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1. 发明授权

US09508622B2 Method for protecting copper wire bonds on aluminum pads of a semiconductor device from corrosion 有权
标题翻译：用于保护半导体器件的铝焊盘上铜线接合的腐蚀的方法
公开(公告)号：US09508622B2
公开(公告)日：2016-11-29
申请号：US13096102
申请日：2011-04-28
申请人： Leo M. Higgins, III
发明人： Leo M. Higgins, III
IPC分类号： H01L23/29 , H01L23/31 , H01L23/00
CPC分类号： H01L24/49 , H01L21/56 , H01L23/295 , H01L23/3135 , H01L23/3192 , H01L23/562 , H01L24/05 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/02166 , H01L2224/04042 , H01L2224/05124 , H01L2224/05553 , H01L2224/05567 , H01L2224/05624 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48463 , H01L2224/48507 , H01L2224/48599 , H01L2224/48624 , H01L2224/48799 , H01L2224/48992 , H01L2224/49175 , H01L2224/85205 , H01L2224/85399 , H01L2224/854 , H01L2224/8592 , H01L2924/00014 , H01L2924/01001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01073 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/0549 , H01L2924/181 , H01L2924/186 , H01L2924/3025 , H01L2924/0001 , H01L2224/48824 , H01L2924/00 , H01L2224/05552 , H01L2924/2075 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/00015 , H01L2924/207
摘要： A semiconductor device and method for encapsulating the semiconductor device are provided. The method includes: forming a plurality of wire bonds on a surface of the semiconductor device by bonding each of a plurality of copper wires onto corresponding ones of a plurality of aluminum pads; applying a protective material around the plurality of wire bonds, the protective material having a first pH; and encapsulating at least a portion of the semiconductor device and the protective material with an encapsulating material having a second pH, wherein the first pH of the protective material is for neutralizing the second pH of the encapsulating material around the plurality of wire bonds.
摘要翻译：提供一种用于封装半导体器件的半导体器件和方法。该方法包括：通过将多根铜线中的每一根接合到多个铝焊盘中的相应的铝焊盘上，在半导体器件的表面上形成多个引线键合; 在所述多个引线接合周围施加保护材料，所述保护材料具有第一pH; 以及用具有第二pH的封装材料封装所述半导体器件和所述保护材料的至少一部分，其中所述保护材料的第一pH用于中和所述多个引线键周围的封装材料的第二pH。

2. 发明授权

US09224651B2 Method for plating a semiconductor package lead 有权
标题翻译：电镀半导体封装引线的方法
公开(公告)号：US09224651B2
公开(公告)日：2015-12-29
申请号：US14219094
申请日：2014-03-19
申请人： Leo M. Higgins, III
发明人： Leo M. Higgins, III
IPC分类号： H01L21/00 , H01L21/78 , H01L23/00 , H01L21/56 , H01L23/495 , H01L23/31
CPC分类号： H01L21/78 , H01L21/561 , H01L23/3107 , H01L23/49541 , H01L23/49582 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2224/16245 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/85444 , H01L2224/97 , H01L2924/00014 , H01L2924/12042 , H01L2924/181 , H01L2924/00012 , H01L2224/45099 , H01L2224/29099 , H01L2924/00
摘要： A method of forming a packaged semiconductor device includes loading an array of package sites in position for saw singulation, saw singulating the array of package sites, and performing a non-electrolytic plating operation on exposed lead tips of individual packages from the array of package sites as the array of package sites is saw singulated.
摘要翻译：一种形成封装半导体器件的方法包括将封装位置的阵列装载在锯切单元的位置上，锯切单元包装位置阵列，以及从封装位置阵列的各个封装的裸露引线尖端执行非电解电镀操作因为封装站点的数组被锯切。

