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1. 发明申请

US20050176250A1 Polishig fluid for metallic films and method for producing semiconductor substrate using the same 审中-公开
标题翻译：用于金属膜的抛光液和使用其制造半导体衬底的方法
公开(公告)号：US20050176250A1
公开(公告)日：2005-08-11
申请号：US10486726
申请日：2002-08-08
申请人： Hideaki Takahashi , Koshi Okita , Kuon Miyazaki , Takayuki Matsuda
发明人： Hideaki Takahashi , Koshi Okita , Kuon Miyazaki , Takayuki Matsuda
IPC分类号： B24B37/04 , C09G1/04 , H01L21/321 , H01L21/302
CPC分类号： H01L21/3212 , B24B37/044 , C09G1/04
摘要： A polishing fluid for metallic films, wherein the etching rate is 10 nm/min. or less, the polishing rate under a load of 10 KPa is 200 nm/min. or more, and the contrast, a ratio of the above-mentioned polishing rate to the etching rate, is 20 or more; and a method for producing a semiconductor substrate using the same.
摘要翻译：一种用于金属膜的抛光液，其中蚀刻速率为10nm / min。 10KPa以下的研磨速度为200nm /分钟以下。以上，上述研磨速度与蚀刻速度的比例为20以上。以及使用其制造半导体衬底的方法。

2. 发明授权

US08389116B2 Photosensitive resin composition 有权
标题翻译：感光树脂组合物
公开(公告)号：US08389116B2
公开(公告)日：2013-03-05
申请号：US12440155
申请日：2007-09-04
申请人： Shinji Funakoshi , Koshi Okita , Hiroshi Yamada , Kei Tomeba
发明人： Shinji Funakoshi , Koshi Okita , Hiroshi Yamada , Kei Tomeba
IPC分类号： B32B17/10
CPC分类号： B41C1/05 , B41N1/12 , G03F7/0047 , Y10T428/1352 , Y10T428/1355 , Y10T428/26 , Y10T428/263 , Y10T428/269 , Y10T428/2982
摘要： Problem to be SolvedTo provide a photosensitive resin composition which has good processability even in a relatively low temperature condition near room temperature and exhibits good efficiency in removing debris generated while shaping a printing plate by laser engraving.SolutionA photosensitive resin composition, characterized by comprising: (a) 100 parts by mass of a resin having a number average molecular weight of 1,000 or more; and (b) 0.1 to 10 parts by mass of ultrafine particles having a number average particle diameter of primary particles of 5 nm or more and 100 nm or less; wherein the photosensitive resin composition has a viscosity at 20° C. of 50 Pa·s or more and 10,000 Pa·s or less; and a precursor composition, which is obtained by excluding the component (b) from the photosensitive resin composition, has a viscosity at 20° C. of 5 Pa·s or more and 500 Pa·s or less.
摘要翻译：待解决的问题为了提供即使在室温附近的相对较低的温度条件下也具有良好的加工性的感光性树脂组合物，并且通过激光雕刻来形成印版时，产生的碎屑的效率也很好。溶液一种感光性树脂组合物，其特征在于，包括：（a）100质量份数均分子量为1,000以上的树脂; 和（b）0.1〜10质量份具有5nm以上且100nm以下的一次粒子的数均粒径的超微粒子; 其中所述感光性树脂组合物在20℃下的粘度为50Pa·s以上10,000Pa·s以下。和通过从感光性树脂组合物中排出成分（b）而得到的前体组合物的粘度在5Pa·s以上且500Pa·s以下。

3. 发明申请

US20100189941A1 PHOTOSENSITIVE RESIN COMPOSITION 有权
标题翻译：感光树脂组合物
公开(公告)号：US20100189941A1
公开(公告)日：2010-07-29
申请号：US12440155
申请日：2007-09-04
申请人： Shinji Funakoshi , Koshi Okita , Hiroshi Yamada , Kei Tomeba
发明人： Shinji Funakoshi , Koshi Okita , Hiroshi Yamada , Kei Tomeba
IPC分类号： G03F7/004 , G03F7/20 , B32B27/18 , B32B1/08
CPC分类号： B41C1/05 , B41N1/12 , G03F7/0047 , Y10T428/1352 , Y10T428/1355 , Y10T428/26 , Y10T428/263 , Y10T428/269 , Y10T428/2982
摘要： Problem to be Solved To provide a photosensitive resin composition which has good processability even in a relatively low temperature condition near room temperature and exhibits good efficiency in removing debris generated while shaping a printing plate by laser engraving.Solution A photosensitive resin composition, characterized by comprising: (a) 100 parts by mass of a resin having a number average molecular weight of 1,000 or more; and (b) 0.1 to 10 parts by mass of ultrafine particles having a number average particle diameter of primary particles of 5 nm or more and 100 nm or less; wherein the photosensitive resin composition has a viscosity at 20° C. of 50 Pa·s or more and 10,000 Pa·s or less; and a precursor composition, which is obtained by excluding the component (b) from the photosensitive resin composition, has a viscosity at 20° C. of 5 Pa·s or more and 500 Pa·s or less.
摘要翻译：待解决的问题为了提供即使在室温附近的相对较低的温度条件下也具有良好的加工性的感光性树脂组合物，并且通过激光雕刻来形成印版时，产生的碎屑的效率也很好。溶液一种感光性树脂组合物，其特征在于，包括：（a）100质量份数均分子量为1,000以上的树脂; 和（b）0.1〜10质量份具有5nm以上且100nm以下的一次粒子的数均粒径的超微粒子; 其中所述感光性树脂组合物在20℃下的粘度为50Pa·s以上10,000Pa·s以下。和通过从感光性树脂组合物中排出成分（b）而得到的前体组合物的粘度在5Pa·s以上且500Pa·s以下。

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