专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20090267201A1 Vertical Transmission Structure 有权
标题翻译：垂直传动结构
公开(公告)号：US20090267201A1
公开(公告)日：2009-10-29
申请号：US12196529
申请日：2008-08-22
申请人： Edward Yi Chang , Wei-Cheng Wu , Ruey-Bing Hwang , Li-Han Hsu
发明人： Edward Yi Chang , Wei-Cheng Wu , Ruey-Bing Hwang , Li-Han Hsu
IPC分类号： H01L23/498 , H01P1/00
CPC分类号： H01P1/047 , H01L23/66 , H01L2223/6616 , H01L2223/6627 , H01L2924/0002 , H01L2924/09701 , H01L2924/19032 , H01L2924/19033 , H01L2924/3011 , H01P5/028 , H01L2924/00
摘要： A vertical transmission structure for high frequency transmission lines includes a conductive axial core and a conductive structure surrounding the conductive axial core. The vertical transmission structure is applied to a high-frequency flip chip package for reducing the possibility of underfill from coming in contact with the conductive axial core.
摘要翻译：用于高频传输线的垂直传输结构包括导电轴芯和围绕导电轴芯的导电结构。垂直传输结构被应用于高频倒装芯片封装，用于降低底部填充物与导电轴芯接触的可能性。

2. 发明申请

US20130092935A1 Probe Pad Design for 3DIC Package Yield Analysis 有权
标题翻译：探针垫设计用于3DIC封装产量分析
公开(公告)号：US20130092935A1
公开(公告)日：2013-04-18
申请号：US13272004
申请日：2011-10-12
申请人： Tzu-Yu Wang , Chen-Hua Yu , Shin-Puu Jeng , Shang-Yun Hou , Hsien-Pin Hu , Wei-Cheng Wu , Li-Han Hsu , Meng-Han Lee
发明人： Tzu-Yu Wang , Chen-Hua Yu , Shin-Puu Jeng , Shang-Yun Hou , Hsien-Pin Hu , Wei-Cheng Wu , Li-Han Hsu , Meng-Han Lee
IPC分类号： H01L23/58 , G01R31/26
CPC分类号： H01L22/32 , H01L23/3128 , H01L23/49822 , H01L23/49827 , H01L23/49833 , H01L23/5384 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/73 , H01L25/0655 , H01L2224/131 , H01L2224/13147 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/15192 , H01L2924/15311 , H01L2924/014 , H01L2924/00012 , H01L2924/00
摘要： An interposer includes a first surface on a first side of the interposer and a second surface on a second side of the interposer, wherein the first and the second sides are opposite sides. A first probe pad is disposed at the first surface. An electrical connector is disposed at the first surface, wherein the electrical connector is configured to be used for bonding. A through-via is disposed in the interposer. Front-side connections are disposed on the first side of the interposer, wherein the front-side connections electrically couple the through-via to the probe pad.
摘要翻译：插入器包括在插入件的第一侧上的第一表面和在插入件的第二侧上的第二表面，其中第一和第二侧是相对的两侧。第一探针垫设置在第一表面。电连接器设置在第一表面处，其中电连接器被配置为用于接合。通孔设置在插入器中。前侧连接设置在插入件的第一侧上，其中前侧连接将通孔电连接到探针垫。

3. 发明授权

US08169276B2 Vertical transmission line structure that includes bump elements for flip-chip mounting 有权
标题翻译：垂直传输线结构，包括用于倒装芯片安装的凸块
公开(公告)号：US08169276B2
公开(公告)日：2012-05-01
申请号：US13023235
申请日：2011-02-08
申请人： Edward Yi Chang , Wei-Cheng Wu , Ruey-Bing Hwang , Li-Han Hsu
发明人： Edward Yi Chang , Wei-Cheng Wu , Ruey-Bing Hwang , Li-Han Hsu
IPC分类号： H01P5/02
CPC分类号： H01P1/047 , H01L23/66 , H01L2223/6616 , H01L2223/6627 , H01L2924/0002 , H01L2924/09701 , H01L2924/19032 , H01L2924/19033 , H01L2924/3011 , H01P5/028 , H01L2924/00
摘要： A vertical transmission structure for high frequency transmission lines includes a conductive axial core and a conductive structure surrounding the conductive axial core. The vertical transmission structure is applied to a high-frequency flip chip package for reducing the possibility of underfill from coming in contact with the conductive axial core.
摘要翻译：用于高频传输线的垂直传输结构包括导电轴芯和围绕导电轴芯的导电结构。垂直传输结构被应用于高频倒装芯片封装，用于降低底部填充物与导电轴芯接触的可能性。

