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    • 1. 发明授权
    • Heat exchanger tube to header swaging process
    • 热交换器管到头模锻工艺
    • US06178636B2
    • 2001-01-30
    • US09587699
    • 2000-06-05
    • Dale Lewis KrogerKevin Kent StahleckerLes Dean VanDenTopAdeel Zaidi
    • Dale Lewis KrogerKevin Kent StahleckerLes Dean VanDenTopAdeel Zaidi
    • B21D3906
    • F28F9/16F28F9/22Y10T29/49375Y10T29/53122
    • A method for making a heat exchanger assembly (10) includes inserting tubes (20) through fin holes (32) in heat exchanger fins (30) and headers (40, 42) to form a bundle (50), and expanding the tubes (20) forming an interference fit with the heat exchanger fins (30). The bundle (50) is inserted into a housing (60) open at both end; (67, 68) and having a wall (62) surrounding the headers (40, 42) with inlet and outlet lines (64, 66) in the wall (62), and sealing the wall (62) of the housing (60) to the first and second headers (40, 42) with the inlet and outlet lines (64, 66) disposed between the headers (40, 42). A plurality of mandrel heads (70) are inserted through the open ends (67, 68) of the housing (60) into the tubes (20) expanding the tubes (20) into the headers (40, 42) to form a sealed joint between the tubes (20) and the headers (40, 42). The headers (40,42) are disposed in an axial overlapping relationship with the first and second open ends (67, 68) of the housing (60) of each header extends axially from the open ends (67, 68). A pair of caps (80) close the open ends (67, 68) of the housing (60) and are disposed in axial overlapping relationship with the portion of the headers (40, 42) extending out of the housing (60).
    • 一种用于制造热交换器组件(10)的方法包括在热交换器翅片(30)和集管(40,42)中插入通过翅片孔(32)的管(20)和集管(40,42)以形成束(50) 20)与热交换器翅片(30)形成过盈配合。 束(50)插入到两端敞开的壳体(60)中; (67,68),并且具有围绕所述集管(40,42)的壁(62),所述壁具有在所述壁(62)中的入口和出口管线(64,66),并且密封所述壳体(60)的壁(62) 到所述第一和第二集管(40,42),所述入口和出口管线(64,66)设置在所述集管(40,42)之间。 多个芯棒头(70)通过壳体(60)的开口端(67,68)插入管(20)中,将管(20)膨胀成集管(40,42)以形成密封接头 在管(20)和集管(40,42)之间。 集管(40,42)以与每个集管的壳体(60)的第一和第二开放端(67,68)从开口端(67,68)轴向重叠的关系设置。 一对盖子(80)封闭壳体(60)的开口端(67,68),并且与从壳体(60)延伸出的集管(40,42)的部分轴向重叠地设置。
    • 2. 发明授权
    • Method of and apparatus for testing a nozzle of a pick-and-place system
    • 拾取和放置系统的喷嘴的测试方法和设备
    • US5925835A
    • 1999-07-20
    • US949259
    • 1997-10-13
    • Ranvir Singh SolankiKevin Kent
    • Ranvir Singh SolankiKevin Kent
    • B25J15/06H05K13/04H05K13/08G01N19/00G01L27/00B23P21/00
    • H05K13/0408H05K13/08Y10T29/53039
    • An apparatus (200) and method are provided for testing a nozzle of a pick-and-place system (100). The apparatus (200) includes a reservoir (206) configured to carry a fluid, a membrane (204) covering an opening of the reservoir (206), and a reservoir pressure sensor. The apparatus may further include a processor (118) coupled to the reservoir pressure sensor (208) and an output device (116) coupled to the processor (118). The nozzle (104) is positioned to contact and displace the membrane (204), thus changing the pressure of the fluid within the reservoir (206). The reservoir pressure sensor (208) senses pressure changes within the reservoir (206) and generates a signal that varies in response to the displacement of the membrane. The signal is compared to a predetermined signal to detect whether the nozzle has the proper position, the proper alignment, sufficient vacuum, and other errors affecting pick-and-place systems.