3. 发明授权

US09059144B2 Method for forming die assembly with heat spreader 有权
标题翻译：用散热器成形模具组件的方法
公开(公告)号：US09059144B2
公开(公告)日：2015-06-16
申请号：US13403458
申请日：2012-02-23
申请人： Leo M. Higgins, III , Burton J. Carpenter , Glenn G. Daves
发明人： Leo M. Higgins, III , Burton J. Carpenter , Glenn G. Daves
IPC分类号： H01L23/34 , H01L23/433 , H01L21/56 , H01L23/31
CPC分类号： H01L23/4334 , H01L21/566 , H01L23/3128 , H01L24/73 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/48227 , H01L2224/48247 , H01L2224/73215 , H01L2224/73253 , H01L2224/73265 , H01L2924/15311 , H01L2924/1815 , H01L2924/00012 , H01L2924/00
摘要： A method for forming a molded die assembly includes attaching a first major surface of a semiconductor die onto a package substrate; attaching a heat spreader to a second major surface of the semiconductor die, wherein the second major surface is opposite the first major surface, and wherein the semiconductor die, package substrate, and heat spreader form a die assembly; conforming a die release film to a transfer mold; closing the transfer mold around the die assembly such that the die release film is compressed against the heat spreader and a cavity is formed around the die assembly; transferring a thermoset material into the cavity; and releasing the die assembly from the die release film and the transfer mold.
摘要翻译：一种用于形成模制模具组件的方法包括将半导体管芯的第一主表面附接到封装衬底上; 将散热器附接到所述半导体管芯的第二主表面，其中所述第二主表面与所述第一主表面相对，并且其中所述半导体管芯，封装衬底和散热器形成管芯组件; 将脱模膜贴合到转移模具上; 关闭模具组件周围的转移模具，使得脱模膜压靠散热器并且在模具组件周围形成空腔; 将热固性材料转移到空腔中; 以及从模具脱模膜和转移模具中释放模具组件。

4. 发明授权

US08754521B1 Semiconductor device assembly having a heat spreader 有权
标题翻译：具有散热器的半导体器件组件
公开(公告)号：US08754521B1
公开(公告)日：2014-06-17
申请号：US13799031
申请日：2013-03-13
申请人： Burton J. Carpenter , Leo M. Higgins, III , Yuan Yuan
发明人： Burton J. Carpenter , Leo M. Higgins, III , Yuan Yuan
IPC分类号： H01L23/34 , H01L21/56
CPC分类号： H01L21/565 , H01L23/433 , H01L2224/48091 , H01L2224/8592 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： A packaged semiconductor device includes a package substrate, a semiconductor die on the package substrate, an encapsulant over the semiconductor die and package substrate, and a heat spreader having a pedestal portion and an outer portion surrounding the pedestal portion. The encapsulant includes an opening within a perimeter of the semiconductor die. The bottom surface of the pedestal portion of the heat spreader faces the top surface of the semiconductor die, wherein a first portion of the opening and at least a portion of the encapsulant is between the bottom surface of the pedestal portion and the semiconductor die.
摘要翻译：封装半导体器件包括封装基板，封装基板上的半导体管芯，半导体管芯和封装基板上的密封剂，以及具有基座部分和围绕基座部分的外部部分的散热器。密封剂包括在半导体管芯的周边内的开口。散热器基座部分的底面朝向半导体管芯的顶表面，其中开口的第一部分和密封剂的至少一部分位于基座部分的底表面和半导体管芯之间。

5. 发明申请

US20130221511A1 METHOD FOR FORMING DIE ASSEMBLY WITH HEAT SPREADER 有权
标题翻译：用散热器成型的方法
公开(公告)号：US20130221511A1
公开(公告)日：2013-08-29
申请号：US13403458
申请日：2012-02-23
申请人： Leo M. Higgins, III , Burton J. Carpenter , Glenn G. Daves
发明人： Leo M. Higgins, III , Burton J. Carpenter , Glenn G. Daves
IPC分类号： H01L23/34 , H01L21/60
CPC分类号： H01L23/4334 , H01L21/566 , H01L23/3128 , H01L24/73 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/48227 , H01L2224/48247 , H01L2224/73215 , H01L2224/73253 , H01L2224/73265 , H01L2924/15311 , H01L2924/1815 , H01L2924/00012 , H01L2924/00
摘要： A method for forming a molded die assembly includes attaching a first major surface of a semiconductor die onto a package substrate; attaching a heat spreader to a second major surface of the semiconductor die, wherein the second major surface is opposite the first major surface, and wherein the semiconductor die, package substrate, and heat spreader form a die assembly; conforming a die release film to a transfer mold; closing the transfer mold around the die assembly such that the die release film is compressed against the heat spreader and a cavity is formed around the die assembly; transferring a thermoset material into the cavity; and releasing the die assembly from the die release film and the transfer mold.
摘要翻译：一种用于形成模制模具组件的方法包括将半导体管芯的第一主表面附接到封装衬底上; 将散热器附接到所述半导体管芯的第二主表面，其中所述第二主表面与所述第一主表面相对，并且其中所述半导体管芯，封装衬底和散热器形成管芯组件; 将脱模膜贴合到转移模具上; 关闭模具组件周围的转移模具，使得脱模膜压靠散热器并且在模具组件周围形成空腔; 将热固性材料转移到空腔中; 以及从模具脱模膜和转移模具中释放模具组件。