4. 发明申请

US20100252520A1 STORAGE RACK 审中-公开
标题翻译：储物架
公开(公告)号：US20100252520A1
公开(公告)日：2010-10-07
申请号：US12784458
申请日：2010-05-20
申请人： Li-Han HSU
发明人： Li-Han HSU
IPC分类号： A47B47/00 , A47B55/00
CPC分类号： A47B47/024 , F16B12/24
摘要： A storage system includes a rear frame, a plurality of divider panels, and a plurality of shelving supports. The divider panels include a first divider panel and a second divider panel, each divider panel having a front vertical bar and a rear vertical bar, each divider panel being removably connected to the rear frame adjacent the rear vertical bar. The shelving supports are coupled to the divider panel by hoop and prong couplings. A plurality of U-shaped connectors are provided in spaced apart manner along the front vertical bars and the rear vertical bars of each divider panel. Each shelving support has a perimeter that defines corners, with each corner of each shelving support fitted inside a U-shaped connector. Alternatively, loops are provided along the vertical bars of each divider panel, and prongs are provided at the corners of the shelving supports.
摘要翻译：存储系统包括后框架，多个分隔板和多个搁架支撑件。分隔板包括第一分隔板和第二分隔板，每个分隔板具有前垂直杆和后垂直杆，每个分隔板可相对于后垂直杆可拆卸地连接到后框架。搁架支架通过环形和插脚式联轴器联接到分隔板。多个U形连接器沿着每个分隔板的前垂直杆和后垂直杆以间隔开的方式设置。每个搁架支架具有定义拐角的周边，每个搁架支架的每个角都装配在U形连接器内。或者，沿着每个分隔板的垂直杆设置环，并且在搁架支撑件的角部设置插脚。

5. 发明申请

US20090314731A1 Storage rack 失效
标题翻译：存储架
公开(公告)号：US20090314731A1
公开(公告)日：2009-12-24
申请号：US12214871
申请日：2008-06-23
申请人： Li-Han Hsu
发明人： Li-Han Hsu
IPC分类号： A47B96/00
CPC分类号： A47B47/024 , F16B12/24
摘要： A storage system includes a rear frame, a plurality of divider panels, and a plurality of shelving panels. The divider panels include a first divider panel and a second divider panel, each divider panel having a front vertical bar and a rear vertical bar, each divider panel being removably connected to the rear frame adjacent the rear vertical bar. A plurality of U-shaped connectors are provided in spaced apart manner along the front vertical bars and the rear vertical bars of each divider panel. Each shelving panel has a four-sided configuration that defines four corners, with each corner of each shelving panel fitted inside a U-shaped connector.
摘要翻译：存储系统包括后框架，多个分隔板和多个搁板。分隔板包括第一分隔板和第二分隔板，每个分隔板具有前垂直杆和后垂直杆，每个分隔板可相对于后垂直杆可拆卸地连接到后框架。多个U形连接器沿着每个分隔板的前垂直杆和后垂直杆以间隔开的方式设置。每个搁板具有四面配置，其定义了四个角，每个搁板的每个角都安装在U形连接器内。

6. 外观设计

USD703468S1 Modular utility rack 有权
公开(公告)号：USD703468S1
公开(公告)日：2014-04-29
申请号：US29476444
申请日：2013-12-13
申请人： Edwin Ho , Li-Han Hsu
设计人： Edwin Ho , Li-Han Hsu

7. 发明授权

US08258606B2 High frequency flip chip package structure of polymer substrate 有权
标题翻译：高频倒装芯片封装结构的聚合物基板
公开(公告)号：US08258606B2
公开(公告)日：2012-09-04
申请号：US13085602
申请日：2011-04-13
申请人： Edward-yi Chang , Li-Han Hsu , Chee-Way Oh , Wei-Cheng Wu , Chin-te Wang
发明人： Edward-yi Chang , Li-Han Hsu , Chee-Way Oh , Wei-Cheng Wu , Chin-te Wang
IPC分类号： H01L23/50 , H01L29/40
CPC分类号： H01L23/66 , H01L21/563 , H01L23/49816 , H01L24/16 , H01L24/81 , H01L2223/6627 , H01L2224/16 , H01L2224/73204 , H01L2224/81192 , H01L2224/81203 , H01L2224/81444 , H01L2224/81895 , H01L2224/82203 , H01L2224/83102 , H01L2224/83104 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/01079 , H01L2924/15311 , H01L2924/19033 , H01L2224/0401
摘要： A high frequency flip chip package substrate of a polymer is a one-layer structure packaged by a high frequency flip chip package process to overcome the shortcomings of a conventional two-layer structure packaged by the high frequency flip chip package process. The conventional structure not only incurs additional insertion loss and return loss in its high frequency characteristic, but also brings out a reliability issue. Thus, the manufacturing process of a ceramic substrate in the conventional structure still has the disadvantages of a poor yield rate and a high cost.
摘要翻译：聚合物的高频倒装芯片封装衬底是通过高频倒装芯片封装工艺封装的单层结构，以克服通过高频倒装芯片封装工艺封装的常规双层结构的缺点。常规结构不仅在其高频特性中引起额外的插入损耗和回波损耗，而且带来可靠性问题。因此，传统结构中的陶瓷基板的制造工序仍然具有成品率低，成本高的缺点。

