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    • 3. 发明申请
    • SYSTEMS AND METHODS FOR NON-CONTACT MEASURING SPUTTERING TARGET THICKNESS ULTRASONIICS
    • 非接触式测量目标厚度超声波的系统和方法
    • WO2004097401A1
    • 2004-11-11
    • PCT/US2004/012292
    • 2004-04-21
    • TOSOH SMD, INC.LEYBOVICH, Alexander
    • LEYBOVICH, Alexander
    • G01N33/00
    • G01B17/025C23C14/3407G01B17/02G01D5/48
    • A method and apparatus for ultrasonically measuring the thickness of sputter targets of varying shapes. An immersion bubble (32) and transducer (36) provide pulses to a front surface (24) and a front surface/bonded surface (26) interface of a target. The pulses generate reflected echoes that are converted to electric signals. By measuring the difference in time that the electric signals occur the thickness of the target may be approximated to identify whether the thickness of the target is appropriate for use. The system includes a sputter track (15), specimen (20), chuck (28), nozzle (34), columns (60), opening (62), inlet (70), cable (58), gauge (59), turret (90), position (92), remote PC controller (110), electrical line (112), and rear part (84).
    • 一种用于超声波测量不同形状的溅射靶的厚度的方法和装置。 浸入式气泡(32)和换能器(36)向靶的前表面(24)和前表面/接合表面(26)界面提供脉冲。 脉冲产生被转换为电信号的反射回波。 通过测量电信号发生的时间差,可以近似目标的厚度以识别目标的厚度是否适合使用。 该系统包括溅射轨道(15),试样(20),卡盘(28),喷嘴(34),柱(60),开口(62),入口(70),电缆(58) 转台(90),位置(92),远程PC控制器(110),电线(112)和后部(84)。
    • 5. 发明申请
    • SPUTTER TARGET
    • 射击目标
    • WO2011102896A1
    • 2011-08-25
    • PCT/US2011/000285
    • 2011-02-16
    • TOSOH SMD, INC.IVANOV, Eugene, Y.LEYBOVICH, AlexanderRIZER, John
    • IVANOV, Eugene, Y.LEYBOVICH, AlexanderRIZER, John
    • C23C14/34
    • C23C14/3407H01J37/3423H01J37/3426H01J37/3435Y10T29/49826
    • In one aspect of the invention, a sputter target is provided comprising a backing plate (40) comprising a front surface and a back surface; and a sputtering plate mounted on said backing plate, the sputtering plate comprising a sputtering surface and a back surface. At least one of the back surface of the sputtering plate, the front surface of the backing plate, or the back surface of the backing plate has at least one groove (30) that is shaped and sized to correspond to an observed region of higher sputtering of the sputtering plate relative to an adjacent area of the sputtering plate. An insert (50) is placed in the groove (s). The backing plate comprises a first material, the sputtering plate comprises a second material, and an insert comprises a third material. In yet another aspect of the sputter target, a method of controlling the electromagnetic properties of a sputter target is provided.
    • 在本发明的一个方面,提供一种溅射靶,其包括一个包括前表面和后表面的背板(40) 以及安装在所述背板上的溅射板,所述溅射板包括溅射表面和背面。 溅射板的后表面,背板的前表面或背板的后表面中的至少一个具有至少一个凹槽(30),其形状和尺寸被设计成对应于较高溅射的观察区域 的溅射板相对于溅射板的相邻区域。 插入件(50)放置在凹槽中。 背板包括第一材料,溅射板包括第二材料,并且插入件包括第三材料。 在溅射靶的另一方面,提供了一种控制溅射靶的电磁特性的方法。