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    • 4. 发明授权
    • Sense circuit of a semiconductor memory device
    • 半导体存储器件的检测电路
    • US4774692A
    • 1988-09-27
    • US122452
    • 1987-11-19
    • Motohiro OishiKunio MatsudairaKeiji Fukumura
    • Motohiro OishiKunio MatsudairaKeiji Fukumura
    • G11C11/419G11C7/06G11C7/12G11C7/00H03K3/01
    • G11C7/12G11C7/067
    • A sense circuit of a semiconductor memory transistor includes a bit line connected to a memory cell which stores "1" or "0". The sense circuit includes a MOS transistor which has its gate connected to the bit line, its source connected to ground voltage and its drain connected to a supply voltage through a load MOS transistor. The sense circuit also includes a compensating circuit for compensating the voltage at the bit line when the ground voltage has fluctuated. For example, the compensating circuit includes a pull-up circuit for pulling up the voltage at the bit line when the ground voltage has shifted to the positive side and a pull-down circuit for pulling down the voltage at the bit line when the ground voltage has shifted to the negative side, thereby maintaining the relative voltage relationship between the voltage at the bit line and the ground voltage at a proper value.
    • 半导体存储晶体管的感测电路包括连接到存储“1”或“0”的存储单元的位线。 感测电路包括其栅极连接到位线的MOS晶体管,其源极接地电压,其漏极通过负载MOS晶体管连接到电源电压。 感测电路还包括补偿电路,用于在接地电压波动时补偿位线处的电压。 例如,补偿电路包括:上拉电路,用于在接地电压转移到正极时提升位线上的电压;以及下拉电路,用于在接地电压 已经转移到负侧,从而将位线处的电压和接地电压之间的相对电压关系保持在适当的值。
    • 7. 发明授权
    • Semiconductor memory device using high-density and high-speed MOS
elements
    • 半导体存储器件采用高密度高速MOS元件
    • US4990999A
    • 1991-02-05
    • US416494
    • 1989-10-03
    • Motohiro OishiKunio MatsudairaKeiji FukumuraShigemi Sasada
    • Motohiro OishiKunio MatsudairaKeiji FukumuraShigemi Sasada
    • H01L21/3205H01L21/8246H01L23/52H01L27/108H01L27/112
    • H01L27/10805
    • A semiconductor memory device in which MOS transistors are used. The device has diffusion lines and polysilicon lines formed on a semiconductor substrate, first and second insulating films covering the diffusion lines and the polysilicon lines, respectively. The diffusion lines extend at intervals and parallel with each other, and constitute bit lines of the memory device. The polysilicon lines extend at intervals, intersect the diffusion lines, and constitute word lines of the memory device. Metal wiring lines are formed on the second insulating film are each positioned over every other diffusion line in such a manner as to extend along the corresponding diffusion line, each metal wiring line being electrically connected to the corresponding diffusion line through a contact hole. Two regions of two adjacent diffusion lines that are underneath the two intersections of these two adjacent diffusion lines and one polysilicon line constitute the source region and the drain region of one MOS transistor, and a portion of the polysilicon line which is between the source region and the drain region constitutes the gate of the MOS transistor. Thus, MOS transistors of the device can be disposed with an increased density, without involving any reduction in the operation speed of the device.
    • 使用MOS晶体管的半导体存储器件。 该器件具有形成在半导体衬底上的扩散线和多晶硅线,分别覆盖扩散线和多晶硅线的第一和第二绝缘膜。 扩散线以间隔延伸并且彼此平行,并且构成存储器件的位线。 多晶硅线以间隔延伸,与扩散线相交,并构成存储器件的字线。 形成在第二绝缘膜上的金属布线各自沿着相应的扩散线延伸设置在每隔一个扩散线上,每条金属布线通过接触孔与相应的扩散线电连接。 在两个相邻扩散线的两个交点之下的两个相邻扩散线的两个区域和一个多晶硅线构成一个MOS晶体管的源极区域和漏极区域,以及位于源极区域和 漏区构成MOS晶体管的栅极。 因此,器件的MOS晶体管可以以更高的密度布置,而不会降低器件的工作速度。