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    • 1. 发明申请
    • METHODS FOR PASSIVATING METALLIC IMPLANTABLE MEDICAL DEVICES INCLUDING RADIOPAQUE MARKERS
    • 用于吞入金属可植入医疗器械的方法,包括无线电标记
    • WO2014011215A1
    • 2014-01-16
    • PCT/US2013/027501
    • 2013-02-22
    • ABBOTT CARDIOVASCULAR SYSTEMS, INC.LIN, Zhicheng
    • LIN, Zhicheng
    • C25F3/18C25F3/16A61F2/91
    • A61L31/18A61F2/86A61F2210/0076A61F2240/001A61F2250/0054A61F2250/0098A61L31/022C25F3/16F04C2270/041
    • The present disclosure is directed to methods of manufacturing and passivating stents and other implantable medical devices including one or more attached radiopaque markers. In one embodiment, the method includes providing a metallic implantable medical device body without any radiopaque marker(s) attached thereto, primary electropolishing the device body without any markers attached thereto, attaching one or more radiopaque markers to the device body, and lightly electropolishing the device including device body and attached radiopaque markers. Light electropolishing removes no more than about 5 percent by weight of the device (i.e., the device body and attached marker(s)). Light electropolishing passivates the exposed surfaces of the device body and markers, while also providing electropolishing to the region of any welds where the radiopaque marker(s) attach to the device body.
    • 本公开涉及制造和钝化支架和其它可植入医疗装置的方法,包括一个或多个附接的不透射线标记物。 在一个实施例中,该方法包括提供金属可植入医疗装置主体,而没有附接到其上的任何不透射线的标记,初次电抛光装置主体而没有附接到其上的任何标记,将一个或多个不透射线的标记附接到装置主体,以及轻轻电解抛光 装置包括装置主体和附接的不透射线标记。 轻质电解抛光消除不超过装置重量的约5%(即,装置主体和附着的标记)。 光电抛光钝化了器件主体和标记的暴露表面,同时还向不透射线标记附着到器件主体的任何焊缝的区域提供电抛光。