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1. 发明授权

US07989561B2 Composition of liquid, solid and semisolid epoxy resins 有权
标题翻译：液体，固体和半固体环氧树脂的组成
公开(公告)号：US07989561B2
公开(公告)日：2011-08-02
申请号：US12240815
申请日：2008-09-29
申请人： Makoto Hayashi , Koshin Nakai , Katsuto Murata
发明人： Makoto Hayashi , Koshin Nakai , Katsuto Murata
IPC分类号： C08L63/00 , C08L63/02 , C08L63/04 , H05K1/03
CPC分类号： H05K3/4661 , C08G59/38 , C08L63/00 , H05K3/381 , H05K2201/0209 , C08L2666/22
摘要： A thermosetting resin composition include a liquid epoxy resin, a solid epoxy resin, a semisolid epoxy resin, an epoxy curing agent, and a filler. The liquid epoxy resin is liquid at 20° C. and has at least two epoxy groups in a molecule. A solid epoxy resin is solid at 40° C. and has at least three epoxy groups in a molecule. A semisolid epoxy resin is solid at 20° C. and liquid at 40° C. and has at least two epoxy groups in a molecule. A ratio of mass of the liquid epoxy resin to a sum of mass of the solid epoxy resin and mass of the semisolid epoxy resin is about 1:1 to about 1:10, and a ratio of the mass of the solid epoxy resin to the mass of the semisolid epoxy resin is about 1:0.5 to about 1:2.
摘要翻译：热固性树脂组合物包括液体环氧树脂，固体环氧树脂，半固体环氧树脂，环氧固化剂和填料。液体环氧树脂在20℃下为液体，在分子中具有至少两个环氧基。固体环氧树脂在40℃是固体，在分子中具有至少三个环氧基。半固态环氧树脂在20℃为固体，在40℃为液体，在分子中具有至少两个环氧基。液体环氧树脂的质量与固体环氧树脂的质量之和与半固态环氧树脂的质量之比为约1:1至约1:10，固体环氧树脂的质量与半固态环氧树脂的质量为约1:0.5至约1:2。

2. 发明申请

US20090314532A1 THERMOSETTING RESIN COMPOSITION, DRY FILM INCLUDING THERMOSETTING RESIN COMPOSITION, AND MULTILAYER PRINTED WIRING BOARD INCLUDING THERMOSETTING RESIN COMPOSITION 有权
标题翻译：热固性树脂组合物，包括热固性树脂组合物的干膜，以及包含热固性树脂组合物的多层印刷线路板
公开(公告)号：US20090314532A1
公开(公告)日：2009-12-24
申请号：US12240815
申请日：2008-09-29
申请人： Makoto Hayashi , Koshin Nakai , Katsuto Murata
发明人： Makoto Hayashi , Koshin Nakai , Katsuto Murata
IPC分类号： H05K1/00 , C08G59/00
CPC分类号： H05K3/4661 , C08G59/38 , C08L63/00 , H05K3/381 , H05K2201/0209 , C08L2666/22
摘要： A thermosetting resin composition include a liquid epoxy resin, a solid epoxy resin, a semisolid epoxy resin, an epoxy curing agent, and a filler. The liquid epoxy resin is liquid at 20° C. and has at least two epoxy groups in a molecule. A solid epoxy resin is solid at 40° C. and has at least three epoxy groups in a molecule. A semisolid epoxy resin is solid at 20° C. and liquid at 40° C. and has at least two epoxy groups in a molecule. A ratio of mass of the liquid epoxy resin to a sum of mass of the solid epoxy resin and mass of the semisolid epoxy resin is about 1:1 to about 1:10, and a ratio of the mass of the solid epoxy resin to the mass of the semisolid epoxy resin is about 1:0.5 to about 1:2.
摘要翻译：热固性树脂组合物包括液体环氧树脂，固体环氧树脂，半固体环氧树脂，环氧固化剂和填料。液体环氧树脂在20℃下为液体，在分子中具有至少两个环氧基。固体环氧树脂在40℃是固体，在分子中具有至少三个环氧基。半固态环氧树脂在20℃为固体，在40℃为液体，在分子中具有至少两个环氧基。液体环氧树脂的质量与固体环氧树脂的质量之和与半固态环氧树脂的质量之比为约1:1至约1:10，固体环氧树脂的质量与半固态环氧树脂的质量为约1:0.5至约1:2。

