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1. 发明授权

US5242594A Process and apparatus for industrial fractionation of polymers 失效
$Process and apparatus for industrial fractionation of polymers$
标题翻译：工业分离聚合物的工艺和装置
公开(公告)号：US5242594A
公开(公告)日：1993-09-07
申请号：US835900
申请日：1992-02-14
申请人： Klaus Weinmann , Lutz Tschersich , Bernhard A. Wolf
发明人： Klaus Weinmann , Lutz Tschersich , Bernhard A. Wolf
IPC分类号： B01D11/04 , C08F6/00 , C08F6/04 , C08G85/00 , C08J3/00
CPC分类号： C08G85/00 , C08F6/04
摘要： In a process for industrial fractionation of polymers using an extraction column and a homogeneous extraction agent a homogeneous feed is supplied to a region of the extraction column which is nearer the upper end thereof when the feed has a greater density than the extraction agent and which is nearer the lower end thereof when the feed has a lower density than the extraction agent. An apparatus for carrying out this process consists advantageously, instead of a pulsed sieve plate column as hitherto, of an unpulsed filling body column which leads to a better separation because a back mixing is avoided in favourable manner.
摘要翻译：在使用萃取塔和均匀萃取剂对聚合物进行工业分馏的方法中，当进料具有比萃取剂更大的密度时，将均匀的进料供给到萃取塔的更接近其上端的区域，当进料的密度低于萃取剂时，其较低端较近。用于执行该方法的装置有利地代替迄今为止由不可靠的方式避免反向混合而导致更好分离的未运动的填充体柱的脉冲筛板塔。

2. 发明授权

US08662155B2 Chip cooling device having wedge element 有权
标题翻译：具有楔形元件的芯片冷却装置
公开(公告)号：US08662155B2
公开(公告)日：2014-03-04
申请号：US12682302
申请日：2008-10-10
申请人： Klaus Weinmann , Philipp Hortmann
发明人： Klaus Weinmann , Philipp Hortmann
IPC分类号： F28F7/00
CPC分类号： H01L23/4338 , H01L23/4006 , H01L2023/4087 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to a cooling device improving the heat transfer between a chip (2) having a semiconducting substrate (3) and a heat sink (7). The gap between a surface (11) of the chip (2) to be cooled and a surface (12) of the heat sink (7), the width of which depends on production tolerances of the elements and soldered connections, is formed as a wedge shape by an angled lower surface (12) of the heat sink, in order to create a wedge-shaped gap. A wedge element (17) having the same wedge angle as the wedge-shaped gap is inserted into said gap exactly far enough that it makes flat contact with both the chip surface (11) to be cooled and the heat sink surface (12). Dimensional deviations are thus compensated for, the use of gap fillers is avoided, and the heat transfer from the heat source to the heat sink is improved.
摘要翻译：本发明涉及一种改善具有半导体衬底（3）的芯片（2）和散热器（7）之间的传热的冷却装置。要冷却的芯片（2）的表面（11）与散热器（7）的表面（12）之间的间隙（其宽度取决于元件和焊接连接的生产公差）形成为通过散热器的成角度的下表面（12）形成楔形，以便产生楔形间隙。具有与楔形间隙相同的楔角的楔形元件（17）被精确地插入所述间隙，使其与要冷却的芯片表面（11）和散热片表面（12）平坦接触。因此补偿尺寸偏差，避免使用间隙填料，并且改善从热源到散热器的热传递。

3. 发明申请

US20120000636A1 CHIP COOLING DEVICE HAVING WEDGE ELEMENT 有权
标题翻译：具有楔形元件的芯片冷却装置
公开(公告)号：US20120000636A1
公开(公告)日：2012-01-05
申请号：US12682302
申请日：2008-10-10
申请人： Klaus Weinmann , Philip Hortmann
发明人： Klaus Weinmann , Philip Hortmann
IPC分类号： F28F7/00
CPC分类号： H01L23/4338 , H01L23/4006 , H01L2023/4087 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to a cooling device improving the heat transfer between a chip (2) having a semiconducting substrate (3) and a heat sink (7). The gap between a surface (11) of the chip (2) to be cooled and a surface (12) of the heat sink (7), the width of which depends on production tolerances of the elements and soldered connections, is formed as a wedge shape by an angled lower surface (12) of the heat sink, in order to create a wedge-shaped gap. A wedge element (17) having the same wedge angle as the wedge-shaped gap is inserted into said gap exactly far enough that it makes flat contact with both the chip surface (11) to be cooled and the heat sink surface (12). Dimensional deviations are thus compensated for, the use of gap fillers is avoided, and the heat transfer from the heat source to the heat sink is improved.
摘要翻译：本发明涉及一种改善具有半导体衬底（3）的芯片（2）和散热器（7）之间的传热的冷却装置。要冷却的芯片（2）的表面（11）与散热器（7）的表面（12）之间的间隙（其宽度取决于元件和焊接连接的生产公差）形成为通过散热器的成角度的下表面（12）形成楔形，以便产生楔形间隙。具有与楔形间隙相同的楔角的楔形元件（17）被精确地插入所述间隙，使其与要冷却的切屑表面（11）和散热片表面（12）平坦接触。因此补偿尺寸偏差，避免使用间隙填料，并且改善从热源到散热器的热传递。

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