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    • 2. 发明授权
    • Semiconductor device manufacturing method and storage medium
    • 半导体器件制造方法和存储介质
    • US08071473B2
    • 2011-12-06
    • US12222666
    • 2008-08-13
    • Kazuki NarishigeKoichi Nagakura
    • Kazuki NarishigeKoichi Nagakura
    • H01L21/4763
    • H01L21/31122H01L21/31116H01L21/31138
    • An object of the present invention is to obtain a favorable etching shape in etching an organic film formed on a substrate.A semiconductor device manufacturing method according to the present invention comprises the steps of: etching with plasma a silicon-containing film and transferring a pattern of a pattern mask stacked on the silicon-containing film onto the silicon-containing film to form a patterned silicon-containing film; removing the pattern mask using plasma to expose the surface of the silicon-containing film; and etching the surface of the organic film through the patterned silicon-containing film by use of oxygen active species in plasma to form a concave portion on the organic film. Thereafter, the silicon-containing film is sputtered to form silicon-containing protection films on the inner wall surfaces of the concave portion. The concave portion is further etched in its depth direction through the patterned silicon-containing film by use of oxygen active species in plasma. Thus, the concave portion can be further etched while the side walls of the concave portion are protected from active oxygen species.
    • 本发明的目的是在蚀刻形成在基板上的有机膜时获得良好的蚀刻形状。 根据本发明的半导体器件制造方法包括以下步骤:用等离子体蚀刻含硅膜并将堆叠在含硅膜上的图案掩模的图案转印到含硅膜上以形成图案化硅 - 含膜; 使用等离子体去除图案掩模以暴露含硅膜的表面; 并且通过使用等离子体中的氧活性物质通过图案化的含硅膜蚀刻有机膜的表面,以在有机膜上形成凹部。 此后,将溅射的含硅膜在凹部的内壁面上形成含硅保护膜。 通过使用等离子体中的氧活性物质,通过图案化的含硅膜在其深度方向上进一步蚀刻凹部。 因此,可以进一步蚀刻凹部,同时保护凹部的侧壁不受活性氧的影响。
    • 3. 发明申请
    • Semiconductor device manufacturing method and storage medium
    • 半导体器件制造方法和存储介质
    • US20090045165A1
    • 2009-02-19
    • US12222666
    • 2008-08-13
    • Kazuki NarishigeKoichi Nagakura
    • Kazuki NarishigeKoichi Nagakura
    • C23F1/00
    • H01L21/31122H01L21/31116H01L21/31138
    • An object of the present invention is to obtain a favorable etching shape in etching an organic film formed on a substrate.A semiconductor device manufacturing method according to the present invention comprises the steps of: etching with plasma a silicon-containing film and transferring a pattern of a pattern mask stacked on the silicon-containing film onto the silicon-containing film to form a patterned silicon-containing film; removing the pattern mask using plasma to expose the surface of the silicon-containing film; and etching the surface of the organic film through the patterned silicon-containing film by use of oxygen active species in plasma to form a concave portion on the organic film. Thereafter, the silicon-containing film is sputtered to form silicon-containing protection films on the inner wall surfaces of the concave portion. The concave portion is further etched in its depth direction through the patterned silicon-containing film by use of oxygen active species in plasma. Thus, the concave portion can be further etched while the side walls of the concave portion are protected from active oxygen species.
    • 本发明的目的是在蚀刻形成在基板上的有机膜时获得良好的蚀刻形状。 根据本发明的半导体器件制造方法包括以下步骤:用等离子体蚀刻含硅膜并将堆叠在含硅膜上的图案掩模的图案转印到含硅膜上以形成图案化硅 - 含膜; 使用等离子体去除图案掩模以暴露含硅膜的表面; 并且通过使用等离子体中的氧活性物质通过图案化的含硅膜蚀刻有机膜的表面,以在有机膜上形成凹部。 此后,将溅射的含硅膜在凹部的内壁面上形成含硅保护膜。 通过使用等离子体中的氧活性物质,通过图案化的含硅膜在其深度方向上进一步蚀刻凹部。 因此,可以进一步蚀刻凹部,同时保护凹部的侧壁不受活性氧的影响。