3. 发明申请

US20110278053A1 DRY FILM AND MULTILAYER PRINTED WIRING BOARD 审中-公开
标题翻译：干膜和多层印刷接线板
公开(公告)号：US20110278053A1
公开(公告)日：2011-11-17
申请号：US13195802
申请日：2011-08-01
申请人： Makoto HAYASHI , Koshin Nakai , Katsuto Murata
发明人： Makoto HAYASHI , Koshin Nakai , Katsuto Murata
IPC分类号： H05K1/03 , C08L63/00
CPC分类号： H05K3/4661 , C08G59/38 , C08L63/00 , H05K3/381 , H05K2201/0209 , C08L2666/22
摘要： A dry film includes a supporting base film and a thin membrane of a thermosetting resin composition. The thin membrane of the thermosetting resin composition is formed on the supporting base film. The thermosetting resin composition includes a liquid epoxy resin, a solid epoxy resin, a semisolid epoxy resin, an epoxy curing agent and a filler. The liquid epoxy resin is liquid at 20° C. and has at least two epoxy groups in a molecule. The solid epoxy resin is solid at 40° C. and has at least three epoxy groups in a molecule. The semisolid epoxy resin is solid at 20° C. and liquid at 40° C. and has at least two epoxy groups in a molecule. A ratio of mass of the liquid epoxy resin to a sum of mass of the solid epoxy resin and mass of the semisolid epoxy resin is about 1:1 to about 1:10 A ratio of the mass of the solid epoxy resin to the mass of the semisolid epoxy resin is about 1:0.5 to about 1:2.
摘要翻译：干膜包括支撑基膜和热固性树脂组合物的薄膜。热固性树脂组合物的薄膜形成在支撑基底膜上。热固性树脂组合物包括液体环氧树脂，固体环氧树脂，半固体环氧树脂，环氧固化剂和填料。液体环氧树脂在20℃下为液体，在分子中具有至少两个环氧基。固体环氧树脂在40℃是固体，在分子中具有至少三个环氧基团。半固态环氧树脂在20℃为固体，在40℃为液体，在分子中具有至少两个环氧基。液体环氧树脂的质量与固体环氧树脂的质量之和与半固态环氧树脂的质量之比为约1:1至约1:10A，固体环氧树脂的质量与质量的比例为半固体环氧树脂为约1:0.5至约1:2。

4. 发明申请

US20090308642A1 THERMOSETTING RESIN COMPOSITION 审中-公开
标题翻译：热固性树脂组合物
公开(公告)号：US20090308642A1
公开(公告)日：2009-12-17
申请号：US12503210
申请日：2009-07-15
申请人： Katsuto MURATA , Koshin NAKAI , Makoto HAYASHI
发明人： Katsuto MURATA , Koshin NAKAI , Makoto HAYASHI
IPC分类号： H05K1/03 , C08L63/00 , C08K3/36 , B32B27/38
CPC分类号： H05K1/0353 , C08G2650/56 , C08J5/24 , C08J2363/00 , C08L63/00 , C08L71/00 , H05K3/4626 , H05K3/4652 , H05K3/4655 , H05K2201/0129 , H05K2201/0209 , H05K2201/068 , Y10T428/31511 , C08L2666/22
摘要： A thermosetting resin composition contains, as essential components, (A) an epoxy resin having at least two epoxy groups in its molecule, (B) a thermoplastic polyhydroxy polyether resin having a fluorene skeleton, (C) an epoxy curing agent, and (D) a filler. A dry film is obtained by forming a thin film of the thermosetting resin composition on a supporting base film, and a prepreg is obtained by coating and/or impregnating a sheet-like fibrous base material with the thermosetting resin composition. Since they exhibit excellent adhesiveness to a substrate or a conductor and a cured film of the thermosetting resin composition has a relatively low thermal expansion coefficient and a high glass transition point and exhibits high resistance to heat and the capability of being roughened by a roughening treatment, they are useful as a resin insulating layer of a multilayer printed circuit board.
摘要翻译：热固性树脂组合物含有：（A）分子中具有至少两个环氧基的环氧树脂，（B）具有芴骨架的热塑性多羟基聚醚树脂，（C）环氧固化剂，（D））填料。通过在支撑基底膜上形成热固性树脂组合物的薄膜而获得干膜，并且通过用热固性树脂组合物涂布和/或浸渍片状纤维基材获得预浸料。由于它们对基材或导体表现出优异的粘附性，并且热固性树脂组合物的固化膜具有相对较低的热膨胀系数和高的玻璃化转变点，并且表现出高的耐热性和通过粗糙化处理而变得粗糙的能力，它们可用作多层印刷电路板的树脂绝缘层。

