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2. 发明申请

WO2008098050A2 MODULAR LASER PACKAGE SYSTEM 审中-公开
标题翻译：模块激光包装系统
公开(公告)号：WO2008098050A2
公开(公告)日：2008-08-14
申请号：PCT/US2008053177
申请日：2008-02-06
申请人： APPLIED OPTOELECTRONICS INC , MURRY STEFAN J , MORBI ZULFIKAR , LIN KAI-SHENG
发明人： MURRY STEFAN J , MORBI ZULFIKAR , LIN KAI-SHENG
IPC分类号： G02B6/36
CPC分类号： G02B6/4201 , G02B6/4245 , G02B6/4271 , G02B6/4279 , G02B6/428
摘要： A modular laser package system may be used to mount one type of laser package, such as a coaxial or TO (transistor outline) can laser package, to a circuit board, such as a transmitter board or a motherboard, designed to receive another type of laser package housing, such as a butterfly-type laser package housing. The modular laser package system may include a circuit board mounting platform, a laser housing mount to mount the laser package to the circuit board mounting platform, and a mounting base to facilitate mounting to the transmitter board or motherboard. The modular laser package system may also include a temperature control device, such as a thermo-electric cooler (TEC), and a temperature sensor, such as a thermistor, mounted to the laser housing mount to control and monitor the temperature of the laser package.
摘要翻译：模块化激光器封装系统可以用于将诸如同轴或TO（晶体管轮廓）罐激光器封装之类的一种类型的激光器封装安装到诸如发射器板或主板的电路板上，所述电路板被设计成接收另一类型的激光封装外壳，如蝶型激光封装外壳。模块化激光器封装系统可以包括电路板安装平台，将激光器封装件安装到电路板安装平台的激光器外壳安装件，以及便于安装到传输器板或主板的安装基座。模块化激光器封装系统还可以包括温度控制装置，诸如热电冷却器（TEC），以及安装到激光器外壳安装件的温度传感器，诸如热敏电阻器，以控制和监测激光器封装件的温度。

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