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    • 3. 发明申请
    • STEREO VISION MEASUREMENT SYSTEM AND METHOD
    • 立体视觉测量系统和方法
    • US20150269723A1
    • 2015-09-24
    • US14662074
    • 2015-03-18
    • Lina KaramJinjin Li
    • Lina KaramJinjin Li
    • G06T7/00H04N13/02G06K9/46G01C11/04
    • G06T7/0004G06K9/00201G06K2209/40G06T7/0006G06T7/11G06T7/593G06T2207/10012G06T2207/30152H04N13/239H04N2013/0081
    • A method for automatic, stereo vision based, in-line solder ball height and substrate coplanarity inspection includes providing an imaging setup together with an imaging processor for reliable, in-line solder ball height measurement. The imaging set up includes a pair of cameras mounted at two opposing angles with ring lighting around each camera lens, which allows the capture of two images of an electronics package in parallel. The lighting generates features on solder balls located on a substrate of the electronics package, which are then used to determine height. Specifically, points with the same intensity on each solder ball surface are grouped, which allows for the formation of curves, also known as iso-contours, which are then matched between the two views. An optimized triangulation is then performed to determine the height of each one of the solder balls.
    • 一种基于自动立体视觉的在线焊球高度和基板共平面检查的方法包括与成像处理器一起提供成像装置,用于可靠的在线焊球高度测量。 该成像装置包括一对相机,以两个相对的角度安装,每个照相机镜头周围环形照明,这允许并行捕获电子包装的两个图像。 照明产生位于电子封装的基板上的焊球上的特征,然后将其用于确定高度。 具体来说,在每个焊球表面上具有相同强度的点被分组,这允许形成曲线,也称为等轮廓,然后在两个视图之间进行匹配。 然后进行优化的三角测量以确定每个焊球的高度。