    • 提供了一种用于测试拾取和放置系统(100)的喷嘴的装置(200)和方法。 装置(200)包括构造成承载流体的储存器(206),覆盖储存器(206)的开口的膜(204)和储存器压力传感器。 该装置还可以包括耦合到储存器压力传感器(208)的处理器(118)和耦合到处理器(118)的输出装置(116)。 喷嘴(104)定位成接触和移动膜(204),从而改变储存器(206)内的流体的压力。 储存器压力传感器(208)感测储存器(206)内的压力变化,并产生响应于膜的位移而变化的信号。 将信号与预定信号进行比较,以检测喷嘴是否具有适当的位置,适当的对准,足够的真空以及影响拾取和放置系统的其他错误。
    • 3. 发明授权
    • Heat exchanger tube to header swaging process
    • 热交换器管到头模锻工艺
    • US6138747A
    • 2000-10-31
    • US251886
    • 1999-02-17
    • Dale Lewis KrogerKevin Kent StahleckerLes Dean VanDenTopAdeel Zaidi
    • Dale Lewis KrogerKevin Kent StahleckerLes Dean VanDenTopAdeel Zaidi
    • F28F9/16F28F9/22F28F9/04
    • F28F9/16F28F9/22Y10T29/49375Y10T29/53122
    • A method for making a heat exchanger assembly (10) includes inserting tubes (20) through fin holes (32) in heat exchanger fins (30) and headers (40, 42) to form a bundle (50), and expanding the tubes (20) forming an interference fit with the heat exchanger fins (30). The bundle (50) is inserted into a housing (60) open at both ends (67, 68) and having a wall (62) surrounding the headers (40, 42) with inlet and outlet lines (64, 66) in the wall (62), and sealing the wall (62) of the housing (60) to the first and second headers (40, 42) with the inlet and outlet lines (64, 66) disposed between the headers (40, 42). A plurality of mandrel heads (70) are inserted through the open ends (67, 68) of the housing (60) into the tubes (20) expanding the tubes (20) into the headers (40, 42) to form a sealed joint between the tubes (20) and the headers (40, 42). The headers (40, 42) are disposed in an axial overlapping relationship with the first and second open ends (67, 68) of the housing (60) of each header extends axially from the open ends (67, 68). A pair of caps (80) close the open ends (67, 68) of the housing (60) and are disposed in axial overlapping relationship with the portion of the headers (40, 42) extending out of the housing (60).
    • 一种用于制造热交换器组件(10)的方法包括在热交换器翅片(30)和集管(40,42)中插入通过翅片孔(32)的管(20)和集管(40,42)以形成束(50) 20)与热交换器翅片(30)形成过盈配合。 束(50)插入到在两端(67,68)处敞开的壳体(60)中,并具有围绕集管(40,42)的壁(62),其中壁(64,66)具有入口和出口管线 (62),并且将所述壳体(60)的壁(62)密封到所述第一和第二集管(40,42)上,其中所述入口和出口管线(64,66)设置在所述集管(40,42)之间。 多个芯棒头(70)通过壳体(60)的开口端(67,68)插入管(20)中,将管(20)膨胀成集管(40,42)以形成密封接头 在管(20)和集管(40,42)之间。 集管(40,42)以与每个集管的壳体(60)的第一和第二开放端(67,68)从开口端(67,68)轴向重叠的关系设置。 一对盖子(80)封闭壳体(60)的开口端(67,68),并且与从壳体(60)延伸出的集管(40,42)的部分轴向重叠地设置。
    • 6. 发明授权
    • Automatic defect detection and generation of control code for subsequent defect repair on an assembly line
    • 自动缺陷检测和生成用于组装线上后续缺陷修复的控制代码
    • US06240633B1
    • 2001-06-05
    • US09372561
    • 1999-08-11
    • Kevin KentJohn KivlinEric Gasmann
    • Kevin KentJohn KivlinEric Gasmann
    • H05K330
    • H05K13/08Y10T29/4913Y10T29/5303Y10T29/53043Y10T29/53048Y10T29/53174Y10T29/53183Y10T29/53187
    • A method for manufacturing an electronic device includes placing a plurality of components on a printed wiring board (204), detecting a defect in a component (210) and, in response, producing a defect indication including a defect location on the printed wiring board. Subsequently, additional components are placed on the printed wiring board (220) but placement of all additional components having a location which has a predetermined relation with the defect location is suspended. The defective printed wiring board may then be repaired by a technician who subsequently places the additional components over the defect location. This reduces the need to apply a large amount of heat to the printed wiring board to remove subsequently placed components such as radio frequency shields. This further reduces the possibility of additional defects occurring during repair.
    • 一种电子设备的制造方法,包括将多个部件放置在印刷电路板(204)上,检测部件(210)中的缺陷,并且响应于在印刷电路板上产生包括缺陷位置的缺陷指示。 随后,附加部件被放置在印刷线路板(220)上,但是具有与缺陷位置具有预定关系的位置的所有附加部件的放置被暂停。 有缺陷的印刷电路板然后可以由技术人员进行修理,技术人员随后将附加部件放置在缺陷位置上。 这减少了对印刷电路板施加大量热量以去除随后放置的部件如射频屏蔽的需要。 这进一步降低了修复期间发生额外缺陷的可能性。