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    • 6. 发明授权
    • Method of manufacturing a heat pipe construction
    • 制造热管结构的方法
    • US06817096B2
    • 2004-11-16
    • US09756821
    • 2001-01-09
    • Kevin A. McCullough
    • Kevin A. McCullough
    • B23P1520
    • B23P15/26F28D15/02F28D15/0233F28D15/0283F28F1/14H01L21/4882H01L23/427H01L2924/0002Y10T29/4935Y10T29/49353H01L2924/00
    • A method of manufacturing a heat pipe construction includes first providing a tubular pipe with an open end. A thermally conductive material, such as a metallic material or a filled polymer composite material is overmolded over or cast around the tubular pipe. Additional heat dissipating elements, such as insert molded pins, may be provided in the overmolded or cast material to enhance thermal conductivity of the heat sink assembly. The tubular pipe is then filled with heat pipe media, such as water or ammonia, and then immediately sealed therein to effectively form an embedded heat pipe within a thermally conductive cast or overmolded structure. With the method of the present invention, an heat pipes can be overmolded with or cast into other heat dissipating material structure to improve overall performance of the heat pipe without damaging the heat pipe.
    • 制造热管结构的方法包括首先提供具有开口端的管状管。 诸如金属材料或填充的聚合物复合材料的导热材料在管状管上包覆成型或铸造在管状管周围。 可以在包覆成型或铸造材料中提供额外的散热元件,例如插入模制销,以增强散热器组件的导热性。 管状管然后用诸如水或氨的热管介质填充,然后立即密封在其中,以有效地在导热铸造或包覆成型结构内形成嵌入的热管。 利用本发明的方法,可以将热管包覆成型或铸造成其他散热材料结构,以改善热管的整体性能而不损坏热管。
    • 9. 发明授权
    • Thermally conductive silk-screenable interface material
    • 导热丝印界面材料
    • US06555486B2
    • 2003-04-29
    • US09904050
    • 2001-07-12
    • Kevin A. McCullough
    • Kevin A. McCullough
    • H01L2131
    • H01L23/3737H01L2924/0002H01L2924/00
    • The present invention provides a novel visible light curable composition for forming a thermally conductive interface and a method of using the same. The composition is used to promote the transfer of heat from a source of heat such as an electronic device to a heat dissipation device such as a heat sink. The composition includes an elastomeric base matrix containing a light curable catalyst, loaded with a thermally conductive filler material such as boron nitride grains or ceramic filler. After the compound is prepared, it is screen or stencil printed onto the desired surface and cured by exposure to visible light. The present invention provides a thermal interface that is bonded to the surface of the desired surface and has sufficient compressibility to allow it to overcome the voids in the mating surface to which the assembly is mounted.
    • 本发明提供一种用于形成导热界面的新型可见光固化组合物及其使用方法。 该组合物用于促进热从诸如电子装置的热量到诸如散热器的散热装置的传热。 该组合物包含含有光可固化催化剂的弹性基体基质,其负载有诸如氮化硼颗粒或陶瓷填料的导热填料。 在制备化合物之后,将其印刷在所需表面上并通过曝光可见光固化。 本发明提供了一种热界面,其结合到所需表面的表面并且具有足够的压缩性以允许其克服组装件所安装的配合表面中的空隙。