权

US07092641B2 Method and apparatus for optical transmission of wavelength-encoded modulation formats 有权
标题翻译：用于波长编码调制格式的光传输的方法和装置
公开(公告)号：US07092641B2
公开(公告)日：2006-08-15
申请号：US10159493
申请日：2002-05-31
申请人： Lisa A. Windover
发明人： Lisa A. Windover
IPC分类号： H04B10/04
CPC分类号： H04B10/504 , H04B10/66 , H04J14/02
摘要： A system that transmits amplitude modulated data in a wavelength-encoded format and then uses a wavelength-sensitive receiver to convert the received optical signal back to the original amplitude modulated data. This system enables transmission of optical signals that are less sensitive to attenuation and attenuation changes. This system is applicable to data in digital, multilevel, or analog formats.
摘要翻译：以波长编码格式发送幅度调制数据，然后使用波长敏感接收机将接收的光信号转换回原始幅度调制数据的系统。该系统能够传输对衰减和衰减变化较不敏感的光信号。该系统适用于数字，多级或模拟格式的数据。

3. 发明授权

US07263248B2 Optical via to pass signals through a printed circuit board 有权
标题翻译：光通孔通过印刷电路板传递信号
公开(公告)号：US07263248B2
公开(公告)日：2007-08-28
申请号：US10365127
申请日：2003-02-11
申请人： Lisa A. Windover
发明人： Lisa A. Windover
IPC分类号： G02B6/12 , G02B6/00
CPC分类号： H04B10/801 , G02B6/4214 , G02B6/43 , H05K1/0274
摘要： An optical via within a printed circuit board (PCB) to route optical signals from one level to another through the PCB. The optical signals entering the optical via from an optoelectronic device, or other source, may be routed by an optical waveguide to enter other optical vias to a destination for different purposes. The source of optical signals may be mounted to the PCB or it may be at a distance, with the optical signals being coupled to or away from the optical via by means of optical waveguides.
摘要翻译：印刷电路板（PCB）中的光通孔，用于通过PCB将光信号从一个层级传输到另一层。从光电子器件或其他源进入光通路的光信号可以由光波导路由，以进入用于不同目的的目的地的其他光学通孔。光信号源可以安装到PCB上，或者它可以在一定距离处，其中光信号通过光波导耦合到或远离光通孔。

4. 发明授权

US07020362B2 Low cost optical interconnect for fiber optic system 失效
标题翻译：用于光纤系统的低成本光互连
公开(公告)号：US07020362B2
公开(公告)日：2006-03-28
申请号：US10635810
申请日：2003-08-05
申请人： Jonathan Simon , Lisa A. Windover , Steven A. Rosenau
发明人： Jonathan Simon , Lisa A. Windover , Steven A. Rosenau
IPC分类号： G02B6/26 , G02B6/42
CPC分类号： G02B6/3636 , G02B6/3652 , G02B6/3692 , G02B6/4249
摘要： A single channel optical interconnect for a fiber optic system includes a penetrator made of optically transmissive material and configured for insertion along the length of a plastic optical fiber for transferring light between the optical fiber and an optoelectronic device. A multiple channel optical interconnect uses a linear array of optoelectronic devices and corresponding optically transmissive penetrators. The penetrators may be pyramidal or conical bodies made of plastic or glass that are positioned above corresponding vertical cavity surface emitting lasers (VCSELs). The penetrators may also be etched directly into the substrates of bottom emitting VCSELs. The penetrators may have specially tailored side wall angles, or coatings, to facilitate coupling into the optical fibers and minimize back reflections into the VCSELs.
摘要翻译：用于光纤系统的单通道光学互连包括由光学透射材料制成的穿透器，并且被配置为沿着塑料光纤的长度插入以在光纤和光电子器件之间传送光。多通道光学互连使用光电子器件的线性阵列和相应的光学透射穿透器。穿透器可以是位于相应的垂直腔表面发射激光器（VCSEL）上方的由塑料或玻璃制成的金字塔形或圆锥形体。穿透器也可以直接蚀刻到底部发射VCSEL的衬底中。穿透器可以具有特别定制的侧壁角度或涂层，以便于耦合到光纤中并使到VCSEL的后反射最小化。