8. 发明申请

US20110121923A1 VERTICAL TRANSMISSION STRUCTURE 有权
标题翻译：垂直传动结构
公开(公告)号：US20110121923A1
公开(公告)日：2011-05-26
申请号：US13023235
申请日：2011-02-08
申请人： Edward Yi Chang , We-Cheng Wu , Ruey-Bing Hwang , Li-Han Hsu
发明人： Edward Yi Chang , We-Cheng Wu , Ruey-Bing Hwang , Li-Han Hsu
IPC分类号： H01P3/08
CPC分类号： H01P1/047 , H01L23/66 , H01L2223/6616 , H01L2223/6627 , H01L2924/0002 , H01L2924/09701 , H01L2924/19032 , H01L2924/19033 , H01L2924/3011 , H01P5/028 , H01L2924/00
摘要： A vertical transmission structure for high frequency transmission lines includes a conductive axial core and a conductive structure surrounding the conductive axial core. The vertical transmission structure is applied to a high-frequency flip chip package for reducing the possibility of underfill from coming in contact with the conductive axial core.
摘要翻译：用于高频传输线的垂直传输结构包括导电轴芯和围绕导电轴芯的导电结构。垂直传输结构被应用于高频倒装芯片封装，用于降低底部填充物与导电轴芯接触的可能性。

9. 发明申请

US20100248430A1 High Frequency Flip Chip Package Process of Polymer Substrate and Structure thereof 有权
标题翻译：聚合物基板的高频倒装芯片封装工艺及其结构
公开(公告)号：US20100248430A1
公开(公告)日：2010-09-30
申请号：US12547575
申请日：2009-08-26
申请人： Edward-yi Chang , Li-Han Hsu , Chee-Way Oil , Wei-Cheng Wu , Chin-te Wang
发明人： Edward-yi Chang , Li-Han Hsu , Chee-Way Oil , Wei-Cheng Wu , Chin-te Wang
IPC分类号： H01L21/56
CPC分类号： H01L23/66 , H01L21/563 , H01L23/49816 , H01L24/16 , H01L24/81 , H01L2223/6627 , H01L2224/16 , H01L2224/73204 , H01L2224/81192 , H01L2224/81203 , H01L2224/81444 , H01L2224/81895 , H01L2224/82203 , H01L2224/83102 , H01L2224/83104 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/01079 , H01L2924/15311 , H01L2924/19033 , H01L2224/0401
摘要： In a high frequency flip chip package process of a polymer substrate and a structure thereof, the structure is a one-layer structure packaged by a high frequency flip chip package process to overcome the shortcomings of a conventional two-layer structure packaged by the high frequency flip chip package process. The conventional structure not only incurs additional insertion loss and return loss in its high frequency characteristic, but also brings out a reliability issue. Thus, the manufacturing process of a ceramic substrate in the conventional structure still has the disadvantages of a poor yield rate and a high cost.
摘要翻译：在聚合物基板的高频倒装芯片封装工艺及其结构中，该结构是通过高频倒装芯片封装工艺封装的单层结构，以克服由高频率封装的常规双层结构的缺点倒装芯片封装过程。常规结构不仅在其高频特性中引起额外的插入损耗和回波损耗，而且带来可靠性问题。因此，传统结构中的陶瓷基板的制造工序仍然具有成品率低，成本高的缺点。

10. 外观设计

USD703467S1 Modular utility rack 有权
公开(公告)号：USD703467S1
公开(公告)日：2014-04-29
申请号：US29476438
申请日：2013-12-13
申请人： Edwin Ho , Li-Han Hsu
设计人： Edwin Ho , Li-Han Hsu

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式