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    • 6. 发明授权
    • Method for direct-electroplating an electrically nonconductive substrate
    • 直接电镀不导电基板的方法
    • US5616230A
    • 1997-04-01
    • US374576
    • 1995-01-20
    • Kuniaki OtsukaKazue YamamotoSatoshi KonishiShigeru Yamato
    • Kuniaki OtsukaKazue YamamotoSatoshi KonishiShigeru Yamato
    • C25D5/54H05K3/18H05K3/42C25D5/02C25D5/34C25D5/56
    • C25D5/54H05K3/424
    • A process for plating an electrically nonconductive substrate by the following sequence of steps:(1) a step of treating an electrically nonconductive substrate with a solution containing a silane coupling agent;(2) a step of treating the electrically nonconductive substrate from said step (1) with a solution containing an anionic surfactant;(3) a step of the electrically nonconductive substrate from said step (2) with a solution containing a palladium compound and at least one nitrogen-containing sulfur compound selected from among thiourea and its derivatives;(4) a step of treating the electrically nonconductive substrate from said step (3) with a reducing solution containing at least one member selected from among sodium borohydride, sodium hypophosphite, hydrazine, dimethylaminoborane, hydroxylamine and glyoxylic acid; and(5) a step of forming an electroplating layer on the electrically nonconductive substrate from said step (4).With this process, improved productivity is obtained through process simplification, reduced treating time and improved working environment.
    • PCT No.PCT / JP94 / 00826 Sec。 371日期1995年1月24日 102(e)日期1995年1月24日PCT 1994年5月24日提交PCT通过以下步骤电镀不导电基材的方法:(1)用含有硅烷偶联剂的溶液处理非导电性基材的工序; (2)用含有阴离子表面活性剂的溶液从所述工序(1)处理非导电性基材的工序; (3)使用含有钯化合物和至少一种选自硫脲及其衍生物的含氮硫化合物的溶液,从所述步骤(2)获得不导电基质的步骤; (4)从含有选自硼氢化钠,次磷酸钠,肼,二甲基氨基硼烷,羟胺和乙醛酸中的至少一种的还原溶液处理所述工序(3)的非导电性基材的工序; 和(5)从所述步骤(4)在所述不导电基材上形成电镀层的步骤。 通过这个过程,通过简化过程,缩短处理时间和改善工作环境,可以获得提高的生产率。