5. 发明授权

US06973105B2 Method and apparatus to enable adaptive equalization at high bandwidths when using single-mode VCSELs over multimode fibers 失效
标题翻译：在多模光纤上使用单模VCSEL时，可以实现高带宽自适应均衡的方法和装置
公开(公告)号：US06973105B2
公开(公告)日：2005-12-06
申请号：US10394840
申请日：2003-03-21
申请人： Lisa A. Windover
发明人： Lisa A. Windover
IPC分类号： G02B6/34 , H01S5/00 , H01S5/062 , H01S5/183 , H04B10/13 , H04B10/155 , H04B10/18 , H01S3/13
CPC分类号： H04B10/2581 , H01S5/005 , H01S5/0057 , H01S5/06216 , H01S5/183 , H01S2301/166 , H04B10/2543 , H04B10/503
摘要： A method and apparatus of using an input signal from a single-transverse mode vertical-cavity surface-emitting laser (VCSEL) with a multimode fiber (MMF) link to enable improved stabilization in time variation and improved modal dispersion of the output signal to facilitate the use of adaptive equalization techniques. The improvement results from using a conditioned launch of the input signal from the VCSEL into the MMF link. The increase in performance may be measured by the improved impulse response and an improved bandwidth-distance product of the MMF link.
摘要翻译：使用来自具有多模光纤（MMF）链路的单横模式垂直腔表面发射激光器（VCSEL）的输入信号的方法和装置能够改善时间变化的稳定性并改善输出信号的模态色散以便于使用自适应均衡技术。改进的结果是使用从VCSEL到MMF链接的输入信号的调节启动。性能的提高可以通过改进的脉冲响应和改进的MMF链路的带宽距离乘积来测量。

6. 发明授权

US06879032B2 Folded flex circuit interconnect having a grid array interface 有权
公开(公告)号：US06879032B2
公开(公告)日：2005-04-12
申请号：US10623304
申请日：2003-07-18
申请人： Steven A. Rosenau , Mohammed E. Ali , Brian E. Lemoff , Lisa A. Windover
发明人： Steven A. Rosenau , Mohammed E. Ali , Brian E. Lemoff , Lisa A. Windover
IPC分类号： H01L21/60 , G02B6/42 , H05K1/14 , H05K1/18 , H01L23/48
CPC分类号： G02B6/4201 , G02B6/4281 , G02B6/4283 , H01L2924/0002 , H05K1/141 , H05K1/147 , H05K1/189 , H05K2201/056 , H05K2201/10734 , H01L2924/00
摘要： A folded flex circuit interconnect increases a number of interconnection pads of a grid array interface available to accommodate high count outputs from distinct circuit elements. The circuit interconnect includes a substrate capable of being folded, a conductor layer adjacent to a surface of the substrate, and a pad array having an interconnection pad connected to the conductor layer at a first end of the circuit interconnect. The pad array is part of the grid array interface. An optics module includes the folded flex circuit interconnect and an optical unit. The folded flex circuit interconnect further includes an electrical interface at a second end that is connected to the conductor layer. The folded flex circuit interconnect connects to the optical unit using the electrical interface. The circuit interconnect connects the optical unit to a motherboard using the pad array at the first end.

7. 发明授权

US06870195B2 Array of discretely formed optical signal emitters for multi-channel communication 有权
标题翻译：用于多通道通信的离散形成的光信号发射器阵列
公开(公告)号：US06870195B2
公开(公告)日：2005-03-22
申请号：US10370853
申请日：2003-02-21
申请人： Brian E. Lemoff , Lisa A. Windover , Scott A. Corzine
发明人： Brian E. Lemoff , Lisa A. Windover , Scott A. Corzine
IPC分类号： G02B6/04 , G02B6/06 , G02B6/42 , H01L25/075 , H01L33/00 , H01S5/02 , H01S5/022 , H01S5/40 , H01S5/42
CPC分类号： H01S5/02284 , H01S5/005 , H01S5/02248 , H01S5/02276 , H01S5/423
摘要： An optical signal emitter for a multi-channel, wavelength division multiplexed (WDM) optical communication system is disclosed. This optical signal emitter does not require an optical multiplexer, or other device, to combine components of an optical signal. Semiconductor die attached to a substrate emit independent components of a multi-channel optical signal from emission apertures that are positioned offset from the center of the die toward an aperture corner of the die. This aperture corner may be shaped so that the apertures can be located closer to each other. The shaping of the die may include a photolithographic process, an etching process, a reactive ion etching process, or a combination thereof.
摘要翻译：公开了一种用于多通道波分复用（WDM）光通信系统的光信号发射器。该光信号发射器不需要光复用器或其他器件来组合光信号的组件。附接到基板的半导体管芯从发射孔发射多通道光信号的独立部件，该发射孔定位成偏离模具的中心朝向管芯的孔角。该孔角可以被成形为使得孔可以彼此更靠近地定位。裸片的成形可以包括光刻工艺，蚀刻工艺，反应离子蚀刻工艺或其组合。

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