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    • 4. 发明申请
    • ALUMINUM ALLOY LINKAGE ROD SYSTEM STRUCTURE HAVING STRUCTURAL NODES
    • 具有结构节点的铝合金连接系统结构
    • WO2012037773A8
    • 2012-05-10
    • PCT/CN2011001319
    • 2011-08-09
    • LIN JUANLIANG KUN
    • LIN JUANLIANG KUN
    • E04B1/58E04B1/24E04C3/04
    • E04B1/19E04B2001/1927E04B2001/1933E04B2001/1984E04C3/16E04C2003/0495
    • An aluminum alloy linkage rod system structure having structural nodes comprises all joint bodies (1), made of an aluminum alloy material, of a structural linkage rod system structure and all rod members (2, 3, 4) of the linkage rod system structure, the rod members (2, 3, 4) being made of an aluminum alloy material, intersecting at all nodes and joined to the joint bodies (1). Each joint body (1) is provided with a node body limb board or a node body groove in a plane of the joined rod members (2, 3, 4) as required by the joined rod members (2, 3, 4). Each of the rod members (2, 3, 4) is provided with a rod port at the rod end corresponding to the node body limb board for implanting the node body limb board. The rod end corresponding to the node body groove is directly implanted in the corresponding node body groove. All joints of the rod ends and the node body limb board or the node body groove are fastened by aluminum alloy or stainless steel screw bolts or rivet bolts (8). The structure has effective stress distribution and excellent overall performance, and can be conveniently designed, manufactured and mounted.
    • 具有结构节点的铝合金连杆系统结构包括由铝合金材料制成的具有结构连杆系统结构的所有接头体(1)和连杆系统结构的所有杆构件(2,3,4) 杆构件(2,3,4)由铝合金材料制成,在所有节点处相交并连接到接合体(1)。 每个接头本体(1)根据所连接的杆件(2,3,4)的要求在连接的杆件(2,3,4)的平面中设置有节点体侧肢板或节体体槽。 每个杆构件(2,3,4)在对应于节点体肢体板的杆端处设置有杆端口,用于植入节点体肢体板。 对应于节点体槽的杆端直接植入到相应的节点体槽中。 杆端的所有接头和节点体肢体板或节体体槽均用铝合金或不锈钢螺栓或铆钉螺栓(8)固定。 该结构具有有效的应力分布和优异的整体性能,可方便地设计,制造和安装。
    • 8. 实用新型
    • 三合一下水道用之地板水槽過濾裝置
    • 三合一下水道用之地板水槽过滤设备
    • TWM364540U
    • 2009-09-11
    • TW098205945
    • 2009-04-10
    • 梁坤煜 LIANG, KUN YU
    • 梁坤煜 LIANG, KUN YU
    • B01D
    • 本創作係一種三合一下水道用之地板水槽過濾裝置,其包括:一水槽本體,該水槽本體之內部形成一容置空間,於水槽本體之底部設一排水口,並在排水口處結合一過濾柵,更於水槽本體頂端結合有蓋體組件;一蓋體組件,該蓋體組件係由數片上蓋所組成,該數片上蓋置放於水槽本體的頂端內緣處,再利用過濾柵支撐上蓋,使得數片上蓋可形成一平面搭接在水槽本體的頂端。
    • 本创作系一种三合一下水道用之地板水槽过滤设备,其包括:一水槽本体,该水槽本体之内部形成一容置空间,于水槽本体之底部设一排水口,并在排水口处结合一过滤栅,更于水槽本体顶端结合有盖体组件;一盖体组件,该盖体组件系由数片上盖所组成,该数片上盖置放于水槽本体的顶端内缘处,再利用过滤栅支撑上盖,使得数片上盖可形成一平面搭接在水槽本体的顶端。
    • 9. 发明授权
    • Method for preventing Cu CMP corrosion
    • 防止Cu CMP腐蚀的方法
    • US06555477B1
    • 2003-04-29
    • US10152939
    • 2002-05-22
    • Chen-Fa LuChin-Hsiung HoMei-Ling ChenLiang-Kun Huang
    • Chen-Fa LuChin-Hsiung HoMei-Ling ChenLiang-Kun Huang
    • H01L21302
    • H01L21/7684H01L21/02071H01L21/3212
    • A method for preventing or reducing corrosion of copper containing semiconductor features during chemical mechanical polishing (CMP) including providing a semiconductor wafer polishing surface including a copper layer overlying a copper filled anisotropically etched feature; polishing the semiconductor wafer polishing surface according to a first CMP process to remove at least a portion the copper layer to reveal a portion of an underlying barrier/adhesion layer; polishing the semiconductor wafer polishing surface according to a second CMP process including applying a neutralizing solution; polishing the semiconductor wafer polishing surface according to a third CMP process including applying a copper corrosion inhibitor solution; and, polishing the semiconductor wafer polishing surface according to at least a fourth CMP process to remove a remaining portion of the underlying barrier/adhesion layer.
    • 一种用于在化学机械抛光(CMP)期间防止或减少含铜半导体特征的腐蚀的方法,包括提供半导体晶片抛光表面,所述半导体晶片抛光表面包括覆盖铜填充的各向异性蚀刻特征的铜层; 根据第一CMP工艺抛光半导体晶片抛光表面以去除铜层的至少一部分以露出下面的阻挡/粘附层的一部分; 根据包括施加中和溶液的第二CMP工艺抛光半导体晶片抛光表面; 根据包括施加铜腐蚀抑制剂溶液的第三CMP工艺抛光半导体晶片抛光表面; 以及根据至少第四CMP工艺对所述半导体晶片抛光表面进行抛光以去除所述下面的阻挡/粘合层的剩余部分。