5. 发明授权

US07825198B2 Thermosetting resin composition and multilayer printed wiring board using the same 有权
标题翻译：热固性树脂组合物和使用其的多层印刷线路板
公开(公告)号：US07825198B2
公开(公告)日：2010-11-02
申请号：US11525019
申请日：2006-09-22
申请人： Masao Arima , Makoto Hayashi , Koshin Nakai
发明人： Masao Arima , Makoto Hayashi , Koshin Nakai
IPC分类号： C08G59/14 , C08G63/91 , C08G59/40 , C08G59/42 , C08G65/00 , C08G59/00 , C08G63/00 , C08L67/00
CPC分类号： C08J5/24 , C08G65/48 , C08J2363/00 , C08L71/10 , C08L101/02 , C08L2314/00 , H05K1/0326 , H05K3/4626 , C08L2666/02 , C08L2666/14
摘要： A thermosetting resin composition comprising (A) a thermoplastic resin having a structure represented by the following general formula (a) and/or a structure represented by the following general formula (b) in which 5 to 99 mol % of hydroxyl groups of polyhydroxyether are esterified, and (B) a thermosetting resin: wherein R1 represents C1-18 aliphatic or aromatic-ring-containing alkylene group or —SO2—, 5 to 99 mol % of R2 represent a straight chain or cyclic carbonyl group or aromatic carbonyl group having 1 to 20 carbon atoms, the residue 95 to 1 mol % represent a hydrogen atom, and R3 represents a hydrogen atom or a methyl group, with a proviso that a plurality of R3's may be the same or different.
摘要翻译：一种热固性树脂组合物，其包含（A）具有由以下通式（a）表示的结构的热塑性树脂和/或由以下通式（b）表示的结构，其中5至99摩尔％的聚羟基醚的羟基是酯化，和（B）热固性树脂：其中R1表示C1-18脂族或含芳环的亚烷基或-SO2-，5至99摩尔％的R2表示直链或环状羰基或芳族羰基，其具有 1〜20个碳原子，95〜1摩尔％的残基表示氢原子，R3表示氢原子或甲基，条件是多个R3可以相同或不同。

6. 发明申请

US20070015872A1 Thermosetting resin composition and multilayer printed wiring board using the same 有权
标题翻译：热固性树脂组合物和使用其的多层印刷线路板
公开(公告)号：US20070015872A1
公开(公告)日：2007-01-18
申请号：US11525019
申请日：2006-09-22
申请人： Masao Arima , Makoto Hayashi , Koshin Nakai
发明人： Masao Arima , Makoto Hayashi , Koshin Nakai
IPC分类号： C08L53/00
CPC分类号： C08J5/24 , C08G65/48 , C08J2363/00 , C08L71/10 , C08L101/02 , C08L2314/00 , H05K1/0326 , H05K3/4626 , C08L2666/02 , C08L2666/14
摘要： A thermosetting resin composition comprising (A) a thermoplastic resin having a structure represented by the following general formula (a) and/or a structure represented by the following general formula (b) in which 5 to 99 mol % of hydroxyl groups of polyhydroxyether are esterified, and (B) a thermosetting resin: wherein R1 represents C1-18 aliphatic or aromatic-ring-containing alkylene group or —SO2—, 5 to 99 mol % of R2 represent a straight chain or cyclic carbonyl group or aromatic carbonyl group having 1 to 20 carbon atoms, the residue 95 to 1 mol % represent a hydrogen atom, and R3 represents a hydrogen atom or a methyl group, with a proviso that a plurality of R3's may be the same or different.
摘要翻译：一种热固性树脂组合物，其包含（A）具有由以下通式（a）表示的结构的热塑性树脂和/或由以下通式（b）表示的结构，其中5至99摩尔％的聚羟基醚的羟基是酯化，和（B）热固性树脂：其中R 1表示C 1-18脂肪族或芳香族环的亚烷基或-SO 2 - 5〜99摩尔％的R 2表示碳原子数1〜20的直链状或环状的羰基或芳香族羰基，残基95〜1摩尔％表示氢原子， R 3表示氢原子或甲基，条件是多个R 3可以相同或不同。

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