6. 发明申请

US20130037931A1 SEMICONDUCTOR PACKAGE WITH A HEAT SPREADER AND METHOD OF MAKING 审中-公开
标题翻译：带散热器的半导体封装及其制造方法
公开(公告)号：US20130037931A1
公开(公告)日：2013-02-14
申请号：US13205228
申请日：2011-08-08
申请人： LEO M. HIGGINS, III
发明人： LEO M. HIGGINS, III
IPC分类号： H01L21/56 , H01L23/34
CPC分类号： H01L23/4334 , H01L21/565 , H01L23/3121 , H01L2224/48091 , H01L2224/73265 , H01L2924/1815 , H01L2924/00014
摘要： An apparatus and method of forming a semiconductor package includes having and applying, respectively, a thermal interface material on a semiconductor die. The semiconductor die is included on a die assembly. The semiconductor die is installed in a heat spreader. The heat spreader is at least partially filled with mold compound and the semiconductor die is at least partially immersed in the mold compound once the die assembly is mounted on the heat spreader. The mold compound is then cured.
摘要翻译：形成半导体封装的装置和方法包括分别具有并分别应用于半导体管芯上的热界面材料。半导体管芯包括在管芯组件中。半导体管芯安装在散热器中。散热器至少部分地填充有模具化合物，并且一旦模具组件安装在散热器上，半导体模具至少部分地浸入模具化合物中。然后使模具化合物固化。

7. 发明申请

US20120273954A1 SEMICONDUCTOR DEVICE WITH PROTECTIVE MATERIAL AND METHOD FOR ENCAPSULATING 有权
标题翻译：具有保护材料的半导体器件和封装方法
公开(公告)号：US20120273954A1
公开(公告)日：2012-11-01
申请号：US13096102
申请日：2011-04-28
申请人： LEO M. HIGGINS, III
发明人： LEO M. HIGGINS, III
IPC分类号： H01L21/56 , H01L23/49
CPC分类号： H01L24/49 , H01L21/56 , H01L23/295 , H01L23/3135 , H01L23/3192 , H01L23/562 , H01L24/05 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/02166 , H01L2224/04042 , H01L2224/05124 , H01L2224/05553 , H01L2224/05567 , H01L2224/05624 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48463 , H01L2224/48507 , H01L2224/48599 , H01L2224/48624 , H01L2224/48799 , H01L2224/48992 , H01L2224/49175 , H01L2224/85205 , H01L2224/85399 , H01L2224/854 , H01L2224/8592 , H01L2924/00014 , H01L2924/01001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01073 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/0549 , H01L2924/181 , H01L2924/186 , H01L2924/3025 , H01L2924/0001 , H01L2224/48824 , H01L2924/00 , H01L2224/05552 , H01L2924/2075 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/00015 , H01L2924/207
摘要： A semiconductor device and method for encapsulating the semiconductor device are provided. The method includes: forming a plurality of wire bonds on a surface of the semiconductor device by bonding each of a plurality of copper wires onto corresponding ones of a plurality of aluminum pads; applying a protective material around the plurality of wire bonds, the protective material having a first pH; and encapsulating at least a portion of the semiconductor device and the protective material with an encapsulating material having a second pH, wherein the first pH of the protective material is for neutralizing the second pH of the encapsulating material around the plurality of wire bonds.
摘要翻译：提供一种用于封装半导体器件的半导体器件和方法。该方法包括：通过将多根铜线中的每一根接合到多个铝焊盘中的相应的铝焊盘上，在半导体器件的表面上形成多个引线键合; 在所述多个引线接合周围施加保护材料，所述保护材料具有第一pH; 以及用具有第二pH的封装材料封装所述半导体器件和所述保护材料的至少一部分，其中所述保护材料的第一pH用于中和所述多个引线键周围的封装材料的第二pH。

8. 发明授权

US5710071A Process for underfilling a flip-chip semiconductor device 失效
标题翻译：用于底部填充倒装芯片半导体器件的工艺
公开(公告)号：US5710071A
公开(公告)日：1998-01-20
申请号：US566754
申请日：1995-12-04
申请人： Stanley C. Beddingfield , Leo M. Higgins, III , John C. Gentile
发明人： Stanley C. Beddingfield , Leo M. Higgins, III , John C. Gentile
IPC分类号： H01L21/60 , H01L21/56
CPC分类号： H01L24/31 , H01L21/563 , H01L24/28 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2224/73257 , H01L2224/83102 , H01L2224/92125 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/15151 , H01L2924/15311 , H01L2924/15787
摘要： A flip-chip semiconductor device (70) is formed by mounting a semiconductor die (20) to a wiring substrate (30). The wiring substrate includes a hole (39). An underfill encapsulation material (52) is dispensed around an entire perimeter of the semiconductor die. The underfill encapsulation material then flows toward the center of the die, expelling any trapped air through hole (39) of the wiring substrate to avoid voiding. By providing a method which utilizes an entire perimeter dispense, manufacturing time of the underfilling step is significantly reduced. At the same time, a uniform fillet is formed and the formation of voids in the underfill encapsulation material is avoided due to the presence of hole (39) in the wiring substrate. Multiple die (100) can also be underfilled using a single dispensing operation in accordance with the invention.
摘要翻译：通过将半导体管芯（20）安装到布线基板（30）上而形成倒装芯片半导体器件（70）。布线基板包括孔（39）。在半导体管芯的整个周边上分配底部填充封装材料（52）。然后，底部填充封装材料朝向模具的中心流动，排出布线基板的任何被截留的空气通孔（39），以避免空隙。通过提供利用整个周边分配的方法，显着减少了底部填充步骤的制造时间。同时，形成均匀的圆角，并且由于布线基板中存在孔（39）而避免在底部填充封装材料中形成空隙。也可以使用根据本发明的单次分配操作来对多个模具（100）进行底部填充。

9. 发明授权

US5492863A Method for forming conductive bumps on a semiconductor device 失效
标题翻译：在半导体器件上形成导电凸块的方法
公开(公告)号：US5492863A
公开(公告)日：1996-02-20
申请号：US324824
申请日：1994-10-19
申请人： Leo M. Higgins, III
发明人： Leo M. Higgins, III
IPC分类号： H01L21/60 , H01L21/44
CPC分类号： H01L24/02 , H01L24/11 , H01L2224/0401 , H01L2224/114 , H01L2224/116 , H01L2224/13099 , H01L2224/45124 , H01L2224/45144 , H01L2224/73204 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/3025
摘要： Conductive bumps (24) are formed on a semiconductor device (10) by applying or depositing an imageable conductive layer (18) over the device and in contact with I/O pads of a final metallization layer (14). The imageable conductive material is formed of an imageable acrylic resin system filled with conductive particles. In one embodiment, a mask (20) having a pattern of transparent material (21) corresponding to the desired patterned of conductive bumps is used to expose the imageable conductive layer to radiation (23). The imageable conductive layer is then developed, thereby removing unexposed portions of the layer and leaving a plurality of conductive bumps (24) on the I/O pads of the device. Rather than using a negatively imaged conductive layer, a positive resin could be used in formulating the imageable conductive material.
摘要翻译：通过在该器件上施加或沉积可成像的导电层（18）并与最后的金属化层（14）的I / O焊盘接触，在半导体器件（10）上形成导电凸块（24）。可成像导电材料由填充有导电颗粒的可成像丙烯酸树脂体系形成。在一个实施例中，使用具有对应于所需图案化的导电凸块的透明材料（21）图案的掩模（20）将可成像的导电层暴露于辐射（23）。然后显影可成像的导电层，从而去除层的未曝光部分，并在器件的I / O焊盘上留下多个导电凸块（24）。不是使用负成像的导电层，而是可以使用正性树脂来配制可成像的导电材料。

10. 发明授权

US5434452A Z-axis compliant mechanical IC wiring substrate and method for making the same 失效
标题翻译： Z轴兼容机械IC布线基板及其制造方法
公开(公告)号：US5434452A
公开(公告)日：1995-07-18
申请号：US309570
申请日：1994-09-20
申请人： Leo M. Higgins, III
发明人： Leo M. Higgins, III
IPC分类号： H01L23/498 , H01L29/41
CPC分类号： H01L23/49827 , H01L2924/0002
摘要： A compliant integrated circuit (IC) wiring substrate (10) has an insulative carrier film (14) and a plurality of micro-beam conductors (12) in the carrier film. Each of the plurality of micro-beam conductors has a pair of contact bumps (16 and 18) connected to respective posts (22 and 24). A beam element (20) connects the pair of contact bumps and posts at opposing ends and opposing surfaces of the beam element. The plurality of micro-beam conductors extend through the thickness of the carrier film such that the pair of contact bumps protrude from the opposite surfaces of the carrier film. The compliance of the wiring substrate can be varied by varying locations of apertures in the insulative carrier film.
摘要翻译：兼容集成电路（IC）布线基板（10）在载体膜中具有绝缘载体膜（14）和多个微束导体（12）。多个微光束导体中的每一个具有连接到各个柱（22和24）的一对接触凸块（16和18）。梁元件（20）在梁元件的相对端和相对表面处连接一对接触凸块和柱。多个微束导体延伸穿过载体膜的厚度，使得该对接触凸块从载体膜的相对表面突出。布线基板的顺应性可以通过改变绝缘载体膜中的孔的位置来改变。

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